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PR Newswire

MediaTek Announces First Commercial SoC Support for Dolby Vision IQ with Precision Detail

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MediaTek’s Pentonic series of smart TV chips support advanced new imaging technologies powered by Dolby, including features designed for gaming in Dolby Vision

HSINCHU, Taiwan, March 25, 2022 — MediaTek has announced it is the first TV SoC vendor to support Dolby Vision IQ with Precision Detail. Precision Detail is a new innovative feature introduced for TVs with Dolby Vision IQ, which will be supported in MediaTek’s Pentonic series for 8K and 4K smart TVs. In addition, the Pentonic series will enable TV manufacturers to support features designed for gaming in Dolby Vision along with other advanced capabilities. MediaTek and Dolby collaborated on the implementation of these technologies, which will be available starting in 2H 2022 for TV OEMs to begin adopting.

Joining Dolby’s suite of Advanced Imaging technologies available through Dolby Vision IQ, Precision Detail unlocks more from Dolby Vision content by revealing incredible detail in both bright and dark areas. With added texture and depth, images take on a new dimension with astonishing crispness on 8K and 4K smart TVs. In addition to Precision Detail, MediaTek’s Intelligent View technology paired with Dolby’s latest advancements in imaging technology can process multiple Dolby Vision streams simultaneously. Consumers can now watch different media sources at the same time in Dolby Vision in multiple windows, all in stunning detail.

"With our industry-leading chips, paired with astonishing visual and audio technologies powered by Dolby, MediaTek and Dolby are making truly immersive and cinematic entertainment experiences more accessible," said Alex Chen, General Manager of the TV Business Unit at MediaTek. "MediaTek’s Pentonic series will make it easy for OEMs to bring Dolby Vision IQ with Precision Detail to the next generation of 8K and 4K smart TVs."

MediaTek Pentonic also improves gameplay with support for features designed for gaming in Dolby Vision. This includes advancements TV OEMs will be able to offer their customers such as gaming in Dolby Vision at 4K 120Hz. In addition, Pentonic chips will further improve latency and display enhancements when gaming in Dolby Vision through Auto Low Latency Mode (ALLM) and Variable Refresh Rate (VRR) to notably improve the gaming experience for players.

"For the past decade, Dolby Vision has continuously raised the bar of immersive entertainment experiences. Dolby Vision IQ continues this legacy by expanding the benefits of Dolby Vision beyond HDR through innovations like Precision Detail," said Mathias Bendull, Vice President, Living Room at Dolby Laboratories. "We look forward to working with MediaTek and our OEM partners to bring stunning Dolby Vision images for more use cases to the next generation of 8K and 4K smart TVs."

For more information about MediaTek Pentonic smart TV platforms: https://i.mediatek.com/digital-tv

For more information about gaming in Dolby: https://www.dolby.com/gaming/

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. MediaTek is the number one Wi-Fi supplier across broadband, retail routers, consumer electronics devices and gaming, and its Wi-Fi 6 chipsets are powering the latest networking equipment for faster computing experiences. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

 

MediaTek Press Office:

PR@mediatek.com

Kevin Keating, MediaTek

+1- 206-321-7295

10188 Telesis Ct #500, San Diego, CA 92121, USA

 

 

PR Newswire

SK hynix Develops PIM, Next-Generation AI Accelerator

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SEOUL, South Korea, Feb. 16, 2022 — SK hynix (or "the Company", www.skhynix.com) announced on February 16 that it has developed PIM*, a next-generation memory chip with computing capabilities.

*PIM(Processing In Memory): A next-generation technology that provides a solution for data congestion issues for AI and big data by adding computational functions to semiconductor memory

 

SK hynix develops the first sample of GDDR6-AiM that adopts its PIM technology
SK hynix develops the first sample of GDDR6-AiM that adopts its PIM technology

It has been generally accepted that memory chips store data and CPU or GPU, like human brain, process data. SK hynix, following its challenge to such notion and efforts to pursue innovation in the next-generation smart memory, has found a breakthrough solution with the development of the latest technology.

SK hynix plans to showcase its PIM development at the world’s most prestigious semiconductor conference, 2022 ISSCC*, in San Francisco at the end of this month. The  company expects continued efforts for innovation of this technology to bring the memory-centric computing, in which semiconductor memory plays a central role, a step closer to the reality in devices such as smartphones.

*ISSCC: The International Solid-State Circuits Conference will be held virtually from Feb. 20 to Feb. 24 this year with a theme of "Intelligent Silicon for a Sustainable World"

For the first product that adopts the PIM technology, SK hynix has developed a sample of GDDR6-AiM (Accelerator* in memory). The GDDR6-AiM adds computational functions to GDDR6* memory chips, which process data at 16Gbps. A combination of GDDR6-AiM with CPU or GPU instead of a typical DRAM makes certain computation speed 16 times faster. GDDR6-AiM is widely expected to be adopted for machine learning, high-performance computing, and big data computation and storage.

*Accelerator: A special-purpose hardware made using processing and computation chips

*Graphics DDR (GDDR): a standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly, of which generation shifted from GDDR3, GDDR5 and GDDR5X to GDDR6. It’s now one of the most popular memory chips for AI and big data applications

 

SK hynix develops the first sample of GDDR6-AiM that adopts its PIM technology
SK hynix develops the first sample of GDDR6-AiM that adopts its PIM technology

GDDR6-AiM runs on 1.25V, lower than the existing product’s operating voltage of 1.35V. In addition, the PIM reduces data movement to the CPU and GPU, reducing power consumption by 80%. This, accordingly, helps SK hynix meet its commitment to ESG management by reducing carbon emissions of the devices that adopt this product.

SK hynix also plans to introduce a technology that combines GDDR6-AiM with AI chips in collaboration with SAPEON Inc., an AI chip company that recently spun off from SK Telecom.

"The use of artificial neural network data has increased rapidly recently, requiring computing technology optimized for computational characteristics," said Ryu Soo-jung, CEO of SAPEON Inc. "We aim to maximize efficiency in data calculation, costs, and energy use by combining technologies from the two companies."

Ahn Hyun, Head of Solution Development who spearheaded the development of the latest technology and product, said that "SK hynix will build a new memory solution ecosystem using GDDR6-AiM, which has its own computing function." He added that "the company will continue to evolve its business model and the direction for technology development."

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

PR Newswire

Unilumin supports the Opening Ceremony of the 2022 Beijing Winter Olympics

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BEIJING, Feb. 5, 2022 — On February 4, 2022, the whole world watched the Opening Ceremony for the Beijing Winter Olympics. This grand event provided a stunning visual feast that combined digital technology and beautiful creative designs. It was not only technologically advanced, but dynamic, aesthetically pleasing, and experiential. This was also an opportunity to showcase some of China’s newest technology innovations to the world.

At the beautiful Opening Ceremony, a giant snowflake-shaped cauldron and a never-before-seen 8K ultra high definition (UHD) display on the stage of the stadium attracted the world’s attention; Unilumin and BOE Technology were jointly involved in creating these magical displays.

Before the official start, Zhang Yimou, who was the director of the Opening Ceremony, had already dropped hints that this year the Winter Olympics would be totally different. The stage floor of the Opening Ceremony was illuminated by the largest 8K UHD ground display system in existence, with an overall area of 10,393 square meters. Not only was it the largest in the world, but it also used cutting edge technology.

The Ground Display System in the National Stadium (also known as the Bird’s Nest)
The Ground Display System in the National Stadium (also known as the Bird’s Nest)

As the exclusive partner in LED industry for Team China, Unilumin was proud to be granted the right to use the Team China trademark in May 2021. The Winter Olympics feature other lighting products by Unilumin, such as the lighting for the preparation offices in the General Administration of Sport, training centers such as the Beijing Wukesong Arena, training centers for athletes, and the swimming pool. Unilumin is doing its part to cheer on the athletes.

This continues a long tradition of cooperation between Unilumin and sport. Since 2014, Unilumin has supported every major sporting event, from the 2014 Sochi Winter Olympics, to the 2016 Rio Olympics, to the 2018 FIFA World Cup in Russia, to the 2020 Tokyo Olympics. It has also supported other sports events hosted in China such as the 2021 Summer World University Games in Chengdu, and the Hangzhou 2022 Asian Games. Unilumin has always been there for the athletes, at all of the elite sports events held around the world.

Contact: Estella Yan, estella.yan@unilumin.com

 

PR Newswire

Arasan expands Total MIPI Display IP with seamlessly integrated VESA DSC IP

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SAN JOSE, Calif., Jan. 29, 2022 — Arasan Chip Systems, the leading provider of Total IPTM for the SoC market announces the launch of its MIPI DSI-2SM with its seamlessly integrated VESA DSC IP. The VESA DSC IP is compliant with the VESA DSC 1.2 Specifications.

Arasan’s Total MIPI Display IPTM with MIPI DSI-2SM and VESA DSC is used widely as the primary display interface for mobile, automobile, and AR/VR gadgets. These displays are getting more advanced, offering ultra-high-definition resolutions (>4K), higher frame rates, and RGB capabilities. It’s becoming more difficult for designers to balance the need for data bandwidth with a reduction in power usage, all the while maintaining a high level of visual quality. Compression protocols that are visually lossless via display interfaces like Arasan’s VESA DSC IP are needed by design professionals. Arasan’s Total IPTM solution for MIPI DSI-2SM with VESA DSC IP provides an end-to-end solution enabling visually lossless compression for displays requiring high bandwidth and optimum power efficiency.

Arasan’s Total MIPI Display IPTM with VESA DSC IP is seamlessly integrated and highly interoperable with low gate count, low latency, and reduced memory size implementations and provides real-time compression of high-definition streams up to 8K in resolution. The core accepts inputs of 8, 10, 12, 14, or 16 bits per pixel in either RGB or YCbCr format (4:4:4 or 4:2:2). The DSC Encoder/Decoder core incorporates industry-standard interfaces for host setup and control, video input and output, and audio input and output.

Arasan’s VESA DSC Encoder IP and VESA DSC Decoder IP are available immediately as standalone IP or seamlessly integrated with Arasan’s DSI Tx IP or DSI Rx IP respectively.

https://www.arasan.com/product/mipi-dsi-2-sm-with-vesa-dsc/

About Arasan

Arasan Chip Systems, a contributing member of the MIPI Association since 2005 is a leading provider of IP for mobile storage and mobile connectivity interfaces with over a billion chips shipped with our MIPI IP. Arasan’s high-quality, silicon-proven, Total IP Solutions include digital IP, AMS PHY IP, Verification IP, HDK, and Software. Arasan has a focused product portfolio targeting mobile SoCs. The term Mobile has evolved over our two-decade history to include all things mobile – starting with PDAs in the mid-’90s to today’s Automobiles, Drones, and IoT. Arasan is at the forefront of this evolution of "Mobile" with its standards-based IP at the heart of Mobile SoCs.

Contact: 
Dr. Sam Beal 
Mktg1@arasan.com 

 

PR Newswire

Electronic System Design Industry Logs 17% Year-Over-Year Revenue Growth in Q3 2021, ESD Alliance Reports

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MILPITAS, Calif., Jan. 17, 2022 — Electronic System Design (ESD) industry revenue increased 17.1% year-over-year from $2,953.9 million to $3,458.1 million in Q3 2021, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 16.1%.   

"The industry reported double-digit year-over-year revenue growth for Q3 2021," said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. "Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth."

The companies tracked in the EDMD report employed 51,182 people globally in Q3 2021, an 8.7% increase over the Q3 2020 headcount of 47,087 and up 2.4% compared to Q2 2021.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

  • CAE revenue increased 13.7% to $1,054.7 million. The four-quarter CAE moving average increased 11.8%.
  • IC Physical Design and Verification revenue increased 0.7% to $612.6 million. The four-quarter moving average for the category rose 16%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 14.5% to $298.3 million. The four-quarter moving average for PCB and MCM increased 10.9%.
  • SIP revenue rose 30.6% to $1,373.3 million. The four-quarter SIP moving average grew 22.1%.
  • Services revenue increased 12.5% to $119.1 million. The four-quarter Services moving average increased 9.2%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, purchased $1,494.5 million of electronic system design products and services in Q3 2021, a 14.3% increase. The four-quarter moving average for the Americas rose 15.8%.
  • Europe, Middle East, and Africa (EMEA) revenue increased 22.6% to $451.7 million. The four-quarter moving average for EMEA grew 11.9%.
  • Japan revenue increased 11.8% to $259.8 million. The four-quarter moving average for Japan rose 3.3%.
  • Asia Pacific (APAC) revenue increased 19.7% to $1,252.1 million. The four-quarter moving average for APAC increased 21.3%.

About the EDMD Report
The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents EDA, SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

  • Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts                                                                                
Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106             

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

 

PR Newswire

SK Telecom, SK Square and SK hynix Launch ‘SK ICT Alliance’ for Synergies

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LAS VEGAS, Jan. 9, 2022 — At CES 2022, SK Telecom, SK Square and SK hynix announced the launch of the ‘SK ICT Alliance’ to jointly develop and invest in ICT convergence technologies, and create global market opportunities. 

Park Jung-ho, Vice Chairman and CEO of SK Square and SK hynix
Park Jung-ho, Vice Chairman and CEO of SK Square and SK hynix

The alliance comes as SK hynix celebrates the tenth year since joining the SK Group and SK Square successfully spun off from SK Telecom, marking the beginning of a new era of synergies between semiconductor, telecommunication and investment. 

Ryu young-sang, CEO of SK Telecom
Ryu young-sang, CEO of SK Telecom

With the aim to secure global competitiveness in diverse ICT areas such as semiconductors, 5G and AI, the three companies plan to carry out joint business activities in the global market by leveraging SK Square’s innovative investment, SK Telecom’s AI and 5G technologies and SK hynix’s  future semiconductor technologies.

Lee Seok-Hee, CEO of SK hynix
Lee Seok-Hee, CEO of SK hynix

From January 2022, the three companies will operate ‘Synergy Council’ chaired by Vice Chairman Park Jung-ho, and joined by Ryu Young-sang, CEO of SK Telecom, and Lee Seok-Hee, CEO of SK hynix. The Synergy Council will be the highest decision making body, where the executives discuss R&D cooperation and joint investments in semiconductor and ICT areas, and promote global market expansion. 

  • Increasing the presence of SK Telecom’s self-developed AI semiconductor SAPEON

SK Telecom, SK Square and SK hynix will first create synergies in introducing SK Telecom’s AI chip SAPEON* to the global market. The three companies will jointly invest to establish SAPEON Inc. in the U.S. and make inroads into the global AI semiconductor market. 

* SAPEON is SK Telecom’s self-developed AI chip launched in November 2020. Although it is about half the price of a Graphics Processing Unit (GPU), its deep learning computation speed is 1.5 times faster and it uses 20% less power than GPU.

SK Telecom plans to lead the development of SAPEON-related technologies by leveraging its R&D capabilities and service experience accumulated in 5G and AI. In the mid-to long-term, the company will expand its SAPEON model lineup by developing AI chips dedicated to data centers and autonomous driving. 

SK Telecom, SK Square and SK hynix Launch 'SK ICT Alliance' for Synergies
SK Telecom, SK Square and SK hynix Launch ‘SK ICT Alliance’ for Synergies

SK Telecom will also promote synergies between its AI semiconductor and SK hynix’s semiconductor memory technologies, while also attracting strategic and financial investors in cooperation with SK Square. 

SAPEON Inc. will serve as an outpost for expanding the AI semiconductor business to the global market by attracting U.S.-based big tech companies as major clients. It will also secure an edge in luring semiconductor development experts and drawing in outside investors. Moreover, as the subsidiary of SAPEON Inc., SAPEON Korea will take charge of business in Korea and the Asian region. 

Projecting that the convergence of AI and metaverse will define the future world of ICT, SK Telecom plans to innovate its three key services, T Universe, Ifland and AI Agent, in an accelerated manner. Moreover, it will also introduce new services by adding connected intelligence to future devices such as UAM aircrafts, self-driving cars and robots. 

"By proactively responding to changes taking place in the areas of AI, metaverse and 5G, we will prepare ourselves for the next decade," said Ryu Young-sang, CEO of SK Telecom.   

  • Creating an ICT investment capital of over KRW 1 trillion

SK Telecom, SK Square and SK hynix plan to establish a base to make investments overseas this year and attract investment from overseas financial investors to create and operate a total investment capital of over KRW 1 trillion. Detailed discussions on investments are already underway with prominent global investors.

With this investment capital, the three companies will actively invest in companies with innovative technologies such as AI, metaverse, block chain and semiconductors. 

Through these investment activities, they will be able to stay ahead of the convergence trend within the ICT industry and discover unicorns that can change the industrial landscape, which will lead to valuable business synergies. 

SK Telecom and SK hynix will be able to strengthen business partnerships with the companies they invested in or even secure an advantage in the acquisition of these companies in the future. SK Square expects to build a good track record as an investment company, while increasing its corporate value. 

According to market research company Mergermarket, the size of the global buyout market reached around KRW 1,400 trillion (USD 1.172 trillion) in 2021, increasing by about twofold from the previous year. Industries are being rapidly reorganized via M&As between global companies, and those that fail to keep up with this trend are left behind the competition. 

  • SK hynix to increase its global market presence through ‘Inside America’ strategy

SK hynix aims to become a top global tech company that leads the rapidly changing ICT industry.

Recently, the semiconductor market is witnessing more diversified demand from sectors like AI, autonomous driving and metaverse, and pluralization is taking place within the system architecture field like CPU, GPU and MPU. Since the existing law of competition no longer applies to this market, it is imperative for companies to develop new business models and technologies to remain competitive. 

With the acquisition of Intel’s NAND and SSD business, SK hynix is now fully set to strengthen the competitiveness of its NAND flash business. The company also aims to break away from its existing role as a semiconductor supplier and become a company that leads future technologies along with global ICT companies. 

Moreover, SK hynix will carry out its ‘Inside America’ strategy in the U.S., world’s largest ICT market and battlefield, to enhance its business competitiveness and expand into new partnerships. It will also establish a new business unit and R&D center in the U.S. Based on SK hynix’s competitiveness, the three companies expect to strengthen their collaboration with global ICT companies.

"SK hynix will take a leap to become a top-notch global tech company by offering more innovative technologies and products, and creating value for the society and humanity," said Lee Seok-Hee, CEO of SK hynix. 

Meanwhile, SK Square plans to accelerate the creation of synergies among the three companies by making innovative investments. In response to SK hynix’s moves towards global market expansion and new technology development, SK Square will make joint investments in the semiconductor ecosystem. In parallel, it will increase its investment in platforms that will drive future innovations such as metaverse and blockchain.

SK Square will also enter the new global block chain market by leveraging Korbit, a virtual asset exchange it recently invested in, and build a blockchain-based economic system in collaboration with SK Telecom’s metaverse platform Ifland.

"This year, the SK ICT Alliance will join forces to achieve new innovations and make a big leap forward in the global market," said Park Jung-ho, Vice Chairman and CEO of SK Square and SK hynix. "As leading players in the global semiconductor and ICT industries, we will also make best efforts to contribute to the Korean economy."  

About SK Telecom

SK Telecom (NYSE:SKM) is Korea’s leading ICT company, driving innovations in fixed & wireless telecommunications, AI service, and digital infrastructure service. Armed with cutting-edge ICT including AI and 5G, the company is ushering in a new level of convergence to deliver unprecedented value to customers. As the global 5G pioneer, SKT is committed to realizing the full potential of 5G through ground-breaking services that can improve people’s lives, transform businesses, and lead to a better society.

SKT boasts unrivaled leadership in the Korean mobile market with over 30 million subscribers, which account for nearly 50 percent of the market. 

For more information, please contact skt_press@sk.com or visit our LinkedIn page www.linkedin.com/company/sk-telecom.

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), Flash memory chips ("NAND Flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

PR Newswire

Three Big Announcements From BLUETTI at CES 2022

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LAS VEGAS, Jan. 3, 2022 — BLUETTI highlighted its thinking-forward solar energy facility collections at CES 2022, including the world’s first sodium-ion solar generator — NA300 and much-anticipated AC & EB series of power stations. Here’s a dive into them:

1. The Next Generation of Energy Storage: Sodium-ion Battery

BLUETTI NA300 is gonna start the revolution of energy storage systems. Begin with its 3,000W pure sine wave inverter and 3,000Wh capacity, it can juice up most electric appliances in the market. And it feels similar to the superstar BLUETTI EP500 Pro, supporting connection with another NA300 by a fusion box—Output voltage and power double to 240V and 6,000W—and App remote control.

Besides, it’s able to charge at an incredible rate of 6,000W (3,000W Max. for both AC and PV); and work with two B480 battery modules (4,800Wh each) for a whopping 12,600Wh. Such unit severs a family’s electricity needs for DAYS or even ONE WEEK during grid failures or natural disasters with constant solar input. 

Back to the Na-ion, BLUETTI first-gen Na+ batteries are comparable with lithium-ion ones. They could charge to 80% SOC in 30 minutes at room temperature. Moreover, they will keep over 85% capacity retention and over 80% system integration efficiency in sub-zero temperature (-20°C). Finally the below demonstrates a throughout comparison between this sodium-ion battery and LiFePO4 battery.


2. The Long-waited APEX: BLUETTI AC500

The BLUETTI AC series have hit the market quite a few times. This time AC500 holds a 5,000W pure sine wave inverter, maybe the most powerful in today’s market. It is also 100% modular same as AC300, and can work with six B301 battery modules (3072Wh each) for a groundbreaking 18,432Wh. Also, it supports capacity expansion with AC300’s companion—B300.

More than that, AC500 manages 8,000W Max. AC + PV dual charging (5,000W and 3,000W for AC and PV, respectively). And two AC500s can build a 240V, 10000W output power system with a fusion box.

3. The Tiny yet Mighty Assassin: BLUETTI EB3A

Finally comes the BLUETTI EB3A. Out of BLUETTI naming custom, "EB3A" is quite distinct from other lineups. BLUETTI staff said the "A" is for "Advanced". EB3A has the 600W pure sine wave inverter and 288Wh LiFePO4 battery pack under the hood and supports 600W Max. AC input and 200W Max. solar input, absolutely a big catfish for the entry-level power station market.

Plus, EB3A is the first BLUETTI compact model needn’t charge with a bulky power brick (among the sub-3000Wh range). And it only takes EB3A 20 minutes, a coffee break to get 80% fully charged.

BLUETTI is seeing the energy storage’s future forward. However, it needs more time to improve and iterate the capability of sodium-ion battery technology, and diversified technologies are expected to assure the industry’s development for a green and pleasant world in the future.

PR Newswire

SK Telecom Showcases Green ICT at CES 2022

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LAS VEGAS, Jan. 2, 2022 — SK Telecom (NYSE: SKM, hereinafter referred to as "SKT") today announced that it will participate in CES 2022, which will be held in Las Vegas from January 5 to 8, 2022, to showcase green ICT in the era of Net Zero. 

SKT Showcases Green ICT at CES 2022
SKT Showcases Green ICT at CES 2022

SKT will operate a joint exhibition booth with SK Inc., SK Innovation, SK hynix, SK E&S and SK Ecoplant under the theme of ‘SK’s 2030 Net Zero Pledge’ and offer a chance for visitors to experience its innovative green technologies. 

  • Environmentally friendly AI and telecommunications network technologies

AI and telecommunications networks stand at the core of ICT innovation. However, they are also pointed out as a cause of environmental pollution due to the large amount of power they consume. Against this backdrop, SKT is accelerating an ICT revolution through the development and application of low-power high-efficiency semiconductors and energy-saving telecommunications network technologies. 

At CES 2022, SKT will be showcasing its self-developed AI chip named SAPEON. SAPEON is optimally designed to process artificial intelligence tasks faster, using less power by efficiently processing large amounts of data in parallel.

With the rapid spread of AI services in people’s daily lives and industries, the amount of data that needs to be processed is growing exponentially. However, the existing AI data centers that use Graphics Processing Units (GPU) for inference are receiving criticism for consuming a great amount of energy. SAPEON is an environmentally-friendly solution as it uses 20% less power than GPU, while supporting 1.5 times faster deep learning computation. 

SKT will also introduce Single RAN, a technology that reduces the amount of power usage by approximately 53% through integrated operation of 3G and LTE network equipment. The company either replaced the outdated 3G and LTE equipment with new equipment applied with Single RAN or upgraded the software of its existing LTE equipment with Single RAN to operate as both 3G and LTE equipment.

By successfully applying Single RAN to all applicable base stations and repeaters installed in 78 cities in Korea including Seoul in 2020, SKT earned around 10,000 tons of carbon credits. 

  • ICT solutions for reducing carbon generation in daily lives 

At CES 2022, SKT will invite visitors to experience its metaverse service, multi-use cup project and other ICT services that can help reduce CO2 emissions such as optimal route navigation service. 

The company will introduce its metaverse platform Ifland as a new promising path towards a low carbon society. Ifland allows users to take carbon generating activities such as conferences, presentations and business trips to the virtual world. 

It provides a wide variety of virtual spaces including conference halls, outdoor stages and rooftops, and enables users to enjoy rich communication by sharing documents (PDF) and video files (MP4). It can accommodate up to 130 users simultaneously, which makes it an ideal place for large-scale events. 

Ifland has been providing users with a new and environmentally friendly experience by migrating diverse offline events to the virtual world ranging from the D-100 event for 2021 Seoul UN Peacekeeping Ministerial and K-pop concerts. 

SKT will also present the Habit Cup Project that promotes the use of multi-use cups to reduce plastic waste. Coffee shops participating in the project are serving beverages in multi-use cups named ‘Habit Cups’ that can be later returned via smart kiosks capable of identifying and accepting only Habit Cups through the use of SKT’s vision AI technology. Returned cups are collected everyday to be cleaned and sanitized, and then delivered back to cafes. 

At present, SKT is carrying out a trial project joined by around 20 cafes located in central areas of Seoul, where there is a large floating population. The company expects to eliminate the use of 1.2 million disposable cups during the three-month project period. It is also implementing a trial project in Jeju Island, and expects to reduce the use of 630,000 disposable cups per year. 

Korea’s No.1 mobility platform T Map will also be on display. By providing an optimal route, T Map contributes to reducing greenhouse gas emissions and saving fuel. The service also helps save social costs by decreasing the risk of traffic accidents through enhanced safety features like sudden brake alert. 

"At CES 2022, we will be showcasing cutting-edge technologies that can drive the green ICT revolution, along with innovative services that hold the power to reduce carbon generation in our daily lives," said SKT. "Through multifaceted efforts, SKT will become a solid leader in the era of Net Zero." 

About SK Telecom

SK Telecom (NYSE: SKM) is Korea’s leading ICT company, driving innovations in fixed & wireless telecommunications, AI service, and digital infrastructure service. Armed with cutting-edge ICT including AI and 5G, the company is ushering in a new level of convergence to deliver unprecedented value to customers. As the global 5G pioneer, SKT is committed to realizing the full potential of 5G through ground-breaking services that can improve people’s lives, transform businesses, and lead to a better society.

SKT boasts unrivaled leadership in the Korean mobile market with over 30 million subscribers, which account for nearly 50 percent of the market. 

For more information, please contact skt_press@sk.com or visit our LinkedIn page www.linkedin.com/company/sk-telecom.

 

PR Newswire

ITRI’s VLSI-TSA and VLSI-DAT Symposia will Kick Off in April 2022

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HSINCHU, , Dec. 22, 2021 — The Industrial Technology Research Institute (ITRI) will host the 2022 International Symposia on VLSI Technology, Systems and Applications (VLSI-TSA) and Design, Automation and Test (VLSI-DAT) on April 18-21, 2022 at the Ambassador Hotel Hsinchu, Taiwan. Experts from top companies and prestigious academic institutions including TSMC, Intel, IBM, Microsoft Corporation, MediaTek, Mitsubishi Electric Corporation, Winbond Electronics Corporation, Stanford University, and University of California, Berkeley will share their insights and latest research findings on 3D heterogeneous integration, AI hardware design, GaN and SiC technology and applications, silicon photonics, in-memory computing, advanced packaging, AIoT security, next-generation MRAM, low dimensional materials and devices, and high performance computing.

The VLSI-TSA and VLSI-DAT Symposia will take place in person in Hsinchu, Taiwan during April 18-21, 2022.
The VLSI-TSA and VLSI-DAT Symposia will take place in person in Hsinchu, Taiwan during April 18-21, 2022.

The VLSI-TSA and VLSI-DAT symposia were first held in 1983, hosting premiere conferences in semiconductor-related fields and attracting up to 1,000 participants every year. In the 2022 event, six esteemed experts will give keynote speeches. Dr. Babak Sabi, Sr. Vice President and General Manager of Assembly and Test Technology Development at Intel Corporation, will describe current technology envelopes and future scaling directions for representative advanced packaging architectures. Mr. Toru Matsuoka, Deputy General Manager of the Business Planning Project Group, Power Device Works at Mitsubishi Electric Corporation, will discuss the latest SiC technology and will demonstrate some application examples. Dr. Jeff Burns, Director of IBM Research AI Hardware Center, will share his insights on the challenges and opportunities in AI hardware design. Prof. Boris Murmann of Stanford University will illustrate examples of small-scale data analysis and machine learning inference systems that operate near the physical interface. Dr. K. Lawrence Loh, Sr. Vice President of MediaTek, will highlight technology challenges to the IC industry for the next decade. Dr. L.C. Lu, Vice President of Research & Development/Design & Technology Platform at TSMC, will review recent market trends and focus on advances in process scaling for libraries, memories and external interfaces, covering several design and technology co-optimization (DTCO) techniques that enable higher transistor density and performance.

The 2022 VLSI-TSA and VLSI-DAT symposia are planned as hybrid events, incorporating an in-person conference and a virtual platform with live sessions and on-demand video presentations. The in-person symposia will be held on April 18-21, 2022 at the Ambassador Hotel Hsinchu, Taiwan. Following the physical event, there will be virtual symposia providing online access to on-demand video presentations from April 25 to May 24, 2022. Over 150 outstanding papers will be presented during the symposia.

Online registration will be open from January 1, 2022. Enjoy the early registration discount until March 18, 2022, and students are eligible for an up to 65% discount on their registration fee. Registration link: https://reg.itri.org.tw/2022VLSI.

For further information, please visit the conference websites:
2022 VLSI-TSA: https://expo.itri.org.tw/2022vlsitsa 
2022 VLSI-DAT: https://expo.itri.org.tw/2022vlsidat 

About ITRI

Industrial Technology Research Institute (ITRI) is one of the world’s leading technology R&D institutions aiming to innovate a better future for society. Founded in 1973, ITRI has played a vital role in transforming Taiwan’s industries from labor-intensive into innovation-driven. To address market needs and global trends, it has launched its 2030 Technology Strategy & Roadmap and focuses on innovation development in Smart Living, Quality Health, and Sustainable Environment. It also strives to strengthen Intelligentization Enabling Technology to support diversified applications.

Over the years, ITRI has been dedicated to incubating startups and spinoffs, including well-known names such as UMC and TSMC. In addition to its headquarters in Taiwan, ITRI has branch offices in the U.S., Europe, and Japan in an effort to extend its R&D scope and promote international cooperation across the globe. For more information, please visit https://www.itri.org/eng.

PR Newswire

YES (Yield Engineering Systems, Inc.) Acquires SPEC (Semiconductor Process Equipment Corp.)

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Adds Wet Processing to its Expanding Portfolio of Surface & Material Enhancement Solutions

FREMONT, Calif., Dec. 22, 2021 — YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced that it has acquired SPEC (Semiconductor Process Equipment Corporation) of Valencia, California for an undisclosed amount. The companies had announced a strategic partnership agreement in June.

The purchase brings together two longtime, trusted semiconductor equipment suppliers with more than 70 years of industry experience between them. "YES and SPEC have many characteristics in common," said Rama Alapati, CEO of YES. "Both of us have accumulated decades of technological expertise and have installed hundreds of systems in dozens of countries. We both take pride in our many repeat customers, and our excellent industry reputations. In acquiring SPEC, we feel YES is now better-positioned to meet the growing demands of current and future customers in emerging markets such as HPC, AI/ML, 5G, autonomous driving, augmented reality, and other computationally intensive applications."

"The SPEC product line, which includes cleaning, etching, stripping and plating equipment, complements our portfolio well, and will allow YES to extend our offerings into the wet processing market," added Rezwan Lateef, President of YES. "We welcome SPEC’s employees to the YES team, and we look forward to developing a variety of new products together to address and anticipate customer needs."

"SPEC is very pleased to join forces with YES. With global demand for semiconductors increasing dramatically, this merger could not have come at a better time for both companies. We are excited to help YES open new markets and opportunities for our proven wet-process technologies going forward," said Kevin McGillivray, co-founder of SPEC.  

In addition to augmenting its personnel resources with the SPEC staff, YES will gain more than 40,000 square feet of manufacturing, assembly, and cleanroom space in Valencia, as well as SPEC’s regional offices around the world.

About YES

YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit www.yieldengineering.com.

About SPEC

SPEC (Semiconductor Process Equipment Corporation) is a highly experienced supplier of surface conditioning wet process equipment. Since 1986, SPEC has designed and manufactured wafer-level and device-level wet process equipment for acid and solvent surface modification (cleaning, etching, stripping), electroplating, and electroless (chemical) plating for all industries requiring a high level of process cleanliness. SPEC’s products are used for polysilicon chip, chunk, and ingot cleaning; crucible cleaning, cavity cleaning for particle accelerators, chemical mixing and delivery, hard drive component cleaning, and quartzware cleaning. SPEC systems are engineered to match the unique requirements of the end user. For more information, please visit www.team-spec.com.

Media Contact
Victoria Barnes
Director of Communications
YES (Yield Engineering Systems, Inc.)
510-954-6723 direct
VBarnes@yieldengineering.com