HSINCHU, Feb. 20, 2024 — M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), today announced that the PCIe 5.0 PHY IP has obtained the…
Walt Disney Studios and Pixelworks Enter into a First of its Kind Multi-Year Agreement to Expand Reach of TrueCut Motion Technology
Disney will pioneer motion grading on select titles ensuring playback matches filmmaker creative intent BURBANK, Calif., Feb. 1, 2024 — In…
DFI Unveils Embedded System Module Equipped with Intel’s Latest AI Processor to Enter the AI IPC Market
TAIPEI, Jan. 31, 2024 — DFI, the world’s leading brand in embedded motherboards and industrial computers, is targeting the AI application market by launching the embedded system module (SOM)…
Raytron to Light Up SPIE Photonics West 2024 with Infrared Tech Marvels
SAN FRANCISCO, Jan. 29, 2024 — Raytron will meet the customers at booth No.4118 of SPIE Photonics West in the Moscone Center, San Francisco from January 30 to February…
ARTERY AT32 MCU-based Solutions for High-speed Multi-Functional Peripheral
HSINCHU, Jan. 5, 2024 — Office facilities are always fundamental to business. To save manpower and promote efficiency, more and more user-friendly office equipment have been introduced, and one…
Macnica Inc. Selected Leading Innovation Consultancy Orangeleaf Consulting in Malaysia to Propel Accelerated Digital Transformation Excellence in Japan
KUALA LUMPUR, Malaysia, Dec. 29, 2023 — Macnica Inc. headquartered at Yokohama City, Kanagawa Prefecture, President: Kazumasa Hara, hereinafter referred to as "Macnica" is pleased to announce a strategic collaboration with…
EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing with EVG®850 NanoCleave™ System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling…
Chipsea Technologies (Shenzhen) Co., Ltd., a “new player” in the global PC industry chain, has once again been awarded an Intel Platform Component List (PCL) certification, for its new EC product E2010
SHENZHEN, China, Nov. 25, 2023 — Recently, China’s A-share listed company Chipsea Technologies (stock code: 688595) has seen its new generation EC chip CSCE2010 successfully passed Intel PCL (Platform Component…
Chengdu showcases technological strength at high-tech expo
CHENGDU, China, Nov. 24, 2023 — Chengdu, capital of Southwest China’s Sichuan province, demonstrated its strength in sci-tech innovation at the 11th China (Mianyang) Science and Technology City International…
DEEPX Honored with Three CES Innovation Awards 2024 for Leading-Edge AI Chip Tech
Korean fabless startup unleashes world’s most innovative AI chip technology — ultra-gap source technology – DEEPX is honored with three CES Innovation Awards 2024 in its core focus areas: Computer…