Tag Archives: SEM

PR Newswire

MediaTek Diversifies Mobile Offerings with Dimensity 6000 Series for Mainstream 5G Devices

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The new Dimensity 6100+ chipset makes advanced 5G connectivity more accessible while offering improved features

HSINCHU, July 11, 2023 /PRNewswire/ — MediaTek today officially launched its new Dimensity 6000 series along with a chipset designed to enhance the next generation of mainstream 5G devices. The Dimensity 6100+ SoC delivers premium features—including exceptional power efficiency, vivid displays, high frame rates, AI-powered camera technologies, leading low power consumption, and reliable Sub-6 5G connectivity—at an accessible price point.

“As developing markets continue rolling out 5G networks at a rapid pace and operators in developed markets work to finish transitioning consumers from 4G LTE to 5G, there has never been a more vital need for chipsets that cater to the growing number of mainstream mobile devices that feature next-generation connectivity,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs.”

The Dimensity 6100+ integrates an enhanced 5G modem supporting 3GPP Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation, significantly reducing power consumption contributed by MediaTek UltraSave 3.0+ technology. This chip features two Arm Cortex-A76 big cores and six Arm Cortex-A55 efficiency cores, offering notable enhancements, including support for AI-powered cameras, 10-bit displays, outstanding UX and GPU performance, and rich peripheral features.

Other key features of the Dimensity 6100+ chipset include:

  • Up to 108MP Non-ZSL camera support.
  • Up to 2K 30fps video capture.
  • UltraSave 3.0+ technology offers 20% reduced 5G power consumption compared to competitive solutions.
  • Powerful camera features including AI-bokeh for stunning portraits and selfies; working with Arcsoft, MediaTek is also bringing AI-color technology to mainstream devices so users can showcase their creativity.
  • Premium 10-bit display support: Reproduces more than one billion colors for vibrant images and videos, along with support for 90Hz to 120Hz frame rates for a smooth user experience.

MediaTek’s broad 5G portfolio expands across different price tiers to make great mobile experiences more accessible. The Dimensity 9000 series is designed for flagship smartphones and tablets; the Dimensity 8000 family is geared for premium mobile devices; and the Dimensity 7000 lineup expands the company’s range of high-tech devices. The new Dimensity 6000 series will now democratize higher-end features to mainstream 5G devices.

The first smartphones featuring the Dimensity 6100+ chipset will be available in the third quarter of 2023.

To learn more about MediaTek’s mobile platform, please visit: https://i.mediatek.com/mediatek-5g.

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information. 

MediaTek Press Office:

PR@mediatek.com
Kevin Keating, MediaTek
+1- 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

Source: MediaTek Inc.

PR Newswire

ASE Technology Holding Co., Ltd. Announces Monthly Net Revenues*

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TAIPEI, July 10, 2023 /PRNewswire/ — ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711, “ASEH” or the “Company”), announces its unaudited consolidated net revenues for June and 2nd quarter of 2023.

Consolidated net revenues (unaudited)

Jun

May

Jun

Sequential

YoY

(NT$ Million)

2023

2023

2022

Change

Change

Net Revenues

46,722

46,239

57,998

+1.0 %

-19.4 %

Jun

May

Jun

Sequential

YoY

(US$ Million)

2023

2023

2022

Change

Change

Net Revenues

1,523

1,508

1,966

+1.0 %

-22.5 %

Q2

Q1

Q2

Sequential

YoY

(NT$ Million)

2023

2023

2022

Change

Change

Net Revenues

136,275

130,891

160,439

+4.1 %

-15.1 %

Q2

Q1

Q2

Sequential

YoY

(US$ Million)

2023

2023

2022

Change

Change

Net Revenues

4,457

4,304

5,480

+3.6 %

-18.7 %

Net revenues for ATM assembly, testing and material business are as follows:

atm net revenues (unaudited)

Jun

May

Jun

Sequential

YoY

(NT$ Million)

2023

2023

2022

Change

Change

Net Revenues

26,555

26,232

32,879

+1.2 %

-19.2 %

Jun

May

Jun

Sequential

YoY

(US$ Million)

2023

2023

2022

Change

Change

Net Revenues

866

856

1,114

+1.2 %

-22.3 %

Q2

Q1

Q2

Sequential

YoY

(NT$ Million)

2023

2023

2022

Change

Change

Net Revenues

76,108

73,319

94,999

+3.8 %

-19.9 %

Q2

Q1

Q2

Sequential

YoY

(US$ Million)

2023

2023

2022

Change

Change

Net Revenues

2,489

2,411

3,246

+3.2 %

-23.3 %

*This press release is intended to comply with Taiwan regulatory requirements.

Safe Harbor Notice:
This press release contains “forward-looking statements” within the meaning of Section 27A of the United States Securities Act of 1933, as amended, and Section 21E of the United States Securities Exchange Act of 1934, as amended. Although these forward-looking statements, which may include statements regarding our future results of operations, financial condition or business prospects, are based on our own information and information from other sources we believe to be reliable, you should not place undue reliance on these forward-looking statements, which apply only as of the date of this press release. The words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan” and similar expressions, as they relate to us, are intended to identify these forward-looking statements in this press release. These forward-looking statements are necessarily estimates reflecting the best judgment of our senior management and our actual results of operations, financial condition or business prospects may differ materially from those expressed or implied by the forward-looking statements for reasons including, among others, risks associated with cyclicality and market conditions in the semiconductor or electronic industry; changes in our regulatory environment, including our ability to comply with new or stricter environmental regulations and to resolve environmental liabilities; demand for the outsourced semiconductor packaging, testing and electronic manufacturing services we offer and for such outsourced services generally; the highly competitive semiconductor or manufacturing industry we are involved in; our ability to introduce new technologies in order to remain competitive; international business activities; our business strategy; our future expansion plans and capital expenditures; the strained relationship between the Republic of China and the People’s Republic of China; general economic and political conditions; the recent shift in United States trade policies; possible disruptions in commercial activities caused by natural or human-induced disasters; fluctuations in foreign currency exchange rates; and other factors.  For a discussion of these risks and other factors, please see the documents we file from time to time with the Securities and Exchange Commission, including the 2022 Annual Report on Form 20-F filed on April 10, 2023.

Investor Relations Contact:

Source: ASE Technology Holding Co., Ltd.

PR Newswire

United Imaging Introduces Next-Generation PET/CT Systems and Integrated Molecular Technology Platform at SNMMI

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With uMI Panorama™, United Imaging Continues to Push the Envelope on Whole-Body System Performance

HOUSTON, June 26, 2023 /PRNewswire/ — United Imaging, a global leader in manufacturing advanced medical imaging and radiotherapy equipment and a Leadership Circle sponsor at this year’s SNMMI, is making news on several fronts at SNMMI’s annual meeting in Chicago this week.

“There has been a debate in the marketplace for a while about the relative importance of resolution, axial field of view (FOV), and time of flight (TOF),” said Jeffrey Bundy, Ph.D, CEO of United Imaging Healthcare Solutions about the company’s product launch. “With the new wide-bore uMI Panorama and its 2.9 mm NEMA resolution, 35 cm axial FOV and 194 ps timing resolution, we will gladly have a conversation on any single specification or the collective benefit of all of them, because with this particular product, the need to compromise is gone.”

The uMI Panorama was teased recently in the media as one of United Imaging’s four new products in four different imaging modalities so far this year. Cheri Gottke, Vice President of the Molecular Imaging portfolio for the U.S., added that the uMI Panorama is currently installed at Huntsman Cancer Center in Salt Lake City, Utah and that “we chose SNMMI as the official stage to debut it.”   

United Imaging is showcasing a cutting-edge Molecular Imaging technology platform along with the uMI Panorama, called uExcel. The platform integrates hardware and software innovations to optimize performance, imaging capabilities and system functionalities. Its ultra-digital platform (UDP) detector boasts a high-performance ASIC chip, and its AI-empowered workflow streamlines operations and enhances examination efficiency. Exceptional image quality can be achieved with a lower dose, and the quality assurance module maintains peak performance of the system.

The uMI Panorama is a family of products that also includes a 510k pending system with a 148 cm axial FOV, the uMI Panorama GS. Built on the uExcel platform, this ultra-long axial FOV system allows for fast and high-resolution whole-body PET/CT imaging in a single bed position. The uMI Panorama GS is also being unveiled at SNMMI.  

United Imaging continues to see steady acceleration in demand for its popular digital PET/CT the uMI® 550, in both mobile and fixed configurations. “This is one of our most important molecular imaging innovations,” continued Gottke. “The entire digital portfolio from the uMI 550 to the uMI Panorama offers exceptional PET and CT image quality that improves quantitative accuracy and small lesion detectability. Our portfolio includes All-In Configurations™ and Software Upgrades for Life™ so that all our scanners truly stand the test of time from both a technological and a clinical perspective.”

The entire uMI portfolio is also “Born with AI” from the ground up, rather than being retrofitted with it later. This allows a seamless integration of artificial intelligence (AI) across all products, which optimizes daily workflow, improves the patient experience, and creates stunning diagnostic images. United Imaging’s artificial intelligence (uAI®) streamlines routine clinical workflows by auto iso-centering patients and defining the scan range. Its systems also allow faster scanning with less dose, while improving PET and CT imaging quality and providing image consistency in all clinical settings, from academic to freestanding imaging centers. 

SNMMI announced in its Value Initiative Newsletter that United Imaging is joining the Leadership Circle and taking an Industry co-chair position. 

United Imaging this week is also hosting two Satellite Symposiums (available for registration on the SNMMI meeting website) and a by-invitation-only customer event: 

uEXPLORER Symposium on June 25: “Exploring the Unmatched Capabilities of Total Body Imaging: Reflections on 5 Years of Clinical Adoption”; presenters include Dr. Ramsey Badawi, Vice Chair for Research, Department of Radiology, University of California, Davis and Dr. Harshad Kulkarni, Chief Medical Advisor, BAMF Health.

uMI Panorama Symposium on June 26: “Advancing Precision Medicine with Unprecedented PET/CT Technology for Clinical Molecular Imaging” on Monday, June 26, from 11:30 am – 12:30 pm. Presenters include Dr. Jeffrey Yap, Director, Center for Quantitative Imaging at Huntsman Cancer Institute.

United Imaging Educational Evening “UIH Night” (Invitation Only), Sunday June 25th. Presenters include Dr. Richard Carson, Professor of Biomedical Engineering and Radiology, Yale University and Dr. Simon Cherry, Professor of Biomedical Engineering and Radiology, UC Davis

United Imaging is located at booth #4032.

ABOUT UNITED IMAGING
At United Imaging, we develop and manufacture advanced medical products, digital healthcare solutions, and intelligent solutions that cover the entire process of imaging diagnosis and treatment. Founded in 2011, our company has subsidiaries and R&D centers across the world. Our North American headquarters in Houston includes our corporate offices, factory, product showroom, service training center, and service parts distribution center. With a cutting-edge digital portfolio and a mission of Equal Healthcare for All™, we help drive industry progress and bold change.

To learn more, visit united-imaging.com or follow us on LinkedIn and Twitter @UnitedImagingHC.

Source: United Imaging Healthcare Co., Ltd.

PR Newswire

SK hynix Receives International Certification for Automotive Memory Solution Development

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  • Obtains internationally recognized ASPICE Level 2 Certification through collaboration with Siemens
  • Aims to meet growing demand from automotive chip market, improve profitability with globally recognized NAND solutions

SEOUL, South Korea, June 20, 2023 /PRNewswire/ — SK hynix Inc. (or “the company”, www.skhynix.com) announced today that it has received the automotive ASPICE Level 2 certification, marking the first case that a Korean semiconductor company wins the recognition.

* ASPICE(Automotive Software Process Improvement & Capability dEtermination): A guideline for automotive software development that was introduced by European carmakers to evaluate reliability and capabilities of auto part suppliers.

The certification, essential for automotive NAND solution products, is expected to lead to an increased supply and stronger profitability of the company’s NAND solution products such as Universal Flash Memory and Solid State Drive, of which combined market is expected to grow by more than an average 20% every year, the company said.

With introduction and adoption of electric vehicles and autonomous driving system, the importance of technology in the areas of electric and electronic parts of vehicles is also growing.

Particularly, with systems for Advanced Driver Assistance System and Infotainment getting more sophisticated, the importance of software quality management as well as compatibility and stability is growing, requiring auto part suppliers to obtain the ASPICE Level 2 or the equivalent.

To win the certification, SK hynix combined its digital transformation technology with Siemens’ certification solution, which helped result in optimization and success of a stable and efficient system for the overall research and development process ranging from design of software for vehicles and engineering of products to workflow.

The latest achievement follows obtainment of an ISO 26262: 2018 FSM(Functional Safety Management**) in November 2021 as SK hynix continues to deliver accomplishments in the automotive memory business with commitment to safety and reliability.

** ISO 26262: 2018 FSM(Functional Safety Management): An international standard for functional safety in automotive semiconductors set by the International Organization for Standardization.

SK hynix will now aim for the ASPICE Level 3 certification with a more advanced software development process.

“Our achievement comes at a time when product competitiveness of automotive memory solution is more important than ever,” Ahn Hyun, head of solution development, said. “We will aim higher and continue our efforts for development and stronger product competitiveness of automotive memory chips.”

About SK hynix Inc.

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

Source: SK hynix Inc.

PR Newswire

INFiLED shines at InfoComm2023 with its latest EZ2.6, Atlas-X and other quality products

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SHENZHEN, China, June 16, 2023 /PRNewswire/ — On June 14th, INFiLED, a leading enterprise in the LED display industry participated in InfoComm2023, North America’s largest exhibition for the ProAV industry, held at the Orange County Convention Center in Orlando, Florida.

At booth 1624, INFiLED showcased an array of quality products suitable for both indoor and outdoor installations, including fine-pixel-pitch screens and LED panel samples. Moreover, INFiLED’s product specialists provided consulting services to visitors to help them achieve their desired display solutions.

Among the outdoor displays presented by INFiLED was its latest EZ2.6 series for DOOH, featuring energy-saving technology, with a maximum power consumption of only 210W/panel; and a high contrast ratio of 26,700:1, ensuring that bright areas were not overexposed and details in shadows were rendered well when playing content.

An EZ series screen exhibited at the INFiLED booth
An EZ series screen exhibited at the INFiLED booth

Also on exhibit was the Atlas-X series, recently co-developed by INFiLED and PRG. This series supported ±10°concave-convex screen settings, and the connection angle between its cabinets can be quickly changed through cassettes and curving connectors (optional accessories) that can be arranged flexibly; besides, the cabinets were equipped with hidden suspension hooks and vertical locking systems to facilitate screen installation.

In addition to Atlas-X, another incredible LED display for events, the Titan-X series screen, INFiLED’s innovative visual solution for outdoor events also appeared at this exhibition. With up to 70% transparency, it can present stunning visual effects without obstructing the scenery behind the screen; moreover, it featured an extremely stable frame that can withstand winds of 20 m/s.

A Titan-X series screen was shown on the left of the picture and a cart with the Atlas-X series cabinets on the right
A Titan-X series screen was shown on the left of the picture and a cart with the Atlas-X series cabinets on the right

As for indoor displays, above booth 1624, a 5m*2m XII series curved screen was installed. It had a pixel pitch of only 2.6mm, a high refresh rate of 3840Hz, and excellent color representation. The series can be used in retail stores, houses of worship, airport terminals, and other indoor spaces, as to provide an enjoyable viewing experience for viewers.

An XII Series screen above INFiLED’s booth
An XII Series screen above INFiLED’s booth

At the booth, there was also a curved screen with a resolution of 2880*1152 consisting of the XII series and the EZ series. Its flat-to-arc transition was smooth, and the display parameters of the two series used in it could be adjusted to the same. This screen was designed to show visitors unexpected great display solutions achieved by combining different INFiLED products.

A curved screen consisting of the XII series and the EZ series was shown on the left side of the picture, and a DB series screen was on the right
A curved screen consisting of the XII series and the EZ series was shown on the left side of the picture, and a DB series screen was on the right

In terms of indoor fine-pixel-pitch products, INFiLED exhibited an impressive DB1.5 Pro series screen. It was a great choice for virtual production studios and beyond. With 16-bit grayscale and HDR technology, it can accurately present content details of extremely bright and dark scenes, realizing natural and realistic image output.

The indoor screens on display also included a WT0.9 series screen. The product adopted COB encapsulation technology, which ensured its LED panels have good heat dissipation and minimum light decay; besides, it had excellent surface protection as well, to prevent its LED beads from being damaged during transportation or installation.

A WT series screen set up at the INFiLED booth
A WT series screen set up at the INFiLED booth

Aside from the above-mentioned exhibits, other quality products exhibited by INFiLED comprised WP series screens applicable for meeting rooms, as well as single panels including AR 3.9, HR1.56, DB2.6.

About INFiLED

INFiLED is an international high-tech enterprise specializing in the R&D and manufacturing of large-scale LED displays. INFiLED’s products were exported to 87 countries and applied in various fields including DOOH, live events, sports, retail, corporate, and so forth. Focusing on independent innovation and continuous improvement, INFiLED is striving to be the best in the LED screen industry to enlighten the world with a visual feast.

CONTACT: info@infiled.com

PR Newswire

Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports

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MILPITAS, Calif., June 7, 2023 /PRNewswire/ — Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report. Quarter-over-quarter billings slipped 3%. 

“Semiconductor equipment revenue in the first quarter was robust despite macroeconomic headwinds and a challenging industry environment,” said Ajit Manocha, SEMI president and CEO. “The fundamentals remain healthy for the long-term strategic investments needed to support major technology advancements for AI, automotive, and other growth applications.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

Region

1Q2023

4Q2022

1Q2022

1Q (QoQ)

1Q (YoY)

Taiwan

6.93

7.98

4.88

-13 %

42 %

Mainland China

5.86

6.36

7.57

-8 %

-23 %

Korea

5.62

5.80

5.15

-3 %

9 %

North America

3.93

2.60

2.62

51 %

50 %

Japan

1.90

2.25

1.90

-16 %

0 %

Europe

1.52

1.46

1.28

4 %

19 %

Rest of the World

1.06

1.32

1.29

-20 %

-18 %

Total

26.81

27.78

24.69

-3 %

9 %

Sources: SEMI (www.semi.org) and SEAJ (www.seaj.or.jp), June 2023

Note: Summed subtotals may not equal the total due to rounding.

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at mktstats@semi.org. More details are also available on the SEMI Market Data webpage.  

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

PR Newswire

EV Group and Dymek Company Form Joint Venture Company in Malaysia to Enhance Regional Customer Support

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ST. FLORIAN, Austria and HONG KONG, May 23, 2023 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Dymek Company, an advanced equipment distributor for the semiconductor, biomedical, data storage, photovoltaic and aerospace industries, today announced that they have established a new joint venture company in Malaysia.

The new company, called EV Group Malaysia Dymek Sdn. Bhd., will be charged with managing EVG’s customer support operations in Malaysia. Hermann Waltl, executive sales and customer support director and member of the executive board at EVG, will serve as director of the new joint venture, and Sean Lim from Dymek will serve as managing director of the new joint venture.

EV Group Malaysia Dymek is located at 70-3-31, D’Piazza Mall, Jalan Mahsuri, 11900 Bayan Lepas, Penang, Malaysia.

Working closely with EVG’s headquarters, EV Group Malaysia Dymek will be responsible for numerous key regional customer support activities, including equipment installation, technical service and support, spare parts management and supply, and process development support. The company will be fully operational in July 2023.

“Malaysia has been an important center for semiconductor and microelectronics packaging, test and assembly for several decades. As global investments from leading chip manufacturers and outsourced semiconductor assembly and test companies in the region continue to ramp up, it is vital that EVG strengthen its customer support infrastructure here as well,” stated Hermann Waltl. “Dymek has been a key strategic partner for EVG in several countries in Asia already for many years, and we look forward to partnering with them to enhance our customer support in Malaysia as well.”

“This strategic move by EV Group to establish a more direct presence in Malaysia will be well-received by the semiconductor and microelectronics industries of Southeast Asia. Companies here already recognize EVG as a market and technology leader in semiconductor process equipment, and now knowing they can receive local support from local engineers will only further increase their confidence and trust in EVG,” stated Stanley Lam, managing director, Asia Pacific, at Dymek Company. “We are pleased to be working closely with EVG to grow and enhance their customer support infrastructure in Malaysia and across Southeast Asia.”

See EVG at SEMICON Southeast Asia
EVG is a sponsor and program speaker at SEMICON Southeast Asia, taking place May 23-25 at the Setia SPICE Convention Centre in Penang, Malaysia. Attendees interested in learning more about EVG’s latest developments in heterogeneous integration are welcome to attend the Advanced Packaging Forum on Wednesday, May 24 at 15:00 to see Dr. Thorsten Matthias, regional sales director Asia-Pacific for EVG, present on state of the art and upcoming requirements in wafer-to-wafer and die-to-wafer hybrid bonding.

About Dymek Company
Dymek Company Ltd was established in 1989 and is an advanced equipment distributor to leading manufacturers and innovative R&D facilities in the Aerospace, Biomedical, Semiconductor, Data Storage, and Photovoltaic industries. In the early 2000s, Dymek expanded from our headquarters in Hong Kong throughout Southeast Asia and China in order to meet the diverse needs of our customers. In today’s globalized marketplace, it is standard for our customers to have integrated supply chains that link countries across Asia Pacific, and our expert staff is prepared to meet them wherever they are and connect them with industry-leading equipment from around the world. More information about Dymek is available at www.dymek.com.

About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

Dymek Contact:
Dow Wang
Marketing Manager
Dymek Company Ltd
Tel: +60 4 641 5536
E-mail: marketing@dymek.com

EV Group Contacts:

Clemens Schütte 

David Moreno

Director, Marketing and Communications

Principal

EV Group

Open Sky Communications

Tel: +43 7712 5311 0 

Tel: +1.415.519.3915

E-mail: Marketing@EVGroup.com 

E-mail: dmoreno@openskypr.com 
PR Newswire

LG Display Recognized for Pioneering Research on Ultra-large OLED and Stretchable Displays at SID 2023

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SEOUL, South Korea, May 21, 2023 /PRNewswire/ — LG Display, the world’s leading innovator of display technologies, announced today that two of its research papers on ‘ultra-large OLED display’ and ‘Stretchable display’ have been selected as Distinguished Papers by the Society for Information Display (SID).

LG Display's Third Generation OLED TV Panel
LG Display’s Third Generation OLED TV Panel

Under the theme of ‘A Novel Ultra-Large Size OLED Display for Premium TVs,’ LG Display’s research team led by Dr. Hong-jae Shin, research fellow, received the Excellence Paper Award for introducing the key technologies that enabled ultra-large OLED displays of 80 inches and above. With this award, LG Display has been recognized once again for its leadership in OLED innovation.

LG Display's Stretchable Display
LG Display’s Stretchable Display

LG Display led the development of a series of ultra-large OLED TV panels by addressing the challenge of uniformly expressing high-quality images on larger screens, advancing panel and driving technologies, improving the performance of organic light-emitting components, and minimizing bezels.

Following on from the 88-inch 8K OLED TV panel released in 2018, the company commenced the production of its largest 97-inch OLED TV panels last year to offer a full lineup ranging from medium-sized to ultra-large OLED displays. LG Display is the only company with capability of mass-producing ultra-large OLED panels of 80 inches and above.

In addition, LG Display will introduce ‘META technology,’ its third-generation OLED TV panel technology, during SID 2023. These OLED panels realize the industry’s highest brightness of 2,100 nits (1 nit: the brightness of a single candle) among existing OLED TVs, making them the perfect solution for ultra-large TVs. Notably, these panels also demonstrate a remarkable 22 percent improvement in energy efficiency.

Another research team led by Precedence Technology Laboratory at LG Display was also awarded the Excellence Paper Award for the paper, ‘High-Resolution Active-Matrix Micro-LED Stretchable Displays.’ The Stretchable display is highly anticipated as a next-generation display technology courtesy of its ultimate free-form technology that enables it to be extended, folded, and twisted.

LG Display unveiled the industry’s first 12-inch Stretchable display last year that can be stretched by up to 20 percent while delivering full-color RGB and a high resolution of 100ppi (pixels per inch) comparable to standard monitors. This award-winning research has garnered recognition for significantly enhancing the resolution, flexibility, and reliability of stretchable displays, achieving substantial progress towards its commercialization.

LG Display will also present its latest research findings on new technologies during Display Week 2023 from May 21 to 26 at LA Convention Center. This will include the presentation of 15 research papers with significant findings regarding next-generation displays such as OLED and microLED.

LG Display also plans to unveil its latest cutting-edge technologies at SID 2023, including its new OLED technology and third-generation OLED TV panels based on ‘META Technology.’

“We will continue to maintain and expand our competitive advantage by developing cutting-edge displays that provide innovative customer value, particularly in the field of large-sized and high-resolution displays, thereby widening the technological gap between us and our competitors,” remarked Soo-young Yoon, CTO and Executive Vice President at LG Display.

About LG Display

LG Display Co., Ltd. [NYSE: LPL, KRX: 034220] is the world’s leading innovator of display technologies, including thin-film transistor liquid crystal and OLED displays. The company manufactures display panels in a broad range of sizes and specifications primarily for use in TVs, notebook computers, desktop monitors, automobiles, and various other applications, including tablets and mobile devices. LG Display currently operates manufacturing facilities in Korea and China, and back-end assembly facilities in Korea, China, and Vietnam. The company has approximately 69,656 employees operating worldwide. For more news and information about LG Display, please visit www.lgdisplay.com.

Media Contact:
Joo Yeon Jennifer Ha, Manager, Global PR Team 
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PR Newswire

USI Launches PCle Gen.5 Mass Production Testing Platform Solution To Boost The Solid-State Drive Industry

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SHANGHAI, May 15, 2023 /PRNewswire/ — With the accelerating popularity of PCIe Gen.5 technology, high-speed data transfer and low latency have become essential application requirements for industries such as gaming, data centers and cloud computing, high-performance computing, artificial intelligence and machine learning, as well as automotive and aerospace. To meet the urgent need of these industries to build product ecosystems supporting this interface, USI has launched its self-developed PCIe Gen.5 mass production test platform solution. As a well-known enterprise with 17 years of expertise in solid-state drive (SSD) products, USI provides end-to-end services from R&D, validation to mass production, and is renowned for its top product quality in the industry. The launch of the PCIe Gen.5 mass production test platform solution demonstrates USI’ technical strength and innovative capabilities in this field.

The transfer rate of PCIe Gen.5 doubles to 32GT/s compared to the previous generation, which requires more stringent signal transmission and the technology supporting ecosystem is not yet complete. The mass production test platform must have stricter design and validation for the controller, PCB material, wire length, signal path, connector, and software settings, resulting in significantly increased development cycle time, technical risk, and cost. Currently, there are just few solutions in the market that support PCIe Gen.5 testing, which are costly, with long lead time, and the supply from foreign manufacturers is limited. USI launches its self-developed mass production test platform solution to address these challenges.

USI’s SSD generic production testing solution has many advantages. The platform is deployed in a standard rack and has a modular design, with testing port modules added or removed as needed. A single cabinet supports testing for 80 U.2 drives or 40 AIC drives, with a single port supporting up to 150W power consumption. The platform also supports all ports running at full PCIe Gen.5 speed simultaneously, with voltage and current measurement and protection, skew testing, hot-swapping, unified platform software management, software upgrades, platform self-verification, flexible capacity configuration options, and affordable total operating costs for the testing platform. These features will provide customers with a more efficient, stable, and flexible testing solution.

Jaguar Meng, PM of Storage Array & Interconnect PLM of USI, said “USI’s self-developed mass production testing platform solution will provide efficient, stable, and flexible testing support for the PCIe Gen.5 industry. In addition, USI also provides customized support based on a generic testing plan. With its intellectual property in the product, we can provide customized PCIe Gen.5 interface product mass production support such as custom interfaces, temperature variation environments, and mass production testing program development based on customers’ specific needs. This will greatly improve users’ production efficiency, reduce technical risks, and enhance product competitiveness.”

This solution showcases USI’s technical strength and innovation in the solid-state drive (SSD) industry and is a testament to the company’s continuous exploration of technology bottlenecks and innovative solutions. With USI’s generic testing solution and customized support, the company will become a reliable partner for PCIe Gen.5 interface production testing, making an important contribution to the development of the entire industry.

About USI (SSE: 601231)

USI, Universal Scientific Industrial (Shanghai) Co., Ltd., is a global leader in electronic design and manufacturing as well as a leader in the field of SiP (System-in-Package) modules. USI provides D(MS)2 product services: Design, Manufacturing, Miniaturization, Industrial software and hardware Solutions, and material procurement, logistics and maintenance Services. With Asteelflash, USI has 28 sales, production and service locations across four continents of Asia, Europe, Americas and Africa, and offers customer diversified products in the sectors of wireless communication, computer and storage, consumer, industrial, medical and automotive electronics worldwide. USI is a subsidiary of ASE Technology Holding Co., Ltd. (TWSE: 3711, NYSE: ASX). To learn more, please visit www.usiglobal.com and engage with us on LinkedIn and YouTube.

PR Newswire

Supermicro Leads the Industry with the First Eight-Socket and Four-Socket Servers for the Most Demanding Enterprise, Database, and Mission-Critical Workloads, Based On Intel CPUs

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With Up To 480 Cores, 32TB of Memory, and 12 GPUs, These Systems Can Power Generative AI on SAP and Oracle Workflows in Real Time

SAN JOSE, Calif., May 10, 2023 /PRNewswire/ — Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is introducing the most powerful server in its lineup for large-scale database and enterprise applications. The Multi-Processor product line includes the 8-socket server, ideal for in-memory databases requiring up to 480 cores and 32TB of DDR5 memory for maximum performance. In addition, the product line includes a 4-socket server, which is ideal for applications that require a single system image of up to 240 cores and 16TB of high-speed memory. These powerful systems all use 4th Gen Intel Xeon Scalable processors. Compared with the previous generation of 8-socket and 4-socket servers, the systems have 2X the core count, 1.33X the memory capacity, and 2X the memory bandwidth. Also, these systems deliver up to 4X the I/O bandwidth compared to previous generations of systems for connectivity to peripherals. The Supermicro 8-socket system has attained the highest performance ratings ever for a single system based on the SPECcpu2017 FP Rate benchmarks, for both the base and peak results. In addition, the Supermicro 8-socket and 4-socket servers demonstrate performance leadership on a wide range of SPEC benchmarks. Learn more about the SPEC benchmarks at: http://www.spec.org.

Versatile New 8-Socket and 4-Socket Servers for Scale-up Applications
Versatile New 8-Socket and 4-Socket Servers for Scale-up Applications

“We continue to address the needs of our enterprise customers with our new 8-socket and 4-socket servers, the largest and most powerful servers in the industry today,” said Charles Liang, president, and CEO of Supermicro. “We are addressing the needs of the most demanding organizations worldwide, who require the simplicity and serviceability of a single system with up to 480 cores, 32TB of memory, and up to 12 NVIDIA H100 Tensor Core GPUs in a single enclosure. Our new 8-socket systems lead the entire industry in both floating point and integer performance for large MP systems. With our Building Block Solutions approach to server design allows us to bring a wide range of servers to market faster, from the edge to the corporate data center. Supermicro now delivers Rack Scale Solutions for our customers worldwide without constraints.”

Learn more about Supermicro X13 Multi-Processor Servers at: https://www.supermicro.com/en/products/mp?pro=generation_new%3DX13

Both the 8-socket and 4-socket servers have been certified for SAP HANA and Oracle Database and Applications. The large memory pools available to these systems allow superior SAP and Oracle performance as all workloads are scaled up in a single node without the latency of horizontally scaling across networks. In addition, the 4-socket system can host two double-width GPUs while the 8-socket system can host up to 12 double-width GPUs allowing for real-time or batch AI training and inferencing against SAP and Oracle datasets. The versatility and expandability of these systems futureproof  SAP and Oracle deployments for rapidly evolving generative AI automation of ERP workflows.

The new 8-socket and 4-socket servers reduce complexity when creating a high-performance data center for enterprise applications, such as Artificial Intelligence (AI), Databases, Analytics, Business Intelligence, ERP, CRM, and Scientific Visualization workloads. By bringing massive amounts of computing, memory, and storage resources together within a single instance of the operating system, the management of the system is reduced, as is the networking to other servers. The specifications of the two new systems:

  • SYS-681E-TR: Up to TDP 350W, 480 Cores, 32TB of DDR5 Memory, 12 Double-Wide GPUs and 24x 2.5″ Drives, 6U
  • SYS-241H-TNRTTP: Up to TDP 350W, 240 Cores, 16TB of DDR5 Memory, 4 Single-Wide GPUs and 8x 2.5″ Drives, 2U
  • SYS-241E-TNRTTP: Up to TDP 185W, 96 cores, 16TB of DDR5 Memory, 2 Double-Wide GPUs and 24x 2.5″ Drives, 2U

“Supermicro is a leader in developing scale-up systems that use the 4th Gen Intel Xeon Scalable processors. These systems are designed to accelerate enterprise applications with hundreds of cores and terabytes of memory,” stated Greg Ernst, Intel Americas corporate vice president and general manager. “We work closely with Supermicro to deliver innovative systems for large scale applications.”

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are transforming into a Total IT Solutions provider with server, AI, storage, IoT, and switch systems, software, and services while delivering advanced high-volume motherboard, power, and chassis products. The products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc. 

Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.

All other brands, names, and trademarks are the property of their respective owners.

Source: Super Micro Computer, Inc.