Tag Archives: SEM

FIRST Global, Title Sponsor Lam Research to Host the World’s Most International Innovation Challenge to Inspire Kids in STEM, Future Solutions for Climate Change

September 28, 2023 TechENT Syndication Leave a comment

Nearly 200 countries to compete in robotics at the 2023 FIRST Global Challenge in Singapore

WASHINGTON and FREMONT, Calif., Sept. 28, 2023 /PRNewswire/ — The 2023 FIRST Global Challenge will in a few weeks bring together thousands of teens from across the globe to compete in robotics and collaborate to find renewable energy solutions. Created and administered by FIRST Global and helped made possible by Title Sponsor Lam Research, the exciting four-day event is intended to encourage the next generation of innovators.

Students from around the world compete at 2022 FIRST Global Challenge. Photo courtesy of FIRST Global.

The 2023 FIRST Global Challenge will be held in Singapore from October 7-10, 2023. The event focuses on cultivating a passion for science, technology, engineering, and math (STEM) through competition and fun. Now in its seventh year, the Challenge continues to grow in size and scale. Under this year’s theme, “Hydrogen Horizons,” competing high school age students will learn about renewable energy and sharpen their problem-solving skills. With nearly 200 countries competing, the event is the most multinational innovation competition in the world, according to FIRST Global.

“The 2023 FIRST Global Challenge is more than a robotics and STEM challenge, it’s a springboard to inspire curiosity, the innovative spirit, and the understanding of what’s possible when we work together,” said Dean Kamen, founder of FIRST Global. “We are thrilled to bring the FIRST Global Challenge to Singapore. This year, the event is of particular importance as it centers on revolutionizing renewable energy — one of the world’s most pressing problems.”

Powering Breakthroughs Together

Lam, a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, believes that increasing the pipeline of future talent in technology is not only critical to driving the future of semiconductors but also enabling the world to tackle its biggest challenges.

“As we continue to transform the world through technology, we are committed to taking an active role in inspiring and empowering the next generation to help create a better world,” said Stacey MacNeil, chief communications officer and group vice president of ESG at Lam Research. “The FIRST Global Challenge provides life-changing learning experiences for competing students, equipping them with the knowledge and skillsets needed to succeed in the innovation workforce of the future.”

The company has pledged a $10 million donation* to FIRST Global, providing critical funding to support FIRST Global’s mission to expand access to STEM education and cultivate future global technology leaders. The Lam donation is the company’s most significant gift since unveiling its social impact platform, Powering Breakthroughs Together, in 2022. This year, Lam has also provided over 30 mentors worldwide for competing teams, helping to ensure every youth team has an opportunity to thrive at the event.

Teens to Collaborate on Robotics and Develop New Renewable Energy Solutions

During the FIRST Global Challenge, each team will put their unique robot built for the competition to the test in a series of matches and challenges related to renewable energy. Robots will be navigated through a game environment which represents the process of hydrogen energy development. Each team’s robot will score points by producing hydrogen and then storing, transporting, and converting energy. Teams will work together in randomly selected multi-country alliances to score points, thereby encouraging global cooperation and collaborative innovation.

FIRST Global teams will also compete in an innovation competition known as the New Technology Experience (NTE). Under the NTE theme “Energy Evolution,” teams are guided to understand all types of renewable energy, including hydrogen technologies. FIRST Global teams will then research and develop their own innovative solutions to advance the implementation of and improve access to renewable energy.

More information on the 2023 FIRST Global Challenge can be found at first.global.

Media Resources:

About FIRST Global
FIRST Global’s mission is to inspire science and technology leadership and innovation in youth from all nations in order to increase understanding, instill the importance of cooperation, address the world’s most pressing issues, and improve quality of life for all. Bringing these future STEM leaders together in an engaging and collaborative competition drives home the importance, excitement, and applicability of STEM education and demonstrates that they can work together — even in competition — to find solutions to the world’s greatest challenges. Learn more at first.global.

About Lam Research
Lam Research Corporation (NASDAQ: LRCX) is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam’s equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com.

*Contribution to be distributed over a three-year period, from 2023-2025.

FIRST Global Media Contact:
Matt Stalford
press@first.global
+1 (484) 574-2660

Lam Research Media Contact:
Laura Bakken
laura.bakken@lamresearch.com
+1 (510) 572-9021

PR Newswire

Mouser Electronics Receives Fifth Consecutive APAC e-Catalogue Distributor of the Year Award from Molex

September 6, 2023 TechENT Syndication Leave a comment

SHANGHAI, Sept. 6, 2023 /PRNewswire/ — Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, proudly announces that it has received the esteemed APS e-Catalogue Distributor of the Year award from Molex. Mouser received the award in recognition of increased customer count, fastest point-of-sale (POS) growth, inventory management, and overall operational excellence across the Asia Pacific (APAC) region in 2022. Mouser previously won the award for performance in 2021, 2020, 2019, and 2018. Earlier this year, Mouser also received Molex’s Global High Service Distributor of the Year award for the sixth consecutive year.

“We are thrilled to present the Mouser APAC team with this award for the fifth-straight year,” stated Fred Bell, Vice President of Global Distribution at Molex. As a vital component of our business strategy, high-service distribution is paramount, and Mouser’s unparalleled performance and exceptional service truly set them apart. Congratulations to the entire Mouser team on this achievement.”

“We are truly delighted to receive this prestigious award from Molex. Our partnership with Molex is highly valued, and we are committed to providing best-in-class service, fostering innovation, and promoting collaboration to meet the diverse needs of our customers. We eagerly look forward to building on this success and achieving even greater milestones in the coming years.” said Daphne Tien, Vice President of Marketing and Business Development for Mouser APAC.

Mouser provides design engineers with access to over 31,000 Molex products in stock and ready for shipment. To learn more, visit https://www.mouser.com/manufacturer/molex/.

For a comprehensive archive of technical articles, infographics, videos and more from Molex, go to https://molex.mouser.com/.

About Mouser Electronics

Mouser Electronics, a Berkshire Hathaway company, is an authorized semiconductor and electronic component distributor focused on New Product Introductions from its leading manufacturer partners. Serving the global electronic design engineer and buyer community, the global distributor’s website, mouser.com, is available in multiple languages and currencies and features more than 6.8 million products from over 1,200 manufacturer brands. Mouser offers 27 support locations worldwide to provide best-in-class customer service in local language, currency and time zone. The distributor ships to over 650,000 customers in 223 countries/territories from its 1 million-square-foot, state-of-the-art distribution facilities in the Dallas, Texas, metro area. For more information, visit https://www.mouser.com/.

PR Newswire

Focusing on High-performance Advanced Packaging and Global Layout, JCET Achieved Quarter-on-Quarter Growth in Q2 2023

August 25, 2023 TechENT Syndication Leave a comment

Q2 2023 Financial Highlights:

Revenue was RMB 6.31 billion, an increase of 7.7% quarter-on-quarter.
Generated RMB 1.19 billion cash from operations. With net capex investments of RMB 0.75 billion, free cash flow for the quarter was RMB 0.44 billion.
Net profit was RMB 0.39 billion, an increase of 250.8% quarter-on-quarter.
Earnings per share was RMB 0.22, as compared to RMB 0.39 in Q2 2022.

1H 2023 Financial Highlights:

Revenue was RMB 12.17 billion.
Generated RMB 2.42 billion cash from operations. With net capex investments of RMB 1.56 billion, free cash flow for the first half of 2023 was RMB 0.86 billion.
Net profit was RMB 0.5 billion.
Earnings per share was RMB 0.28, as compared to RMB 0.87 in 1H 2022.

SHANGHAI, Aug. 25, 2023 /PRNewswire/ — Today, JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, announced its financial results for the first half year of 2023. The financial report shows that in the first half of 2023, JCET achieved revenue of RMB 12.17 billion, and net profit of RMB 0.5 billion. In Q2 2023 JCET achieved revenue of RMB 6.31 billion, an increase of 7.7% quarter-on-quarter, and net profit of RMB 0.39 billion, an increase of 250.8% quarter-on-quarter.

In the first half of 2023, the global semiconductor industry was in the fluctuating stage of bottoming out and rebounding. JCET adhered to high-performance advanced packaging technologies and product development mechanism, focusing on solutions for emerging applications such as high performance computing and storage, enhanced strategic layout of production capacity, and further strengthened its market position in the global IC industry.

JCET continues to enhance its technological innovation, with R&D investment of RMB 0.67 billion in the first half of this year, a year-on-year increase of 5.0%. The company’s multi-dimensional fan-out heterogeneous integration solution XDFOI™ for 2.5D/3D packaging achieved HVM, providing high-performance chiplet package solutions and production capacity for global customers. In collaboration with multiple customers in the field of high-density SiP technology, JCET has achieved the development and mass production of multiple RFFE modules and AiP modules in the 5G millimeter-wave market. The company is intensifying its market exploration in sectors such as automotive electronics, industrial electronics, and high-performance computing. During the reporting period, revenue from automotive electronics achieved a year-on-year growth of 130%. The company has established a subsidiary with controlling stake in the Lingang New Area of Shanghai, reinforcing its strategic capacity layout in the field of automotive electronics.

In addition, the company has optimized various operational expenses and asset structures, maintaining a stable cash flow capability. It has achieved positive free cash flow for 15 consecutive quarters.

While pursuing its own development, JCET actively engages in philanthropic efforts, contributing to society in areas such as health and environmental protection, disaster relief during floods, and science popularization initiatives.

Mr. Li Zheng, CEO of JCET, said, “JCET has always centered its focus on customers, and achieved quarter-on-quarter growth in performance for the second quarter of this year. Looking ahead, the direction of high-performance advanced packaging technology driving the innovation of the IC industry has become increasingly clear. JCET remains committed to achieving high-quality development through professional and international management, and will continue to create value for investors and the IC industry.”

For more information, please refer to the JCET 1H FY2023 Report.

About JCET Group

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in China and around the world.

CONSOLIDATED BALANCE SHEET (Unaudited)		RMB in millions

	Jun 30, 2023		Dec 31, 2022
ASSETS
Current assets
Currency funds	5,352		2,459
Trading financial assets	2,006		4,316
Derivative financial assets	0		18
Accounts receivable	3,545		3,689
Receivables financing	105		59
Prepayments	127		110
Other receivables	63		61
Inventories	3,003		3,152
Other current assets	251		279
Total current assets	14,452		14,143
Non-current assets
Long-term receivables	41		40
Long-term equity investments	744		765
Other equity investments	456		440
Investment properties	87		89
Fixed assets	19,574		19,517
Construction in progress	710		807
Right-of-use assets	567		578
Intangible assets	483		483
Goodwill	2,293		2,210
Long-term prepaid expenses	22		28
Deferred tax assets	274		247
Other non-current assets	106		61
Total non-current assets	25,357		25,265
Total assets	39,809		39,408

LIABILITIES AND EQUITY	Jun 30, 2023		Dec 31, 2022
Current liabilities
Short-term borrowings	1,211		1,174
Derivative financial liabilities	2		0
Notes payable	215		339
Accounts payable	4,603		4,634
Contract liabilities	273		214
Employee benefits payable	689		984
Taxes and surcharges payable	158		210
Other payables	396		378
Current portion of long-term liabilities	2,857		3,096
Other current liabilities	4		4
Total current liabilities	10,408		11,033
Non-current liabilities
Long-term borrowings	3,013		2,721
Lease liabilities	549		562
Long-term employee benefits payable	11		14
Deferred income	362		340
Deferred tax liabilities	14		40
Other non-current liabilities	41		55
Total non-current liabilities	3,990		3,732
Total liabilities	14,398		14,765
Equity
Paid-in capital	1,787		1,780
Capital reserves	15,265		15,080
Accumulated other comprehensive income	750		400
Specialized reserves	2		0
Surplus reserves	229		229
Unappropriated profit	7,292		7,154
Total equity attributable to owners of the parent	25,325		24,643
Minority shareholders	86		0
Total equity	25,411		24,643
Total liabilities and equity	39,809		39,408

CONSOLIDATED INCOME STATEMENT (Unaudited)			RMB in millions, except share data

	Three months ended		Six months ended
	Jun 30, 2023	Jun 30, 2022	Jun 30, 2023	Jun 30, 2022
Revenue	6,313	7,455	12,173	15,594
Less: Cost of sales	5,359	6,107	10,525	12,706
Taxes and surcharges	27	27	47	43
Selling expenses	51	48	100	97
Administrative expenses	175	236	347	494
Research and development expenses	360	315	669	638
Finance expenses	(7)	(8)	51	15
Including: Interest expenses	68	49	131	92
Interest income	27	9	35	16
Add: Other income	40	26	73	83
Investment income / (loss)	(24)	28	(21)	40
Including: Income / (loss) from investments in associates and joint ventures	(10)	(2)	(21)	(7)
Gain / (loss) on changes in fair value of financial assets/liabilities	37	(17)	46	(14)
Credit impairment (loss is expressed by “-“)	(6)	2	(1)	(5)
Asset impairment (loss is expressed by “-“)	(5)	(65)	0	(64)
Gain / (loss) on disposal of assets	13	9	16	23
Operating profit / (loss)	403	713	547	1,664
Add: Non-operating income	2	1	3	6
Less: Non-operating expenses	0	1	4	1
Profit / (loss) before income taxes	405	713	546	1,669
Less: Income tax expenses	19	31	50	126
Net profit / (loss)	386	682	496	1,543
Classified by continuity of operations
Profit / (loss) from continuing operations	386	682	496	1,543
Classified by ownership
Net profit / (loss) attributable to owners of the parent	386	682	496	1,543
Net profit / (loss) attributable to minority shareholders	0	0	0	0
Add: Unappropriated profit at beginning of period	7,264	5,196	7,154	4,335
Less: Cash dividends declared	358	356	358	356
Unappropriated profit at end of period (attributable to owners of the parent）	7,292	5,522	7,292	5,522
Other comprehensive income, net of tax	481	419	350	386
Comprehensive income attributable to owners of the parent	481	419	350	386
Comprehensive income not be reclassified to profit or loss	6	0	17	0
Remeasurement gains or losses of a defined benefit plan	0	0	1	0
Change in the fair value of other equity investments	6	0	16	0
Comprehensive income to be reclassified to profit or loss	475	419	333	386
Comprehensive income using the equity method that may be reclassified to profit or loss	0	(7)	0	(7)
Cash flow hedge reserve	0	(13)	0	(18)
Exchange differences of foreign currency financial statements	475	439	333	411
Total comprehensive income	867	1,101	846	1,929
Including:
Total comprehensive income attributable to owners of the parent	867	1,101	846	1,929
Total comprehensive income attributable to minority shareholders	0	0	0	0
Earnings per share
Basic earnings per share	0.22	0.39	0.28	0.87
Diluted earnings per share	0.22	0.39	0.28	0.87

CONSOLIDATED CASH FLOW STATEMENT (Unaudited)				RMB in millions

	Three months ended		Six months ended
	Jun 30, 2023	Jun 30, 2022	Jun 30, 2023	Jun 30, 2022
CASH FLOWS FROM OPERATING ACTIVITIES
Cash receipts from the sale of goods and the rendering of services	6,178	8,184	13,162	16,999
Receipts of taxes and surcharges refunds	122	32	216	147
Other cash receipts relating to operating activities	110	62	163	132
Total cash inflows from operating activities	6,410	8,278	13,541	17,278
Cash payments for goods and services	4,069	5,766	8,454	11,612
Cash payments to and on behalf of employees	878	1,060	2,072	2,309
Payments of all types of taxes and surcharges	254	314	466	501
Other cash payments relating to operating activities	22	93	128	171
Total cash outflows from operating activities	5,223	7,233	11,120	14,593
Net cash flows from operating activities	1,187	1,045	2,421	2,685
CASH FLOWS FROM INVESTING ACTIVITIES
Cash receipts from returns of investments	4,350	4,160	8,280	5,160
Cash receipts from investment income	38	32	52	38
Net cash receipts from disposal of fixed assets, intangible assets and other long-term assets	7	8	32	34
Net cash receipts from disposal of subsidiaries and other business units	0	(1)	0	27
Total cash inflows from investing activities	4,395	4,199	8,364	5,259
Cash payments to acquire fixed assets, intangible assets and other long-term assets	749	651	1,588	1,550
Cash payments for investments	3,200	4,310	5,980	5,960
Total cash outflows from investing activities	3,949	4,961	7,568	7,510
Net cash flows from investing activities	446	(762)	796	(2,251)
CASH FLOWS FROM FINANCING ACTIVITIES
Cash proceeds from investments by others	230	0	230	0
Including: Cash receipts from capital contributions from minority shareholders of subsidiaries	86	0	86	0
Cash receipts from borrowings	1,317	985	1,664	1,515
Total cash inflows from financing activities	1,547	985	1,894	1,515
Cash repayments for debts	755	988	1,740	1,734
Cash payments for distribution of dividends or profit and interest expenses	414	49	467	90
Other cash payments relating to financing activities	16	446	48	589
Total cash outflows from financing activities	1,185	1,483	2,255	2,413
Net cash flows from financing activities	362	(498)	(361)	(898)
EFFECT OF EXCHANGE RATE CHANGES ON CASH AND CASH EQUIVALENTS	45	59	37	57
NET INCREASE IN CASH AND CASH EQUIVALENTS	2,040	(156)	2,893	(407)
Add: Cash and cash equivalents at beginning of period	3,306	2,512	2,453	2,763
CASH AND CASH EQUIVALENTS AT END OF PERIOD	5,346	2,356	5,346	2,356

PR Newswire

DEEPX Strengthens Commitment to the Greater China Market by Showcasing its AI Chip Solutions at ELEXCON 2023

August 22, 2023 TechENT Syndication Leave a comment

– Market research firm IDC predicts that 56% of IT devices sold in China will be equipped with AI engines by 2026, and DEEPX will launch products in time to meet the mass production schedule of multiple IT devices.

– DEEPX unveils total solutions based on its AI semiconductor source technology and a live demonstration of its M.2 module on the open embedded platform Orange Pi.

– “DEEPX will introduce compact camera and M.2 module products equipped with AI semiconductors to capture the Greater China market with world-class power and price competitiveness.”

SHENZHEN, China and SEOUL, South Korea, Aug. 22, 2023 /PRNewswire/ — DEEPX (CEO, Lokwon Kim), a company that develops original technology for artificial intelligence semiconductors, will participate in ‘ELEXCON 2023’, the largest electronics exhibition in Shenzhen, China, to showcase its technologies and products to the Greater China market and continue its full-scale efforts to enter the East Asian market.

DEEPX Strengthens Commitment to the Greater China Market by Showcasing its AI Chip Solutions at ELEXCON 2023

ELEXCON 2023 is a three-day international electronics exhibition held at the Shenzhen International Convention Center in Shenzhen, China, from August 23 to 25. Leading Chinese will attend exhibition set manufacturers Huawei, Tencent, Alibaba, and Baidu; North American semiconductor design solution partner (DSP) Mouser Electronics; leading Chinese telecommunications company China Mobile, and leading Chinese video equipment company Hikvision, as well as more than 600 global brands in AI and IoT, embedded systems, and autonomous vehicles, and more than 50,000 related technology professionals.

At the exhibition, DEEPX will showcase its four-chip product suite, DX-L1, DX-L2, DX-M1, and DX-H1, which are total solutions that cover a large portion of the Edge AI market. This product suite offers four total chip solutions to a wide range of applications, from small sensors to robots, home appliances, smart mobility, and edge servers. This range of products showcases DEEPX’s AI semiconductor technology excellence and creates various business opportunities. The company will also highlight a live demonstration of its M.2 modules running AI algorithms for robots by interfacing them with Orange Pi, an embedded board with a rich ecosystem.

According to market research firm IDC, half of the IT devices sold in the Chinese market in 2026 will be equipped with AI engines. By targeting this market, DEEPX expects to launch the world’s highest-performance AI semiconductors in mass production in 2024, align with the mass production lineups of IT device companies in 2025, and seize the opportunity to capture the huge market for edge AI in 2026.

To enter Greater China in earnest, in April, DEEPX partnered with Samsung Electronics’ exclusive distributor, CoAsia Electronics, and began a full-scale collaboration to enter the East Asian market, deploying business personnel in mainland China and Taiwan and promoting cooperation with potential customers. The company has more than 300 global customers with annual sales of approximately KRW 1 trillion. The company’s main sources of revenue are memory semiconductors and CMOS image sensors (CIS), which are essential components for machine vision systems and are compatible with the AI semiconductors developed by DEEPX. DEEPX expects many of CoAsia Elec’s current customers to require AI semiconductors.

In June, DEEPX participated in Computex Taipei 2023 in Taipei, Taiwan, and was recognized for its innovative source technology and commercial potential to lead the global market. In particular, the company won the Startup Terrace Awards and a USD 20,000 cash prize among 400 global startups at Computex Taipei Innovex 2023, a special pavilion for startups. For the fast-growing Greater China market, DEEPX will continue to meet customers locally by participating in the International AI Expo, the largest AI exhibition in Chongqing, China, in October.

“DEEPX plans to participate in various exhibitions and promotional activities held locally at least three to four times a year to preempt the AI semiconductor market in China and Taiwan, which will be important battlegrounds for AI semiconductor technology,” said Lokwon Kim, CEO of DEEPX. And then, “At the ‘2023 Computex Taipei’ exhibition, we received a good response from IT hardware OEMs and Greater China companies in AI application development. These potential customers praised DEEPX’s solution strategy consisting of four products as ▲highly responsive to various market needs and ▲highly mass-producible technology that can smoothly implement AI computation even in resource-constrained environments. In addition to mass-producing NPU chips, we will strengthen cooperation with Chinese and Taiwanese companies to proactively target the Greater China market by mass-producing AI applications that can be applied to the smart camera and AI hardware markets,” he said.

Elexcon 2023 Shenzhen International Electronics Show
-Date: August 23-25
-Place: Hall 1/9, Shenzhen World Exhibition & Convention Center
-DEEPX Booth: Hall 1, 1H51

About DEEPX

DEEPX is a leading AI semiconductor technology company dedicated to driving innovation in the rapidly evolving edge AI landscape. With their state-of-the-art AI chip product line, DEEPX aims to revolutionize industries such as robotics, smart cities, surveillance, and more. DEEPX is committed to establishing the industry standard for AI semiconductors worldwide through technological excellence, strategic collaborations, and a global outlook.

For media inquiries:
PR@deepx.ai
Homepage: https://deepx.ai/
LinkdIn: https://www.linkedin.com/company/deepx-corp/
YouTube: https://www.youtube.com/@deepx2692/

PR Newswire

Genes Tech Group Announces 2023 Interim Results

August 11, 2023 TechENT Syndication Leave a comment

Total revenue reached approximately NTD749.51 million, representing an increase of approximately 25.63%

Revenue from the the turnkey solutions increased by approximately 59.74% to approximately NTD 373.37 million

Basic earnings per share were NTD7.66 cents

2023 Interim Results Highlights

Total revenue reached approximately NTD749.51 million, representing an increase of approximately 25.63%
Total comprehensive income for the period attributable to owners of the Company amounted to approximately NTD76.34 million
Revenue from the turnkey solutions increased by approximately 59.74% to approximately NTD 373.37 million
Basic earnings per share were NTD7.66 cents

HONG KONG, Aug. 11, 2023 /PRNewswire/ — Genes Tech Group Holdings Co. Ltd (“Genes Tech Group” or “The Group”, Stock Code: 8257.HK) announces its interim results for the six months ended 30 June, 2023 (“During the period”). During the period, the Group recorded the total revenue of approximately NTD749.51 million, Total comprehensive income for the period attributable to owners of the Company amounted to approximately NTD76.34 million. Basic earnings per share were NTD7.66 cents.

During the period, revenue from the turnkey solutions amounted to approximately NTD373.37 million, representing an increase of approximately 59.74% as compared to the corresponding period of last year and accounting for approximately 49.81% of the Group’s total revenue. The revenue from trading of used SME and parts amounted to approximately NTD376.15 million, accounting for approximately 50.19% of the Group’s total revenue. During the period under review, revenue from the domestic business in Taiwan accounted for approximately 65.74% of the Group’s total revenue.

In 2023, the global semiconductor industry is facing a complicated operating environment affected by weak end market demand and continuous inventory adjustment. It denotes the start of a downward industrial cycle for the semiconductor market. According to the latest forecast report released by the World Semiconductor Trade Statistics (WSTS), due to the weak demand from smartphones and personal computers, the two major semiconductor downstream sectors, the global semiconductor sales forecast for 2023 is significantly revised downwards to USD515.095 billion, representing a decrease of 10.3% as compared to 2022, which is the first contraction since 2019. However, WSTS also points out that the demand in artificial intelligence (AI), industry, automotive electronics and other fields remains strong, which can make up for the weak demand for semiconductors in the consumer field. WSTS forecasts that global semiconductor sales will increase by 11.8% year-on-year to USD575.997 billion in 2024 and hitting a record high. According to the Semiconductor Equipment and Materials International (SEMI), it is estimated that global sales of SME by OEMs in 2023 will decrease to USD87.4 billion, representing a decrease of 18.6%. A strong rebound to USD100 billion is expected in 2024.

On the other hand, artificial intelligence (AI) will be a key area of the High-tech industry. The development and coopetition of the global semiconductor industry will remain in a state of change and complexity. The Group will pay close attention to the changes in the market environment, respond to market changes in a prudent and prompt manner to seize development opportunities, and actively explore market development opportunities.

Mr. Yang Ming-Hsiang, Chairman and Chief Executive Officer concluded: “In general, there is a differentiation in the consumer and industry, automotive electronics fields of the global semiconductor market. The growth in sectors including telecommunications, consumer electronics and data centers will slow down in the coming years due to the weak demand in the consumer sector caused by inflation and rising interest rates. Benefiting from the booming emerging industries such as new energy vehicles, autonomous vehicles (ADAS) industry, high performance computing (HPC), cloud infrastructure investment, industrial automation, artificial intelligence (AI), Internet of Things (“IoT”), metaverse and wearable devices, there will be a strong demand, driving a strong growth in automotive semiconductors and industrial semiconductors. The Group will increase its efforts in talent exploration, strengthen its innovation and R & D capabilities, and improve the core competitiveness of the Group to further expand market share and create long-term value for shareholders.

About Genes Tech Group Holdings Co. Ltd (Stock Code: 8257.HK)

Genes Tech Group Holdings Co. Ltd is turnkey solution provider and exporter of used SME and parts in Taiwan. Since the commencement of its business in 2009, the Group mainly engaged in providing turnkey solution of used SME and parts to its customers and modifying and/or upgrading the semiconductor equipment of its production systems according to customers needs. In addition, the Group is also engaged in the trading of used SEM and parts. The used SME and parts supplied by the Group included furnaces, clean tracks and other related items, which were used at the front-end of the semiconductor manufacturing process, wafer fabrication such as deposition, photoresist coating and development, and these were extensively applied in mobile phones, game consoles, DVD players, automotive sensors and other digital electronic products.

Source: Genes Tech Group Holdings Co. Ltd

PR Newswire

ChipMOS REPORTS JULY 2023 REVENUE

August 10, 2023 TechENT Syndication Leave a comment

HSINCHU, Aug. 10, 2023 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of July 2023. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$31.45 to US$1.00 as of July 31, 2023.

Revenue for the month of July 2023 was NT$1,836.2 million or US$58.4 million, representing an increase of 2.7% from June 2023, and a decrease of 5.7% from July 2022.

The Company noted the sequential growth reflects the continued improvement in loading levels of its DDIC high-end test platform, and initial signs of improvement in its Memory business entering the second half of 2023.

Consolidated Monthly Revenues (Unaudited)
	July 2023	June 2023	July 2022	MoM Change	YoY Change
Revenues (NT$ million)	1,836.2	1,788.1	1,948.0	2.7 %	-5.7 %
Revenues (US$ million)	58.4	56.9	61.9	2.7 %	-5.7 %

About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.

Forward-Looking Statements:
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the “SEC”) and in the Company’s other filings with the SEC.

Contacts:

Source: ChipMOS TECHNOLOGIES INC.

PR Newswire

Fibocom 5G R16-compliant Module FM160-EAU Achieved Telstra Certification, Closing the Digital Divide with Future-proof FWA Solution across Australia

August 3, 2023 TechENT Syndication Leave a comment

Recently, Fibocom has achieved certification from Telstra, the leading mobile network service provider in Australia, with its SDX62-empowered module FM160-EAU tested on Telstra’s 5G network, further verifying the capability of delivering superior and reliable connectivity service to local users.

SHENZHEN, China, Aug. 3, 2023 /PRNewswire/ — Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced that the 3GPP Release 16 compliant module FM160-EAU has achieved the Telstra certification. The module has been tested and verified on Telstra’s network to provide a high-performance 5G broadband service, driving the 5G adoption across industries such as FWA, security monitoring, and Industrial IoT in the regional market.

Broadband demand for regional and remote areas of Australian users has been growing rapidly, and FWA service is expected to cover more than 120,000 homes and business units by the end of 2024, according to Australia’s national broadband network (NBN). Meanwhile, 5G is empowered with extended capabilities as 3GPP standard evolves, therefore, it is crucial for FWA service providers to keep up with these advancements and bring an elevated experience for end users. The 5G Sub-6GHz module FM160-EAU is designed to provide an optimal 5G user experience with enhanced coverage, boosted throughput, and increased bandwidth. It is the ideal wireless solution for FWA service providers to bridge the gap of the digital divide by enabling gigabit connectivity for end devices such as CPE, ODU, mobile hot spot, USB dongles, etc.

Based on the Qualcomm Snapdragon® X62 modem chipset, FM160-EAU supports NR CA (Carrier Aggregation), and delivers ultra-fast speed of up to 3.5Gbps DL and 900Mbps UL, significantly optimizing the speed performance for those IoT applications that require high data throughput. In addition to hardware design, FM160-EAU packages in M.2 form factor and pin-compatible with Fibocom’s Release 15 module FM150, ensuring the smooth migration to advanced generations and minimizing the investment concerns. It is worth highlighting that FM160-EAU is capable of providing high-precision locating service with its built-in GNSS, and allows feasible customization on abundant functionalities such as digital audio, and industry-standard interfaces for the utilization of 5G applications.

“Validating the interoperability tests on Telstra’s mobile network and receiving the certification successfully signifies another breakthrough of Fibocom’s 5G strategy in the global market,” said Gene Santana, VP of Overseas Carriers Certification Department, Fibocom. “With the implementation of 5G infrastructure in the regional market, we hope to deliver the resilient, fast and secure FM160-enabled 5G FWA solution to the Australian market in collaboration with Telstra.”

Find out the latest news at www.fibocom.com, and follow us on LinkedIn/Twitter/Facebook/Youtube.

Media Contact: pr@fibocom.com

Source: Fibocom Wireless Inc.

PR Newswire

The 40,000 m2 High-End Storage R&D Complex of Longsys’s Shanghai HQ Successfully Topped Out, Gathering Innovative Forces

July 28, 2023 TechENT Syndication Leave a comment

SHENZHEN, China, July 28, 2023 /PRNewswire/ — On July 28, 2023, the topping out ceremony for Longsys’s Shanghai HQ project was successfully held in the Lin-gang Special Area of China (Shanghai) Pilot Free Trade Zone. Leaders from the Lin-gang Special Area Management Committee, Longsys team, and participating units such as project construction, supervision, and design jointly attended the ceremony.

Longsys’s Shanghai HQ is located at the core area of the Dishui Lake Science and Technology Innovation HQ Bay in the Lin-gang Special Area. The project was launched for construction in 2021, covering an area of about 2.3 acres, with a total construction area of about 43,000 m², which can accommodate more than 800 R&D personnel. The project will build an R&D and office complex, focusing on high-end storage product innovation, storage industry chain delivery, offshore cross-border business, and corporate brand culture display. It is expected to be completed before the end of 2024, and will play a crucial role on carrying Longsys’s long-term development strategy.

According to the plan, Longsys’s Shanghai HQ will build a number of R&D areas and labs, introduce cutting-edge technical supporting facilities, and focus on the R&D of enterprise, industry and automotive storage products and the design of memory chips, which are widely used in various fields, such as data centers, smart cars, smart grids, security monitoring, and industrial Internet of Things.

In the high-end product R&D areas, enterprise SSD storage and storage system software for large-scale computing such as data centers, as well as large-capacity UFS memory chips that comply with the automotive and industry reliability standards will be developed to empower high-performance and high-reliability storage applications. In the memory chip design and R&D areas, focus will be on the NOR flash, SLC NAND flash, memory controller chips, memory peripheral chips, and the like to meet the market demand of miniaturized and precise storage. The high-end storage R&D complex will further enhance Longsys’s independent innovation capability and promote the development and application of storage technology in various fields.

Mr. Cai Huabo, Chairman and General Manager of Longsys, said that the construction of the Shanghai HQ Project has made a good start. As the first stop for Longsys’s expansion from the base in China to the global industrial field, with the favorable policy of talent introduction in the Lin-gang Special Area and the strong support for financial and trade innovation reform and industrial ecological construction from the government of the Lin-gang Special Area, the Shanghai HQ will become a paramount R&D center for Longsys’s innovation and development. It will also become a milestone for Longsys’s 24-year development to link the past with the future, expand production and increase capacity. In addition, it will also be regarded as a key measure for practicing the company philosophy of “being close to customers, close to talents, and close to the industrial chain.”

Salutes resounded, and ribbons fluttered in the air. At 11:18, the leaders and guests attending the meeting were excited and passionate to hold gold shovels in warm applause and blessings, and jointly completed the last concrete pouring for the main project. This moment marks that the company will enter another new chapter.

In the future, Longsys’s Shanghai HQ will gather high-end storage talents and R&D equipment, build the world’s top high-end storage R&D complex, comprehensively enhance the company’s all-around storage service capability, and continuously and steadily transform the company into an international semiconductor storage brand.

PR Newswire

ChipMOS SCHEDULES SECOND QUARTER 2023 FINANCIAL RESULTS CONFERENCE CALL

July 17, 2023 TechENT Syndication Leave a comment

HSINCHU, July 17, 2023 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today announced that it will report second quarter 2023 results and host a conference call after the close of trading on the Taiwan Stock Exchange on Thursday, August 3, 2023.

Investors and analysts are encouraged to participate using the dial-in phone number noted below. A webcast and replay will be available on the Company’s website.

Date: Thursday, August 3, 2023
Time:3:00PM Taiwan (3:00AM New York)
Dial-In: +886-2-33961191
Password: 9514003 #

Webcast and Replay: https://www.chipmos.com/chinese/ir/info2.aspx
Replay Starting 2 Hours After Live Call Ends

Language: Mandarin

Note: A transcript will be provided on the Company’s website in English following the conference call to help ensure transparency, and to facilitate a better understanding of the Company’s financial results and operating environment.

Contacts:

Source: ChipMOS TECHNOLOGIES INC.

PR Newswire

Arasan’s MIPI CSI-2 IP achieves ISO26262 ASIL-C Certification for MIPI C-PHY Connectivity

July 12, 2023 TechENT Syndication Leave a comment

Arasan announces the ISO26262 ASIL-C functional certification of its latest MIPI CSI IP supporting MIPI D-PHY and C-PHY v2.0 speeds of upto 54.72Gbps

SAN JOSE, Calif., July 12, 2023 /PRNewswire/ — Arasan, a leading provider of mobile storage and connectivity IP solutions, is proud to announce the ISO26262 ASIL-C functional certification for its latest MIPI CSI-2 IP. This certification applies to Arasan’s MIPI CSI IP, which seamlessly integrates with its MIPI C-PHY IP and D-PHY IP, enabling speeds of up to 54.72Gbps in C-PHY mode.

The ISO26262 ASIL-C certification signifies that Arasan’s CSI-2 IP meets the stringent safety requirements for automotive System-on-Chips (SoCs). Additionally, the certification extends its usability to defense, aircraft, and other industries where the CSI-2 IP, with its wider bus, can be employed on FPGA together with the built-in D-PHY or Arasan’s C-PHY ASIC.

Arasan’s commitment to safety compliance is further demonstrated by the ISO26262 ASIL-C certification. The company’s IP has been extensively utilized in multiple protocol analyzers, lab-based compliance testers, and high-volume production testers for assessing MIPI protocol compliance.

Imaging companies seeking to develop prototypes or limited production quantities of high-resolution camera products can license Arasan’s CSI IP in conjunction with the MIPI C-PHY/D-PHY Combo ASIC.

Apart from the MIPI CSI-2 IP, Arasan offers a comprehensive portfolio of IP solutions for automotive SoCs, including Ethernet, CAN FD/XL, and USB.

The ISO26262 ASIL-C certified MIPI CSI-2 IP is readily available for licensing, catering to both SoC and FPGA applications. Customers licensing Arasan’s CSI Controller IP can be assured of its compliance with specifications, instilling confidence in its usage for testing compliance.

About Arasan:

Arasan Chip Systems has been an active member of the MIPI Association since 2005, providing IP solutions for mobile storage and connectivity interfaces. With over a billion chips shipped incorporating Arasan’s MIPI IP, the company has established a reputation for delivering high-quality, silicon-proven Total IP Solutions, encompassing digital IP, AMS PHY IP, Verification IP, HDK, and Software. Arasan’s focus lies in mobile SoCs, which have evolved to encompass a wide range of applications, from PDAs in the mid-’90s to today’s automobiles, drones, and IoT devices. Arasan remains at the forefront of this “Mobile” evolution, providing standards-based IP that forms the foundation of Mobile SoCs.

Press Contact:
Bonnie Noufer
bonnie.noufer@arasan.com

Source: Arasan Chip Systems, Inc.

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Fibocom 5G R16-compliant Module FM160-EAU Achieved Telstra Certification, Closing the Digital Divide with Future-proof FWA Solution across Australia

The 40,000 m2 High-End Storage R&D Complex of Longsys’s Shanghai HQ Successfully Topped Out, Gathering Innovative Forces

ChipMOS SCHEDULES SECOND QUARTER 2023 FINANCIAL RESULTS CONFERENCE CALL

Arasan’s MIPI CSI-2 IP achieves ISO26262 ASIL-C Certification for MIPI C-PHY Connectivity

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