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PR Newswire

ChipMOS SCHEDULES SECOND QUARTER 2020 FINANCIAL RESULTS CONFERENCE CALL

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HSINCHU, July 21, 2020 — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today announced that it plans to report financial results for the second quarter 2020 after the close of trading on the Taiwan Stock Exchange and before the open of the NASDAQ Stock Market on Tuesday, August 11, 2020.

The Company’s management will host two conference calls to discuss the Company’s second quarter 2020 financial results.  A live, listen only and replay webcast of the conference call will be available through the ChipMOS website.  Investors who want to ask questions of the management team are encouraged to call the dial-in phone numbers noted below.

1. Date: Tuesday, August 11, 2020
Time: 4:00PM Taiwan (4:00AM New York)
Dial-In: +886-2-21928016
Password: 166416 #
Webcast of Live Call and Replay: http://wms.gridow.com/ir/chipmos/chipmos_2020Q2_ch.html
Replay Starting 2 Hours After Live Call Ends
Language: Mandarin

2. Date: Tuesday, August 11, 2020
Time: 8:00PM Taiwan (8:00AM New York)
Dial-In: +1-201-689-8562
Password: 13706850
Replay Starting 2 Hours After Live Call Ends: +1-412-317-6671, with ID 13706850
Webcast of Live Call and Replay: http://wms.gridow.com/ir/chipmos/chipmos_2020Q2_en.html 
Language: English

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

Related Links :

https://www.chipmos.com

PR Newswire

Cyient reports PAT at INR 814 Mn for the First Quarter FY 21; growth of 8.0% QoQ

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HYDERABAD, India, July 17, 2020 — Cyient (Estd: 1991, NSE: CYIENT), a global engineering and technology solutions company, today reported its consolidated financial results for the First quarter (Q1) of FY 2021 ending June 30, 2020.

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Financial Highlights

–      Consolidated revenue at $130.6 Mn (INR 9,917 Mn); degrowth of 12.5% QoQ (in $ terms) and de-growth of 16.6% YoY (in $ terms) and degrowth of 7.6% QoQ (in INR terms) and de-growth of 8.9% YoY (in INR terms)

–      Services revenue at $112.2 Mn; de-growth of 15.2% QoQ (-14.3% in CC) and de-growth of 18.6% YoY

–      DLM revenue at $18.4 Mn; growth of 8.5% QoQ, and de-growth of 1.4% YoY

–      Free cash flow to EBITDA conversion at 138.1%

–      EBIT margin for services at 6.7%, down 283 bps QoQ

–      EBIT margin for DLM at -4.6%, down 410 bps QoQ

–      Profit After Tax at INR 814 Mn for the quarter; growth of 8.0% QoQ

Business Highlights

  • Update on deal wins – Hitachi Rail:
    • Signed an agreement with Hitachi Rail to deliver project engineering services and accelerate the evolution of its signalling technology
    • Cyient will develop and operate a Central Delivery Centre for Hitachi Rail in India, and a Regional Centre in the US
    • Will be responsible for delivering engineering services for Hitachi’s global signalling projects that use proprietary interlocking platforms
  • Update on collaboration with Microsoft
    • Cyient loT Edge Gateway 5400, the flagship product in the company’s family of loT gateways, is Microsoft Azure Certified for loT
    • Cyient’s loT Edge Gateway 5400 provides diverse connectivity and communication protocol options, advanced data processing, and edge analytics capabilities for remote asset monitoring and predictive maintenance solutions
  • Diversifying our customer base
    • We have added 25 new customers in Q1 FY21
  • Commissioning of the Hyderabad factory
    • The new DLM factory in Hyderabad has been commissioned. This is one of the most advanced electronics manufacturing facilities in India, underpinned by the latest technologies in factory automation, Industry 4.0 and supply chain management
    • Strategic advantage to be located in a manufacturing hub in terms of proximity to probable customers, managing supply chains and co-ordination with the design teams

Message from the Management 
Commenting on the results, Mr. Krishna Bodanapu, Managing Director and Chief Executive Officer, said "Q1 FY21 results were better than our expectations, where we recorded a revenue of $130.6 Mn which was lower by 11.6% QoQ and 15.1% YoY in constant currency.  Services business was lower by 14.3 % QoQ in constant currency. The DLM business grew by 8.5% QoQ. We expect traction from top clients to return post Q2. The EBIT margin is lower by 328bps QoQ mainly due to lower business volume which was somewhat offset by lower SG&A spend. We generated Free Cash Flow of INR 2,163 Mn which was higher by 101% QoQ.

This quarter we had some significant wins in both new business and existing clients. This will help us strengthen our revenue outlook in the coming quarters. This quarter we also made significant investments in strengthening our business through strategic partnerships and alliances. We partnered with Microsoft for industry 4.0 offerings. The partnership will allow us take IoT solutions faster to market with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services. We also signed a partnership with Fore Optics for joint Go to Market on taking asset tracking offering to the market. As part of this partnership Fore Optics brings in its IP in supply chain analytics and Cyient its IP in asset tracking IoT. We further strengthened the management team with the addition of Felice Gray-Kemp as the Global General Counsel and Meenu Bagla as the Chief Marketing Officer. The new DLM factory in Hyderabad has been commissioned and I am happy to say that this is one of the most advanced electronics manufacturing facilities in India, underpinned by the latest technologies in factory automation, Industry 4.0 and supply chain management.

Our Outlook for Q2 is positive and we expect growth to return in all industries except Aerospace, which will de-grow further in Q2. For the year, we expect a de-growth in revenue in double digits. We will also reiterate that H2 margin will be back to the steady state margin of H1 of last year. This will continue to be underpinned by strong free cash flow generation and prudent Capex spend."

Commenting on the results, Mr. Ajay Aggarwal, President & CFO, said, "The revenue for Q1FY21 stood at $130.6 Mn (INR 9,917 Mn) with EBIT of INR 511 Mn and PAT of INR 814 Mn. Our rigor on cash collections, close engagement with customers and initiatives on cash conservation has yielded results with FCF generation of INR 2,163 Mn and FCF to EBITDA conversion of 138.1%.

With significant efforts spent on efficiencies and cost optimisation in the last financial year, our focus on cost reduction and profit improvement continued in Q1 and well set to show results in the coming quarters. We are positive on realising benefits of our sustained initiatives on collections, working capital cycles, payables and discretionary cost control in FY21. 

In the current turbulent times, it is very difficult to predict future with a reasonable certainty. We are cognizant of the dynamic situation we are in, and are working with extreme agility in making decisions and taking corrective actions to manage business scenarios with special focus on cash and costs.

We remain strongly focused on growth, improvement in operating efficiencies and cash generation and thus maximizing the value for our shareholders."

Business performance and outlook

Aerospace & Defense
Aerospace & Defence business unit witnessed a decline of 15.6% QoQ and 21.5% YoY. The services business from commercial aviation clients witnessed significant challenges across geographies. The defence business remained resilient and we expect the traction to continue through the year. The manufacturing business grew driven by new wins and stable defence accounts.

We expect to witness decline in Q2 driven by poor market demand for passenger travel. We are actively engaged with key clients to strengthen our relationship and retain our market share. We expect manufacturing business to witness strong growth through Q2. The digital offerings are seeing momentum in this vertical. We expect the demand to be driven by digital, defence and DLM in the near term.

Communications
Communications business unit witnessed a decline of 10.8% QoQ and growth of 0.6% YoY. The services business witnessed increased demand in key clients driven by demand for increased network bandwidth both from consumer & enterprise segments. Also, 5G rollouts across various geographies are gaining traction. However, closure on major programs, field access and new client acquisition remained a challenge.

We expect strong growth in Q2 driven by growth in key clients. 5G rollouts, wireless and fiber rollout, digital technologies will continue to drive growth through next few quarters.

Transportation
Transportation business unit witnessed a decline of 10.9% QoQ and 23.9% YoY, primarily driven by change in revenue complexion and lower momentum in one of our key clients. 

Our outlook for Q2 continues to remain positive driven by growth in key client accounts and new wins in mobility business. We expect momentum in signaling business to return through the quarter.

E&U
Energy and Utilities business unit witnessed a decline of 19.4% QoQ and 30.0% YoY driven by temporary stoppage in field work for the Utilities business and decline in demand for the manufacturing business.

We expect strong growth in Q2 driven by growth across services. We expect traction in Energy segment to return post Q2

Medtech and Healthcare
Medical technology and Healthcare business unit witnessed a growth of 18.2% QoQ and 32.7% YoY driven by growth in key client in the services business and manufacturing business.

Our outlook for Q2 stands positive driven by growth in key client in the manufacturing business. We expect growth in Covid related equipment’s like IVD and hospital equipment’s to drive growth through the quarter.

SIA (Semiconductor, Semiconductor, IoT and Analytics)
Semiconductor, IoT and Analytics business unit witnessed a growth of 15.6% QoQ and decline of 18.7% YoY. The growth was driven by growth in key clients in semiconductor as well as embedded automotive services. We also completed ASIC IC shipments for a high precision GPS chip leveraging our new test infrastructure in Europe. Asides this, our facilities in Leuven (Belgium) and Duisburg (Germany) will be fully equipped to perform test development for high volume production for complex analog mixed signal ASICs through the year.

We expect growth through Q2 driven by ramp up in new turnkey ASIC projects and IC shipments.

DLM (Design Led manufacturing)
Design Led manufacturing business unit witnessed a growth of 8.4% QoQ and decline of 1.4% YoY driven by growth across Aerospace and Medical segments. Our strong focus on inventory reduction through the quarter resulted in increased cash flow for the business.

We expect strong growth through Q2 driven by key clients in Aerospace & Defence and Medical segment. We will continue to focus on better inventory management and operational excellence to improve our cash position.

About Cyient
Cyient (Estd: 1991, NSE: CYIENT) is a global engineering and technology solutions company.  As a Design, Build, and Maintain partner for leading organizations worldwide, Cyient takes solution ownership across the value chain to help customers focus on their core, innovate, and stay ahead of the curve. The company leverages digital technologies, advanced analytics capabilities, domain knowledge, and technical expertise to solve complex business problems.

Cyient partners with customers to operate as part of their extended team in ways that best suit their organization’s culture and requirements. Cyient’s industry focus includes aerospace and defense, healthcare, telecommunications, rail transportation, semiconductor, geospatial, industrial, and energy.

For more information, please visit www.cyient.com.

Follow news about the company at @Cyient.

Media Relations
Perfect Relations
Vishal Thapa
Mobile: +91 9701834446
Email: vthapa@perfectrelations.com 

Disclaimer

This document contains certain forward-looking statements on our future prospects. Although Cyient believes that expectations contained in these statements are reasonable, their nature involves a number of risks and uncertainties that may lead to different results. These forward-looking statements represent only the current expectations and beliefs, and the company provides no assurance that such expectations will prove correct.

All the references to Cyient’s financial results in this update pertain to the company’s consolidated operations comprising wholly-owned and Step-down subsidiaries Cyient Europe Limited; Cyient Inc.; Cyient GmbH; Cyient Australia Pty Ltd; Cyient Singapore Private Limited; Cyient KK; Cyient Israel India Limited; Cyient Insights Private Limited; Cyient Canada Inc.; Cyient Defense Services Inc.; Certon Software Inc.; Certon Instruments Inc.; B&F Design Inc.; New Technology Precision Machining Co. Inc.; Cyient Insights LLC; Cyient Benelux BV; Cyient Schweiz GmbH; Cyient SRO; AnSem NV; AnSem B.V.; Cyient AB; partly owned subsidiaries Cyient Solutions and Systems Private Limited; Cyient DLM Private Limited; joint venture Infotech HAL Ltd (HAL JV) & associate company Infotech Aerospace Services Inc. (IASI) until 8th December 2017.

The income statement and cash flow provided is in the internal MIS format. MIS format is different from the income statement published as part of the financial results, which is as per the statutory requirement.

 

 

Related Links :

http://www.cyient.com

PR Newswire

ChipMOS REPORTS 10.7% YEAR-OVER-YEAR INCREASE IN 2Q20 REVENUE; JUNE MONTHLY REVENUE INCREASES 9.0% YEAR-OVER-YEAR

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HSINCHU, July 10, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of June 2020 and for the second quarter ended June 30, 2020. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$29.44 to US$1.00 as of June 30, 2020.

Revenue for the second quarter of 2020 was NT$5,428.1 million or US$184.4 million, representing an increase of 10.7% from the second quarter of 2019, and a decrease of 2.8% from the first quarter of 2020.

Revenue for the month of June 2020 was NT$1,784.5 million or US$60.6 million, representing an increase of 9.0% from June 2019, and a decrease of 0.3% from May 2020.  

The Company noted this represents a six year record high for its second quarter revenue. ChipMOS continues to benefit from growth in its memory business, led by DRAM and NOR flash demand in support of cloud-based storage services and applications, ongoing 5G network buildouts worldwide, and higher demand from the gaming market and in support of increased work and school from home needs.  Within its DRAM business, commodity DRAM was stronger in the second quarter 2020 than niche DRAM.  DDIC revenue was impacted by continued softness in smartphones and TVs, both of which are positioned for a potential rebound in growth in the second half of 2020 due to rationalized inventory in the supply chain along with an expected demand recovery.

Consolidated Monthly Revenues (Unaudited)
 

June 2020

May 2020

June 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,784.5

1,789.3

1,636.7

-0.3%

9.0%

Revenues

(US$ million)

60.6

60.8

55.6

-0.3%

9.0%

Consolidated Quarterly Revenues (Unaudited)
 

Second Quarter 2020

First Quarter

2020

Second Quarter 2019

QoQ Change

YoY Change

Revenues

(NT$ million)

5,428.1

5,586.8

4,905.3

-2.8%

10.7%

Revenues

(US$ million)

184.4

189.8

166.6

-2.8%

10.7%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

Related Links :

https://www.chipmos.com
PR Newswire

Palma Ceia SemiDesign Announces Sampling for PCS11ax28, New 802.11ax Transceiver

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SANTA CLARA, California, June 29, 2020 —  Palma Ceia SemiDesign, a fabless semiconductor company specializing in semiconductor chips and IP for next-generation wireless connectivity, today announced the PCS11ax28, its new chip for the 802.11ax Wi-Fi standard, is now available for customer sampling.

“We are very excited at the test outcomes for the PCS11ax28, our new 802.11ax transceiver – initial testing all came back with positive results,” said James Flowers, chief operating officer of Palma Ceia SemiDesign. “The advanced feature set of the PCS11ax28 is designed to support the ever-expanding universe of applications for the Internet of Things and our customers’ accelerating initiatives. Sample supply is initially limited due to greater than expected customer demand and we are working with our global partners to expand supply.”

The 802.11ax standard, also known as Wi-Fi 6, is the newest version of the 802.11 standard for wireless network transmissions commonly referred to as Wi-Fi. It offers greater maximum data rates than earlier standards, as well as higher network capacity to support greater numbers of IoT devices. Wi-Fi 6 is backward-compatible with the previous version of the Wi-Fi standard, 802.11ac.

Highlights of the new Wi-Fi 6 chip from Palma Ceia SemiDesign include:

  • Currently available in 1×1 MIMO configuration. Availability of 2X2 and 4X4 configurations is expected to begin Q3 2020
  • Supports Wi-Fi 6 channel bandwidths 20 MHz, 40MHz and 80MHz.
  • Supports all Wi-Fi 6 modulations up to 1024-QAM.
  • Analog I/O out can enable Bluetooth over 2.4 GHz channel.
  • Extremely low power consumption, with peak RX power consumption of only 195mW for the 1×1 configuration.
  • Based on high-performance 28-nm HPC technology

Requests for additional information and sample requests for the PCS11ax28 from Palma Ceia SemiDesign can be made via the Palma Ceia SemiDesign website or by email to wifi-for-iot@pcsemi.com.

About Palma Ceia SemiDesign

Palma Ceia SemiDesign (PCS) is a fabless semiconductor company and leading provider of communication chips and IP for next-generation Wi-Fi and cellular applications. With a focus on emerging Wi-Fi and LTE standards, PCS targets the design of ICs for broadband, wireless, medical and automotive applications. Palma Ceia SemiDesign solutions are differentiated by low-power, high-performance and ease of integration. With operational headquarters in Hong Kong, the company has design centers in Cambridge (United Kingdom), Hong Kong, and McKinney, Texas (United States). Additional sales and support activities are located in mainland China, Israel, Japan, Korea, and Taiwan. Visit Palma Ceia SemiDesign on the web at www.pcsemi.com.

Palma Ceia SemiDesign and the Palma Ceia SemiDesign logo are trademarks of Palma Ceia SemiDesign, a Cayman Islands corporation, and are protected by trademark laws of the United States and other jurisdictions. All other product and company names are trademarks or registered trademarks of their respective companies.

Palma Ceia SemiDesign Media Contact
John Molyneux
press@pcsemi.com

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Related Links :

http://www.pcsemi.com

PR Newswire

Cyient Collaborates with Microsoft to Accelerate Internet of Things Solutions for Industry 4.0

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Verified IoT Edge Gateways and software enhance interoperability and allow faster time to production.

HYDERABAD, India, June 26, 2020 — Cyient, a global engineering and technology solutions company, today announced it has joined Microsoft Azure Certified for Internet of Things (IoT), ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services. Microsoft Azure Certified for IoT allows businesses to reach customers where they are, working with an ecosystem of devices and platforms, allowing for faster time to production. 

Suman Narayan, Senior Vice President, Semiconductors and Medical Technologies and Healthcare, Cyient
Suman Narayan, Senior Vice President, Semiconductors and Medical Technologies and Healthcare, Cyient

Cyient combines 28 years of operations technology experience and industry domain knowledge with its digital solutions and services expertise to help businesses simplify complex IoT implementations and manage the convergence of OT/IT for improved outcomes.  From solving a single, high-impact customer challenge to mapping out a strategic roadmap for superior operations, Cyient helps customers Connect, Integrate, Analyze, and Act on data to drive actions. 

Cyient IoT Edge Gateway 5400, the flagship product in the company’s family of IoT gateways, is Microsoft Azure Certified for IoT. It provides customers with a modular and scalable edge gateway for seamless connectivity of legacy machines and next-gen intelligent devices to the Industrial IoT network and the cloud. Cyient’s IoT Edge Gateway 5400 provides diverse connectivity and communication protocol options, advanced data processing, and edge analytics capabilities for remote asset monitoring and predictive maintenance solutions.  Cyient’s modular platform approach to hardware and software, with plug-and-play modules and over-the-air firmware updates, ensure your long-life assets evolve as your business and technology evolve.

Speaking on the collaboration, Suman Narayan, Senior Vice President, Semiconductors and Medical Technologies and Healthcare at Cyient, said, "Industries today are increasing focus on digital technology and building intelligence into equipment for remote monitoring and to extend asset life, improve customer experience, and ensure regulatory compliance. The Microsoft Azure IoT Certification validates Cyient’s ability to accelerate IoT deployments for customers and ensure seamless integration from the edge to the cloud."

"Microsoft Azure Certified for IoT extends our promise to bring IoT to business scale, starting with interoperable solutions from leading technology companies around the world," said Jerry Lee, Director of Marketing for Azure Internet of Things, Microsoft Corp. "With trusted offerings and verified partners, Microsoft Azure Certified for IoT accelerates the deployment of IoT even further."

IoT projects are complex and take a long time to implement. Customers find that choosing and connecting the right set of devices, assets or sensors to the cloud can be time-consuming. To jumpstart their IoT projects with confidence, customers are looking for certified devices and platforms that are tested for readiness, compatibility and usability with the Microsoft Azure IoT Suite. By choosing a partner from the Microsoft Azure Certified for IoT program, customers can save time and effort on project specs and RFP processes by knowing in advance what devices and offerings will work with the Azure IoT Suite.

Learn more about this collaboration at Azure Certified for IoT and explore the Azure IoT Suite today.

About Cyient:

Cyient (Estd: 1991, NSE: CYIENT) is a global engineering and technology solutions company.  As a Design, Build, and Maintain partner for leading organizations worldwide, Cyient takes solution ownership across the value chain to help customers focus on their core, innovate, and stay ahead of the curve. The company leverages digital technologies, advanced analytics capabilities, domain knowledge, and technical expertise to solve complex business problems.

Cyient partners with customers to operate as part of their extended team in ways that best suit their organization’s culture and requirements. Cyient’s industry focus includes aerospace and defense, healthcare, telecommunications, rail transportation, semiconductor, geospatial, industrial, and energy.

For more information, please visit www.cyient.com

Follow news about the company at @Cyient

Disclaimer: All product and company names herein may be trademarks of their registered owners.

Contact Details

Media Relations
Perfect Relations
Vishal Thapa
Mobile: +91 9701834446
Email: vthapa@perfectrelations.com

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Related Links :

http://www.cyient.com

PR Newswire

JCET Group Subsidiary Recognized for Excellence by Texas Instruments

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SHANGHAI, June 25, 2020 — Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP), subsidiary of JCET Group has received the Texas Instruments (TI) 2019 Supplier Excellence Award. The annual award honors companies whose dedication and commitment in supplying products and services meet TI’s high standards for excellence. Recipients are an elite group of suppliers chosen for their exemplary performance in the areas of Cost, Environmental & Social Responsibility, Technology, Responsiveness, Assurance of Supply, and Quality.

TI uses the products and services of more than 10,000 suppliers throughout the world. The “TI Supplier Excellence Award” is the highest TI award issued to their best preforming global suppliers. JCAP is the only packaging and test company in mainland China that is receiving this award for 2019. JCET Group has provided its services to TI for many years, and has established a close partnership. This award is the result of the long term cooperation between the two companies and the recognition of JCAP’s continued excellent performance in 2019.

Mr. Jerry Zhang, General Manager of JCAP stated, “It is our great honor to receive this award for the fourth time. The supplier excellence award represents TI’s confirmation and recognition of JCAP’s Bump & WLP technologies and high volume production services. Being a global leading packaging and testing company, JCET Group always promotes innovation, assures the highest quality, and on-time delivery with advanced patented technologies. JCET Group will continue to concentrate on research, development and innovation to add more high-end packaging technologies to our portfolio, and work closely together with our customers for continuous improvement and excellence.”  

the Texas Instruments (TI) 2019 Supplier Excellence Award
the Texas Instruments (TI) 2019 Supplier Excellence Award

About JCET Group:

JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

About JCAP

As one of the core business units of JCET Group, Jiangyin Changdian Advanced Packaging Co., LTD. (JCAP) is focused on mid-end semiconductor packaging and test technologies and providing the highest quality service for our global customers.

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PR Newswire

SmartSens Completes Acquisition of Allchip Microelectronics, Extending Imaging Leadership to Automotive Market

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SHANGHAI, June 20, 2020 — SmartSens Technology today announced its completed acquisition and merger with Shenzhen-based Allchip Microelectronics — a specialist in CMOS image sensors for automotive applications.

SmartSens acquires Allchip Microelectronics
SmartSens acquires Allchip Microelectronics

 

Allchip focuses on the design and development of CIS video sensing technologies. Its products, which include a series of SOC image sensors, have been widely deployed in automobile cameras and other miniaturized video surveillance applications.

* Allchip moved to new SmartSens Shenzhen R&D Center located at Shenzhen Longgang District in June!

New SmartSens Shenzhen R&D Center
New SmartSens Shenzhen R&D Center

 

Celebrating the R&D Center opening in the Longgang District
Celebrating the R&D Center opening in the Longgang District

 

“The increasing adoption of image sensors in automobiles has brought new momentum to the imaging market. According to a projection by research firm Yole Développement, the volume of camera modules in the global automobile market will exceed US$8B by 2025. Our acquisition of Allchip Microelectronics is a strategic move for SmartSens that will significantly broaden our leadership and capacity in addressing this market,” said Dr. Richard Xu, Founder and CEO of SmartSens. “Our combined advantage — utilizing shared resources and technologies — will deliver a true win-win for us and our customers, for years to come.”

“We are thrilled to be part of the SmartSens family. We share the same set of core values, which emphasize the pursuit of technology innovation in service of our customers’ needs. We look forward to combining Allchip’s technical know-how in the automotive industry with SmartSens’ excellent business channel to successfully launch class-leading products for Automotive ADAS systems and other smart sensing applications,” said Mr. Mike Hu, current VP of Technology at SmartSens and former CEO of Allchip.  Mr. Hu is a veteran in CMOS image sensor field since his key role in BYD Microelectronics time as the Chief Technology Officer back in ten years ago.

SmartSens expects its acquisition and integration of Allchip further improve its cost structure and competitiveness in the automotive market while accelerating its innovation in smart car CIS solutions.

About SmartSens Technology Co. Ltd.

Founded in 2011, SmartSens Technology Co. Ltd. is a leading supplier of high-performance CMOS imaging systems worldwide and a forerunner in the video surveillance industry. Its products are widely used in the fields of vehicle-mounted imaging, machine vision and consumer electronics (sports cameras, drones, robot cleaners, smart home cameras, etc.). With research centers based in Shanghai and Beijing among others, the company focuses on providing future-oriented solutions and market-leading products. Coupled with cutting-edge technology and innovation, SmartSens is the industry’s first ever company to introduce the global shutter CIS sensors based on voltage domain architecture and stack BSI process. Since its founding, SmartSens has been committed to providing customers with high-quality smart sensors. Learn more at SmartSensTech.com.

 
PR Newswire

ChipMOS REPORTS MAY 2020 REVENUE

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HSINCHU, June 8, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of May 2020. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.01 to US$1.00 as of May 29, 2020.

Revenue for the month of May 2020 was NT$1,789.3 million or US$59.6 million. This represents an increase of 4.7% as compared to May 2019 and a decrease of 3.5% from April 2020. The Company noted that it maintained stable utilization, with healthy memory demand, including DRAM and NOR flash, offset by TV and smartphone related DDIC demand softness.

Consolidated Monthly Revenues (Unaudited)

May 2020

April 2020

May 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,789.3

1,854.3

1,709.1

-3.5%

4.7%

Revenues

(US$ million)

59.6

61.8

57.0

-3.5%

4.7%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

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Cision View original content:http://www.prnewswire.com/news-releases/chipmos-reports-may-2020-revenue-301071757.html

Source: ChipMOS TECHNOLOGIES INC.

PR Newswire

ChipMOS to Present at Investor Conference Hosted by the Taiwan Stock Exchange and SinoPac Securities Corp.

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HSINCHU, June 4, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today announced that it will present at the Taiwan Double Good Forum hosted by the Taiwan Stock Exchange and SinoPac Securities Corp. The virtual conference will take place on Wednesday, June 10, 2020.

Management from the Company, including Jesse Huang, Vice President of Strategy and Investor Relations, will discuss the Company’s recent financial results, business trends and growth opportunities. The Company’s investor update is currently available on the investor relations’ section of its website at www.chipmos.com.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

Contacts:

Cision View original content:http://www.prnewswire.com/news-releases/chipmos-to-present-at-investor-conference-hosted-by-the-taiwan-stock-exchange-and-sinopac-securities-corp-301070182.html

Source: ChipMOS TECHNOLOGIES INC.

PR Newswire

Memory, Power and AI Semiconductors in 5G to Hit $15.03 Billion in Revenues by 2025, Finds Frost & Sullivan

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5G semiconductor applications witness unprecedented growth, driven by increasing data traffic and hardware improvements

SANTA CLARA, California, June 3, 2020 /PRNewswire/ — Frost & Sullivan’s recent analysis, Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025, finds that the 5G AI, memory, and power amplifier (PA) semiconductor market is rapidly transitioning from a nascent stage to a growth stage. It is strongly driven by exponentially increasing data traffic, technological advancements leading to hardware performance and capability improvements, and the emergence of new use cases. Registering an unprecedented growth at a compound annual growth rate (CAGR) of 74.3%, the market for 5G AI, memory, and PA semiconductors is estimated to garner revenue of $15.03 billion by 2025 from $536.9 million in 2019.

Frost & Sullivan - 5G
Frost & Sullivan – 5G

For further information on this analysis, please visit – http://frost.ly/458.

“5G is in the early commercialization stage, and a majority of the deployments in the coming years are expected to be in the sub-6 GHz range. Hence, short-term opportunities will be limited to traditional devices, such as smartphones, communication infrastructure, and laptops,” said Prabhu Karunakaran, Test & Measurement Industry Analyst at Frost & Sullivan. “Further, the AI processor market for 5G applications is rapidly growing, specifically in edge devices. They are expected to play a significant role in various devices, including edge servers and autonomous cars.”

Karunakaran added, “Memory integrated circuits (ICs) supporting 5G end-user markets will be the highest contributors. Power amplifier IC is estimated to have generated larger revenue due to multiple 5G deployments, with revenue from the infrastructure segment. Additionally, AI is in the infancy stage and is expected to grow significantly in the next five years.”

To tap into opportunities created by memory, PA, and AI semiconductors in 5G, Frost & Sullivan has identified key prospects in the:

  • Manufacturing Sector: To mitigate the issues of surging operational costs in the manufacturing sector, semiconductor companies must work with network equipment manufacturers and robotics system manufacturers to integrate cost-effective memory, PA, and AI chips and capitalize on the opportunity.
  • Healthcare Sector: The spread of the COVID-19 pandemic has resulted in a sudden rise in the adoption of robotics in the healthcare sector. AI and PA market participants should look into optimizing the existing products to leverage this unprecedented opportunity.
  • Automotive Sector: Autonomous vehicles need an ultra-fast, reliable network that processes huge volumes of data. Hence, 5G AI, PA, and memory device manufacturers should develop automotive-grade devices that function reliably.
  • Retail Sector: AI, memory, and PA semiconductor market participants should increasingly focus on developing solutions for 5G edge servers that will require processing large data volumes.
  • Agriculture Sector: Digitization is transforming the agriculture sector rapidly. Market players must work with system and device manufacturers to develop cost-effective, application-specific integrated circuits to enhance farm productivity.

Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025 is the latest addition to Frost & Sullivan’s Test & Measurement research and analyses available through the Frost & Sullivan Leadership Council, which helps organizations identify a continuous flow of growth opportunities to succeed in an unpredictable future.

About Frost & Sullivan
For over five decades, Frost & Sullivan has become world-renowned for its role in helping investors, corporate leaders and governments navigate economic changes and identify disruptive technologies, Mega Trends, new business models and companies to action, resulting in a continuous flow of growth opportunities to drive future success. Contact us: Start the discussion.

Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025
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