HSINCHU, July 21, 2020 — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it plans to report financial results for the second quarter 2020 after the close of trading on the Taiwan Stock…
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ChipMOS REPORTS MAY 2020 REVENUE
HSINCHU, June 8, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of May 2020. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$30.01 to US$1.00 as of May 29, 2020.
Revenue for the month of May 2020 was NT$1,789.3 million or US$59.6 million. This represents an increase of 4.7% as compared to May 2019 and a decrease of 3.5% from April 2020. The Company noted that it maintained stable utilization, with healthy memory demand, including DRAM and NOR flash, offset by TV and smartphone related DDIC demand softness.
|
Consolidated Monthly Revenues (Unaudited) |
|||||
|
May 2020 |
April 2020 |
May 2019 |
MoM Change |
YoY Change |
|
|
Revenues (NT$ million) |
1,789.3 |
1,854.3 |
1,709.1 |
-3.5% |
4.7% |
|
Revenues (US$ million) |
59.6 |
61.8 |
57.0 |
-3.5% |
4.7% |
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.
Forward-Looking Statements
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.
Contacts:
|
In Taiwan Jesse Huang ChipMOS TECHNOLOGIES INC. +886-6-5052388 ext. 7715 |
In the U.S. David Pasquale Global IR Partners +1-914-337-8801 |
Related Links :
https://www.chipmos.com
ChipMOS to Present at Investor Conference Hosted by the Taiwan Stock Exchange and SinoPac Securities Corp.
HSINCHU, June 4, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present at the Taiwan Double Good Forum hosted by the Taiwan Stock Exchange and SinoPac Securities Corp. The virtual conference will take place on Wednesday, June 10, 2020.
Management from the Company, including Jesse Huang, Vice President of Strategy and Investor Relations, will discuss the Company’s recent financial results, business trends and growth opportunities. The Company’s investor update is currently available on the investor relations’ section of its website at www.chipmos.com.
About ChipMOS TECHNOLOGIES INC.:
ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.
Forward-Looking Statements
This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.
Contacts:
|
In Taiwan Jesse Huang ChipMOS TECHNOLOGIES INC. +886-6-5052388 ext. 7715 |
In the U.S. David Pasquale Global IR Partners +1-914-337-8801 |
Related Links :
http://www.chipmos.com
Memory, Power and AI Semiconductors in 5G to Hit $15.03 Billion in Revenues by 2025, Finds Frost & Sullivan
5G semiconductor applications witness unprecedented growth, driven by increasing data traffic and hardware improvements
SANTA CLARA, California, June 3, 2020 /PRNewswire/ — Frost & Sullivan’s recent analysis, Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025, finds that the 5G AI, memory, and power amplifier (PA) semiconductor market is rapidly transitioning from a nascent stage to a growth stage. It is strongly driven by exponentially increasing data traffic, technological advancements leading to hardware performance and capability improvements, and the emergence of new use cases. Registering an unprecedented growth at a compound annual growth rate (CAGR) of 74.3%, the market for 5G AI, memory, and PA semiconductors is estimated to garner revenue of $15.03 billion by 2025 from $536.9 million in 2019.
Frost & Sullivan – 5G
For further information on this analysis, please visit – http://frost.ly/458.
"5G is in the early commercialization stage, and a majority of the deployments in the coming years are expected to be in the sub-6 GHz range. Hence, short-term opportunities will be limited to traditional devices, such as smartphones, communication infrastructure, and laptops," said Prabhu Karunakaran, Test & Measurement Industry Analyst at Frost & Sullivan. "Further, the AI processor market for 5G applications is rapidly growing, specifically in edge devices. They are expected to play a significant role in various devices, including edge servers and autonomous cars."
Karunakaran added, "Memory integrated circuits (ICs) supporting 5G end-user markets will be the highest contributors. Power amplifier IC is estimated to have generated larger revenue due to multiple 5G deployments, with revenue from the infrastructure segment. Additionally, AI is in the infancy stage and is expected to grow significantly in the next five years."
To tap into opportunities created by memory, PA, and AI semiconductors in 5G, Frost & Sullivan has identified key prospects in the:
- Manufacturing Sector: To mitigate the issues of surging operational costs in the manufacturing sector, semiconductor companies must work with network equipment manufacturers and robotics system manufacturers to integrate cost-effective memory, PA, and AI chips and capitalize on the opportunity.
- Healthcare Sector: The spread of the COVID-19 pandemic has resulted in a sudden rise in the adoption of robotics in the healthcare sector. AI and PA market participants should look into optimizing the existing products to leverage this unprecedented opportunity.
- Automotive Sector: Autonomous vehicles need an ultra-fast, reliable network that processes huge volumes of data. Hence, 5G AI, PA, and memory device manufacturers should develop automotive-grade devices that function reliably.
- Retail Sector: AI, memory, and PA semiconductor market participants should increasingly focus on developing solutions for 5G edge servers that will require processing large data volumes.
- Agriculture Sector: Digitization is transforming the agriculture sector rapidly. Market players must work with system and device manufacturers to develop cost-effective, application-specific integrated circuits to enhance farm productivity.
Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025 is the latest addition to Frost & Sullivan’s Test & Measurement research and analyses available through the Frost & Sullivan Leadership Council, which helps organizations identify a continuous flow of growth opportunities to succeed in an unpredictable future.
About Frost & Sullivan
For over five decades, Frost & Sullivan has become world-renowned for its role in helping investors, corporate leaders and governments navigate economic changes and identify disruptive technologies, Mega Trends, new business models and companies to action, resulting in a continuous flow of growth opportunities to drive future success. Contact us: Start the discussion.
Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025
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Media Contact:
Priya George, Corporate Communications
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Related Links :
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