KUALA LUMPUR, Malaysia, Dec. 29, 2023 — Macnica Inc. headquartered at Yokohama City, Kanagawa Prefecture, President: Kazumasa Hara, hereinafter referred to as "Macnica" is pleased to announce a strategic collaboration with…
EV Group Brings Revolutionary Layer Transfer Technology to High-Volume Manufacturing with EVG®850 NanoCleave™ System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and transistor scaling…
Chipsea Technologies (Shenzhen) Co., Ltd., a “new player” in the global PC industry chain, has once again been awarded an Intel Platform Component List (PCL) certification, for its new EC product E2010
SHENZHEN, China, Nov. 25, 2023 — Recently, China’s A-share listed company Chipsea Technologies (stock code: 688595) has seen its new generation EC chip CSCE2010 successfully passed Intel PCL (Platform Component…
Chengdu showcases technological strength at high-tech expo
CHENGDU, China, Nov. 24, 2023 — Chengdu, capital of Southwest China’s Sichuan province, demonstrated its strength in sci-tech innovation at the 11th China (Mianyang) Science and Technology City International…
DEEPX Honored with Three CES Innovation Awards 2024 for Leading-Edge AI Chip Tech
Korean fabless startup unleashes world’s most innovative AI chip technology — ultra-gap source technology – DEEPX is honored with three CES Innovation Awards 2024 in its core focus areas: Computer…
ERS electronic introduces “High Power Dissipation” Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test
MUNICH, Nov. 14, 2023 — ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing…
VisIC Technologies Revolutionizes Automotive Power Electronics with V22TG D3GAN in Advanced Top Side Cooled Isolated Package
NESS ZIONA, Israel, Nov. 14, 2023 — VisIC Technologies Ltd, a global leader in advanced GaN power electronics solutions, is excited to…
ICZOOM Named Outstanding e-Commerce Platform of the Year at Prestigious Global IC & Component Exhibition and Conference, IIC Shenzhen 2023; Company Also Wins Global Electronic Component Distributor Excellence Award
HONG KONG, Nov. 9, 2023 — ICZOOM Group Inc. (Nasdaq: IZM) (the "Company" or "ICZOOM"), a B2B electronic component products e-commerce platform,…
Qorvo® QSPICE™ Revolutionizes Circuit Simulation for Power and Analog Designers
GREENSBORO, NC, Oct. 25, 2023 — Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, recently announced the release of QSPICE™, a new generation of circuit simulation software…
Supermicro highlights AI as next industrial revolution; foundation of new era lies with digital data creation, storage, and processing
TAIPEI, Oct. 12, 2023 — In 2024, the semiconductor sector will face several major changes. At the forefront of these changes are innovations in high-performance computing (HPC) and AI…