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PR Newswire

Ingdan Innovations Introduces New Strategic Investors, RMB166 million Raised for the Blue Ocean of China’s Chips Market

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HONG KONG, Sept. 11, 2020 — Cogobuy Group ("Cogobuy" or the "Company", stock code: 400.HK; with its subsidiaries (the ”Group”)) is pleased to announce the Company’s non-wholly owned subsidiary Comtech Industrial Technology (Shenzhen) Company Limited ("Comtech Industrial"), a technical service platform engaged in chip sales under the name of "Ingdan Innovations", has reached respective subscription agreements with a total of eight strategic investors, following the introduction of the leading strategic investor Guangdong Finance Fund Management Co., Ltd. ("Guangdong Finance Fund Management") in August 2020. The investment supports Ingdan Innovations‘ rapid development in the trillion-RMB domestic chip market, and will accelerate to the resumption of high growth for the Company’s business.

Pursuant to the strategic investment agreements, the eight investors agreed to inject capital into Comtech Industrial in the aggregate amount of up to RMB165.8 million, for an aggregate equity interest of up to 6.46% of Comtech Industrial. After the transaction, the Company’s shareholding in Comtech Industrial will decrease from 75% to around 70%. Comtech Industrial will continue to be a subsidiary of the Company and the financial results of Comtech Industrial will continue to be consolidated into those of the Group.

Ingdan Innovations is the Group’s technical service platform engaged in chips sales. Ingdan Innovations leverages its network of over 50% of global IC suppliers and top domestic chip companies, and provides chips sales services to over 100 global high-end chip suppliers and tens of thousands of smart hardware companies.

Mr. Jeffrey Kang, CEO of Cogobuy Group, said, "Benefitting from the rapid development of 5G industries and the infrastructure, Cogobuy recorded strong performance in both profit and revenue in the first half of 2020 and brought on Guangdong Finance Fund Management, which belongs to Guangdong’s largest provincial integrated financial platform as Ingdan Innovations’ first leading strategic investor. Since then, the group successfully introduced eight strategic investors to invest Ingdan Innovations and raised additional capitals for daily operation. Going forward, we expect to introduce more investors into Ingdan Innovations. The new capital will enable Cogobuy to capture the strong demand for high-end chips, driven by the large-scale expansion of 5G industries, artificial intelligence, Internet of Things, and other new infrastructure in China, indirectly increase our chip sales and market shares and maintain the Group’s high growth to prepare for the next momentum."

About Cogobuy Group

Cogobuy Group, a technology service company focusing on serving global chip industry and AIoT ecosystem, is headquartered in Shenzhen, with offices and branches across major cities in China, including Hong Kong, Shanghai, Beijing, Wuhan, Chengdu, Nanjing, Hangzhou, and Xi’an, as well as overseas branches in U.S., Singapore, Israel, and Japan. The Group was composed by Ingdan Innovations, a technical service platform serving chip industry, and "Ingfin Services", integrated the Company’s proprietary products, financing, and other enterprise services, forming a new "Ingdan Innovations + Ingfin Services" dual business model. For further information, please refer to the Company’s website at http://www.cogobuy.com/

For investor and media enquiries

Please contact Ms. Novam Ng at ir@cogobuy.com.

PR Newswire

ChipMOS REPORTS AUGUST 2020 REVENUE

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HSINCHU, Sept. 9, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of August 2020.  All U.S. dollar figures cited in this press release are based on the exchange rate of NT$29.37 to US$1.00 as of August 31, 2020.

Revenue for the month of August 2020 was NT$1,902.5 million or US$64.8 million, an increase of 0.8% as compared to July 2020 and a decrease of 0.5% compared to August 2019.  The Company noted it is benefiting from increased DDIC and bumping demand driven by new HD-grade smartphone models, along with large- and mid-size panels to meet TDDI, TV, notebook tablet growth, respectively.  Wafer test capacity of high end platform for DDIC is almost fully utilized due to increased demand combined with required longer TDDI test times.

Consolidated Monthly Revenues (Unaudited)

August 2020

July 2020

August 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,902.5

1,886.6

1,912.2

0.8%

-0.5%

Revenues

(US$ million)

64.8

64.2

65.1

0.8%

-0.5%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

Related Links :

https://www.chipmos.com

PR Newswire

Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government’s Consideration to Add the Company to a Trade Blacklist

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SHANGHAI, Sept. 5, 2020 — Reuters reported Friday, September 4 (EST), citing a Defense Department official that the Trump administration is considering whether to add China’s top chipmaker SMIC to a trade blacklist.

SMIC solemnly declares that the Company, a public company listed on the Hong Kong Stock Exchange and the Sci-Tech Innovation Board (STAR Market), is an international semiconductor foundry strictly complying with the laws and regulations of all jurisdictions where it performs its businesses.  Since its inception, the Company has been fully compliant with all rules and laws. SMIC has maintained long-term strategic partnerships with multiple U.S.-based semiconductor equipment suppliers.  Over the years, the Bureau of Industry and Security (BIS) has granted numerous export licenses for the Company.  With a large and diverse customer base, serving companies in the U.S., Europe, and other Asian regions, SMIC plays an important role in the global semiconductor supply chain.  The Company manufactures semiconductors and provides services solely for civilian and commercial end-users and end-uses.  We have no relationship with the Chinese military.  In and before 2016, SMIC had been granted Validated End-User (VEU) authorization by the BIS and the company hosted several visits from U.S. Government officials.  Any assumptions of the Company’s ties with the Chinese military are untrue statements and false accusations.  The Company is in complete shock and perplexity to the news.  Nevertheless, SMIC is open to sincere and transparent communication with the U.S. Government agencies in hope of resolving potential misunderstandings.

About SMIC
Semiconductor Manufacturing International Corporation ("SMIC", SSE STAR MARKET: 688981; SEHK: 00981; OTCQX: SMICY) and its subsidiaries collectively constitute one of the leading foundries in the world, is Mainland China’s most advanced and largest foundry, broadest in technology coverage, and most comprehensive in semiconductor manufacturing services. SMIC Group provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 14 nanometer. Headquartered in Shanghai, China, SMIC Group has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab), a 200mm fab and a majority-owned joint-venture 300mm fab for advanced nodes (under construction) in Shanghai; a 300mm fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin. SMIC Group also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan China, and a representative office in Hong Kong China. For more information, please visit www.smics.com.

 

 

Related Links :

http://www.smics.com

PR Newswire

Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States

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MediaTek’s Dimensity 1000C delivers premium 5G experiences, advance AI capabilities, enhanced display features and ultra-fast connectivity

TAIPEI, Sept. 3, 2020 — MediaTek today announced its newest 5G smartphone chip, the Dimensity 1000C, which debuted first in the United States.

MediaTek's Dimensity 1000C 5G smartphone chipset debuts first in the US powering the new LG Velvet on T-Mobile's nationwide 5G network.
MediaTek’s Dimensity 1000C 5G smartphone chipset debuts first in the US powering the new LG Velvet on T-Mobile’s nationwide 5G network.

The Dimensity 1000C will power LG’s newest device, the LG VELVET™ on T-Mobile’s nationwide 5G network, and deliver advance AI capabilities, enhanced display features, fast connectivity and improved multimedia capabilities for a premium user experience.

"From the world’s first standalone 5G data call to collaborating on their first 5G chipset in America, T-Mobile and MediaTek have partnered to move 5G innovation forward," said Ryan Sullivan, VP of Product Development at T-Mobile. "This is another step towards #5GforAll on America’s largest nationwide 5G network."

The 7nm Dimensity 1000C features super fast 5G speeds and expands MediaTek’s  5G family of chipsets and its flagship series that delivers full premium 5G experiences for smartphone users.

"Compared to other parts of the world, consumers in the U.S. haven’t had much choice on the chipset side when it comes to 5G smartphones," said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. "MediaTek is focused on giving consumers more options and expanding access to 5G devices so that everyone can enjoy the premium features and speeds that are defining the next era of mobile computing."

The Dimensity 1000C features four Arm-Cortex-A77 CPU cores and four power-efficient Arm Cortex-A55 cores operating up to 2GHz, with a large, low-latency communal cache that improves performance and power-efficiency even further. Five Arm Mali-G57 GPU cores mean avid gamers have powerful graphics at their fingertips. The MediaTek AI processing unit (APU 3.0) combines three different types of AI processors. This versatile and unique design meets the needs of the latest AI-camera, AI-assistant, in-app and OS-enhancements for superior smartphone experiences.

Key features and specs include:

  • AV1 with Netflix: The Dimensity 1000C enables AV1 HDR on Netflix, and AV1 video streaming on YouTube. MediaTek is also working with Twitch, the world’s leading live streaming channel, to bring AV1 video streaming to mobile.
  • Dual Voice Wake Up: The Dimensity 1000C is MediaTek’s first SoC model with dual integrated Voice Wakeup (VoW) function in US that minimizes the power of applications in the Android OS such as the always-on Google Assistant.    
  • Dual Display: The Dimensity 1000C is MediaTek’s first model to support dual display.
  • Advanced Camera Support: For stronger and more precise face detection, the Dimensity 1000C is equipped with an advanced AI face detection hardware engine.

MediaTek Dimensity 1000 powered devices have already launched with key smartphone brands in other markets. The Dimenstiy  1000C was developed and tailored for the US market. The 1000 series joins MediaTek’s other popular Dimensity 5G chips including the Dimensity 800 and Dimensity 700 series. MediaTek offers a full range of 5G chips to bring the promise of 5G to everyone.

MediaTek  5G technologies are integrated across product lines – including in smartphones and 5G connectivity for routers and PCs.

For more details on MediaTek’s Dimensity series, visit: https://i.mediatek.com/mediatek-5g 

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 1.5 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek Press Office:

PR@mediatek.com
Kevin Keating, MediaTek
+1 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

Related Links :

http://www.mediatek.com

PR Newswire

MediaTek Advances its 5G Platform with New T750 5G Chipset for Fixed Wireless Access Routers and Mobile Hotspot CPE Devices

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Highly integrated, low-power T750 5G chipset delivers 5G broadband experience for 5G NR sub-6GHz frequencies

HSINCHU, Taiwan, Sept. 3, 2020 — MediaTek today announced its T750 5G chipset to power next generation 5G CPE wireless products, like fixed wireless access routers (FWA) and mobile hotspots, to bring fast 5G connectivity into homes, businesses and anyone on the go.

The highly integrated, 7nm compact chip design comes with an integrated 5G radio and quad-core Arm CPU. It’s full-featured with all the essential functions and peripherals for device makers to build high performance consumer premise equipment products in the smallest form factors possible. The T750 is sampling now with potential customers.

"Pervasive high-speed broadband connectivity is becoming more important with the increase in connected devices and the surge of people working from home, taking online classes and using services like tele-health and video calling," said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit. "We are extending our 5G leadership beyond the smartphone segment with the T750 chipset, opening up new markets for broadband operators and device makers, and helping consumers – no matter where they live – to experience all the advantages of 5G connectivity."

5G routers with support for sub-6GHz frequencies bring a more affordable broadband alternative to areas with limited DSL, cable or fiber services. Having access to super-fast connectivity will also be a game-changer for suburban, rural and less developed areas that struggle with access to current wireless services and signals.

Analyst firm IDC expects the global 5G and LTE router and gateway market to grow from approximately $979 million in 2019 to just under $3 billion in 2024. Counterpoint Research also projects 5G fixed wireless access growing from 10.3M subscribers in 2020 to over 450M subscribers by 2030.  

The MediaTek T750 chipset supports 5G sub-6GHz frequencies and two component carrier aggregation (2CC CA) for extended coverage, making it ideal for indoor and outdoor fixed wireless access products, like home routers, as well as mobile hotspots. In addition, the T750 design, which includes a 5G NR FR1 modem, quad-core Arm Cortex-A55 processors and the required peripherals all on a single chip, offers performance and time-to-market advantages that speed up ODM/OEM development times.

"Operators can take advantage of 5G capabilities, high bandwidth and low latency to offer 5G FWA services supporting fiber-like experience for consumers and businesses. As adoption of live video streaming and latency intensive applications such as gaming, AR/VR based online applications is increasing, 5G FWA services are expected gain momentum," said Khin Sandi Lynn, industry analyst from ABI Research. "MediaTek’s 5G chipsets for FWA routers will certainly fulfill the market demand as well as accelerate the competition in the FWA CPE ecosystem. In addition, the support of sub-6GHz band is a perfect solution for many of the operators planning to achieve wide service coverage in a short time frame."

For consumers, the T750 offers a compact 5G device that they can self-install and avoid the hassles of lengthy installation times for fixed line broadband. For operators, the T750 will provide 5G speeds right out the box to rival fixed line services without incurring costs for laying down cables or fiber. The T750 chipset comes pre-integrated with software drivers for MediaTek’s connectivity solutions such as our 4×4 and 2×2 + 2×2 dual-band Wi-Fi 6 chipsets for distributing fast 5G internet to consumers’ favorite client devices.

Additional T750 features include:

  • Support for standalone and non-standalone (SA/NSA) sub-6GHz 5G networks
  • Two component 5G FR1 carrier aggregation in both FDD and TDD modes
  • Support for up to 5CC LTE carrier aggregation
  • Embedded GPU and display driver to support a HD display up to 720p
  • Four PCIe interfaces for external Wi-Fi and Bluetooth
  • Two 2.5Gbps SGMII interfaces to allow for a variety of LAN configurations
  • PCM interface for external land-line phones

The T750 joins the MediaTek family of 5G chips powering smartphones, smart homes and PCs. It leverages MediaTek’s existing integrated circuits and intellectual property to help OEMs accelerate time to market. MediaTek recently introduced its T700 5G data card connectivity solution for PCs and other embedded applications. MediaTek boasts a full tier of 5G Dimensity chips for smartphones. The Dimensity series are powerful and power-efficient chipsets offering unrivaled connectivity, multimedia, AI and imaging innovations for premium and mid-tier smartphones. MediaTek is also the number one Wi-Fi supplier across broadband, retail routers, consumer electronics devices and gaming, and its Wi-Fi 6 chipsets are powering the latest networking equipment for faster computing experiences.

For more information about MediaTek’s 5G portfolio, please visit: https://i.mediatek.com/mediatek-5g.

###                    

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 1.5 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek Press Office:

PR@mediatek.com
Kevin Keating, MediaTek
+1- 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

 

Related Links :

http://www.mediatek.com

PR Newswire

ChipMOS to Present at 21st Credit Suisse Asian Technology Conference.

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HSINCHU, Sept. 1, 2020 — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present at the 21st Credit Suisse Asian Technology Conference to be held virtually from Wednesday, September 9 to Friday, September 11, 2020.

Management from the Company, including Jesse Huang, Vice President of Strategy and Investor Relations, will meet virtually with institutional investors to discuss the Company’s recent financial results, business trends and growth opportunities.  The Company’s latest investor update is available on the investor relations’ section of its website at www.chipmos.com.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 

Related Links :

https://www.chipmos.com

PR Newswire

Quectel’s New Generation Smart Modules Certified by Verizon

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SHANGHAI, Aug. 31, 2020 — Quectel Wireless Solutions (603236.SS), the leading global supplier of cellular and GNSS modules, has announced that Verizon has approved its new generation Smart Modules, the SC600T-NA and SC600Y-NA, for operation on Verizon’s 4G LTE network.

The SC600T-NA and SC600Y-NA are industrial grade LTE Cat 6 modules with an operational and certified built-in Android 9.0 OS. The SC600T-NA is based on Qualcomm® Snapdragon™ MSM8953 and the SC600Y-NA adopts Qualcomm® Snapdragon™ SDM450. The former supports Octa-core A53 up to 2.0 GHz, camera 24 MP and video 4K at 30 fps, while the latter supports Octa-core A53 up to 1.8 GHz, camera 21 and video 1080 at 60 fps. Both modules integrate 2 GB LPDDR3 + 16 GB eMMC flash and support WUXGA display.

With powerful engines, the two modules are fully integrated with Bluetooth, Wi-Fi capability and strong multimedia functions include support for dual LCDs and dual touch panels with independent display and operation. The modules can support a maximum of four cameras with two working simultaneously. Quick Charge 3.0 technology can facilitate various smart devices, including vending machines, smart cash registers, smart delivery machines and more.

Designed for North America, both modules work on FDD-LTE bands B2/B4/B5/B7/B12/B13/B14/B17/B25/ B26/B66/B71, TDD-LTE band B41 and WCDMA bands B2/B4/B5. In addition, the multi-constellation GNSS receiver is available in both modules, which is ideal for applications that require fast and accurate fixes, such as in-car video streaming and live video devices.

"These two modules for North America have passed another industry milestone. They will enable IoT designers, manufacturers and their customers to utilize the latest and leading LTE network technologies from America’s most awarded network," said Patrick Qian, Chairman and CEO of Quectel. "The new generation Cat 6 smart modules are critical for devices to utilize the processing power whenever needed."

About Quectel

Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we create superior cellular and GNSS modules backed by outstanding support and services. Our growing global team of 1800 professionals, the largest in the IoT modules industry worldwide, ensures we are first to market and continue to set the pace of development. Listed on the Shanghai Stock Exchange (603236.SS), our international leadership is devoted to advancing IoT across the globe. For more information, visit www.quectel.com, LinkedIn, Facebook and Twitter

Ashley LIU
Tel: +86 551 6586 9386 x 8016
media@quectel.com

Related Links :

IoT Modules, IoT Antennas and Certification Services
PR Newswire

G-ray Switzerland announces new CEO, closes successful funding round

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NEUCHÂTEL, Switzerland, Aug. 31, 2020 — G-ray Switzerland, the medical imaging and industrial diagnosis start-up founded in 2014, has announced the appointment of Luis Pallares as Chief Executive Officer, as the company embarks on an accelerated growth drive and completes a successful funding round.

Mr Pallares is focused on leading the transformation of G-ray’s business development efforts following the company’s development of a disruptive and patented state of the art technology to bring safer, cheaper and better vision into imaging for medical and industrial diagnosis.

Mr Pallares joins G-ray with a wealth of entrepreneurial and start-up experience, having founded Spain’s first streaming service, Addhoc Streaming, Spanish-speaking health related content site Vivir Mejor, and Spain’s leading digital strategy firm, Nennisiwok.

Most recently Mr Pallares’ deep experience in technology development, artificial intelligence and digital advertising led him found Plyzer Technologies, a global leader of price comparison technology matched with business analytics and intelligence based on artificial intelligence.

The appointment coincides with the news that G-ray has also raised a further CHF 2.6 millions, enabling it close out its successful Series A funding round at CHF 28 million.

Luis Pallares, Chief Executive Officer of G-ray, said: "G-ray has already proven to be a positive disruptive force within the technology industry and I relish the opportunity to help deliver tangible progress by bringing improvements in imaging into medical and industrial diagnosis."

Mr Yves Claude Aubert, Chairman of G-ray Switzerland, said: "Our technology has already started to disrupt the multi-billion particle detection imaging markets, based on our proprietary and transformative unique detector architecture. As artificial intelligence impacts the traditional X ray detector market, Luis is the perfect choice to lead G-ray forward into a new phase of growth and to capture these opportunities.

About G-ray Switzerland

Founded in 2014 in Neuchâtel, G-ray Switzerland SA has filed a number of revolutionary patents in the fields of radiographic imaging and new semiconductor assembly techniques. The rapidly expanding company has developed core skills in monolithic detectors with integrated high-resolution CMOS circuits. These innovations cover a wide range of sectors, including automotive, aerospace and medicine. www.g-ray.ch

 

 

Related Links :

http://www.g-ray.ch

PR Newswire

SIMCom Has Invested over RMB 500 Million in 5G and Is Expected to Launch R16 Standard Modules Next Year

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SHANGHAI, Aug. 28, 2020 — The 5G era will see a smart world where everything is truly connected. Modules are extremely important as they connect upstream standard chips and downstream highly fragmented vertical applications. Luo Xiaoyan, the vice president of SIMCom, shared his opinion.

SIMCom 5G modules
SIMCom 5G modules

With Heavy Demand for 5G Modules, Lots of Orders Will Be Ready for Delivery

Luo Xiaoyan shared: In 2020, the market capacity of 5G IoT terminals will reach about 5 million. Generally, communication modules are needed for non-mobile cellular IoT terminals to get connected. The freezing of R16 standard means the official completion of 5G’s first evolution. Applications including automatic drive and industrial IoT will be achieved sooner, further realizing customers’ imagination on 5G.

"SIMCom is actively planning for the R16 standard modules and are expected to be launched next year." Luo Xiaoyan predicted optimistically, "There is heavy demand for 5G modules. We have lots of orders ready for delivery."

Despite a bright market future, the research and development of 5G modules in the initial commercial stage will still face many challenges.

"Due to multiple frequency bands, the research and development of 5G modules face challenges mainly from RF performance and heat dissipation. We need to make breakthroughs with technological development and innovation." Luo Xiaoyan said, "5G R&D investments are mostly made in researchers, developers, new tools and equipment. Currently, SIMCom has invested over RMB 500 Million in 5G R&D."

In addition, the price of 5G modules is relatively high. Customers in the industry are in urgent need of lower-priced 5G modules to reduce costs and facilitate large-scale deployment. In Luo Xiaoyan’s view, the price of modules is strongly related to the quantity of modules. As 5G applications become increasingly widespread and the quantity of 5G modules grows, the price of modules will gradually decrease. Meanwhile, SIMCom is also actively reducing costs by using more cost-effective components to reduce the cost of 5G modules. Meanwhile, SIMCom is deploying the China Core Project. It’s currently negotiating 5G module partnership with a number of chip manufacturers.

About SIMCom

SIMCom Wireless Solutions Limited is a global leader in the cellular module space and fully committed to provide LPWA, 4G, Smart Modules, C-V2X, 5G modules around the world.

For more information, please visit www.simcom.com, LinkedIn, Twitter and Facebook.

Related Links :

http://www.simcom.com

PR Newswire

“I Love Being Pioneer”– Interview with Prominent WPI-MANA Researcher

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TSUKUBA, Japan, Aug. 28, 2020 — The International Center for Materials Nanoarchitectonics (WPI-MANA), a unit of the National Institute for Materials Science (NIMS), welcomed Honorary Professor Hideo Hosono of Tokyo Institute of Technology as a NIMS Distinguished Fellow and the leader of the Electro-Active Materials Team.

(Photo: https://kyodonewsprwire.jp/prwfile/release/M105739/202008183234/_prw_PI1fl_es00fXV1.jpg)

Prof. Hosono, the world-renowned researcher, is famous for creating amorphous oxide semiconductor IGZO-TFTs and room temperature-stable electrides, and discovering iron-based superconductors. He discusses his life and work in an interview.

Q: You have done important work in a variety of fields. What’s your secret?

"I don’t have any secrets. I’ve just been focusing on what I want to do without restrictions on the technical or academic field. For example, chemistry and physics as two separate disciplines have little meaning in materials science. My main interest is in functional materials utilizing electrons in solids. In the case of semiconductors, I study the movement of electrons under an electric field, and superconductors are similar–you manipulate electrons in catalysis to react with molecules on a surface.

"My PhD thesis was on line shape analysis of electron spin resonance spectra in glass–rather fundamental work. After that, I did joint work in the material sciences department at Nagoya Institute of Technology, where I worked with ceramics, especially photoactive glasses and protonic conduction in glass. I did ion implantation into SiO2 glass for a year at Vanderbilt University in the U.S. as well as research at Oak Ridge National Lab, in Tennessee.

"I returned to Japan, to Tokyo Tech, and changed my research topic from photoactive glasses to oxide semiconductors. The most visible result of my work at that time was the proposal of transparent amorphous oxide semiconductors for thin film transistors, leading to the IGZO TFT, which is now used in high-resolution LCD panels such as tablets and OLEDs for TV screens. When I started this research in 1993, there was almost no work being done in the field. But now, 25 years later, oxide semiconductors are the world standard for TFTs for flat-panel displays and beyond. It was during this work on oxide semiconductors that we discovered iron-based superconductors."