HONG KONG, Sept. 11, 2020 — Cogobuy Group ("Cogobuy" or the "Company", stock code: 400.HK; with its subsidiaries (the ”Group”)) is pleased to announce the Company’s non-wholly owned subsidiary Comtech Industrial Technology (Shenzhen) Company Limited ("Comtech Industrial"), a technical service platform engaged in chip sales under the name of "Ingdan Innovations",…
ChipMOS REPORTS AUGUST 2020 REVENUE
HSINCHU, Sept. 9, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of August 2020. All U.S. dollar figures cited in this press release are…
Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government’s Consideration to Add the Company to a Trade Blacklist
SHANGHAI, Sept. 5, 2020 — Reuters reported Friday, September 4 (EST), citing a Defense Department official that the Trump administration is considering whether to add China’s top chipmaker SMIC to a trade blacklist. SMIC solemnly declares that the Company, a public company listed on the Hong Kong Stock Exchange and…
Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States
MediaTek’s Dimensity 1000C delivers premium 5G experiences, advance AI capabilities, enhanced display features and ultra-fast connectivity TAIPEI, Sept. 3, 2020 — MediaTek today announced its newest 5G smartphone chip, the Dimensity 1000C, which debuted first in the United States. MediaTek’s Dimensity 1000C 5G smartphone chipset…
MediaTek Advances its 5G Platform with New T750 5G Chipset for Fixed Wireless Access Routers and Mobile Hotspot CPE Devices
Highly integrated, low-power T750 5G chipset delivers 5G broadband experience for 5G NR sub-6GHz frequencies HSINCHU, Taiwan, Sept. 3, 2020 — MediaTek today announced its T750 5G chipset to power next generation 5G CPE wireless products, like fixed wireless access routers (FWA) and mobile hotspots, to bring fast 5G connectivity into…
ChipMOS to Present at 21st Credit Suisse Asian Technology Conference.
HSINCHU, Sept. 1, 2020 — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present at the 21st Credit Suisse Asian Technology Conference to be held virtually…
Quectel’s New Generation Smart Modules Certified by Verizon
SHANGHAI, Aug. 31, 2020 — Quectel Wireless Solutions (603236.SS), the leading global supplier of cellular and GNSS modules, has announced that Verizon has approved its new generation Smart Modules, the SC600T-NA and SC600Y-NA, for operation on Verizon’s 4G LTE network. The SC600T-NA and SC600Y-NA are industrial grade LTE Cat…
G-ray Switzerland announces new CEO, closes successful funding round
NEUCHÂTEL, Switzerland, Aug. 31, 2020 — G-ray Switzerland, the medical imaging and industrial diagnosis start-up founded in 2014, has announced the appointment of Luis Pallares as Chief Executive Officer, as the company embarks on an accelerated growth drive and completes a successful funding round. Mr Pallares is focused on leading the transformation of…
SIMCom Has Invested over RMB 500 Million in 5G and Is Expected to Launch R16 Standard Modules Next Year
SHANGHAI, Aug. 28, 2020 — The 5G era will see a smart world where everything is truly connected. Modules are extremely important as they connect upstream standard chips and downstream highly fragmented vertical applications. Luo Xiaoyan, the vice president of SIMCom, shared his opinion. SIMCom 5G modules …
“I Love Being Pioneer”– Interview with Prominent WPI-MANA Researcher
TSUKUBA, Japan, Aug. 28, 2020 — The International Center for Materials Nanoarchitectonics (WPI-MANA), a unit of the National Institute for Materials Science (NIMS), welcomed Honorary Professor Hideo Hosono of Tokyo Institute of Technology as a NIMS Distinguished Fellow and the leader of the Electro-Active Materials Team. (Photo: https://kyodonewsprwire.jp/prwfile/release/M105739/202008183234/_prw_PI1fl_es00fXV1.jpg) Prof. Hosono,…