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PR Newswire

Correction: WiMi Announces Acquisition of Fe-da Electronics Company Pte Ltd

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BEIJING, Nov. 5, 2020 — WiMi Hologram Cloud Inc. (Nasdaq: WIMI) ("WiMi" or the "Company"), a leading augmented reality ("AR") service provider in China, announces that its wholly-owned subsidiary, VIYI Technology Inc. ("VIYI Technology"), has entered into an agreement for the acquisition of 100% equity interests of Singapore-based Fe-da Electronics Company Pte Ltd. ("Fe-da Electronics") to accelerate the development of the Company’s semiconductor chip business. According to the financial statements provided by Fe-da Electronics, the revenues of Fe-da Electronics amounted to US$45,892,564 and US$70,770,218 for 2018 and 2019, respectively, both of which have exceeded the total revenues of WiMi in their respective periods. Through integrating Fe-da Electronics, the Company seeks to further optimize its financial model so as to improve its business growth and market size, and create more value for its investors.

The main businesses of Fe-da Electronics are the customization of central processing units ("CPU") for computers and servers and the production of storage devices, including SSD and RAM storage devices. After integrating Fe-da Electronics into VIYI Technology, the Company plans to both retain and strengthen Fe-da Electronics’ current team, fostering meaningful synergies in its development of central processing algorithm services. The Company also plans to utilize Fe-da Electronics’ existing artificial intelligence ("AI") and cloud computing technologies to further unlock its potential in the development of cloud service solutions.

Through the Company’s integration of Fe-da Electronics’ semiconductor businesses, the Company will further strengthen its central processing algorithm services, launch an integrated hardware-software system for enterprise and industrial data centers, and help better facilitate the digital transformation process by providing the entire industry, especially small- and medium-sized enterprises, with integrated cloud computing products and services. Furthermore, the Company will also leverage Fe-da Electronics’ resources to further establish its presence in Mainland China, Hong Kong, Taiwan, Southeast Asia, and other areas.

Mr. Shuo Shi, Chief Executive Officer of WiMi, commented, "Our acquisition of Fe-da Electronics marks a very important milestone in our journey to achieve our long-term goal of becoming a global leader in CPU AI algorithms. In addition, our integration with Fe-da Electronics will create significant synergies in the areas of technology, product development, and market coverage, helping us to seize those market opportunities in the field of central processing algorithm services and develop more unique competitive advantages. Going forward, we plan to leverage these advantages to capture related market opportunities, move closer towards the fulfillment of our long-term goals in both AI algorithms and cloud computing services, and create more value for our shareholders over the long term."

About WIMI Hologram Cloud Inc.

WiMi Hologram Cloud, Inc.(NASDAQ: WIMI), whose commercial operations began in 2015, operates an integrated holographic AR application platform in China and has built a comprehensive and diversified holographic AR content library among all holographic AR solution providers in China. Its extensive portfolio includes 4,654 AR holographic contents. The company has also achieved a speed of image processing that is 80 percent faster than the industry average. While most peer companies may identify and capture 40 to 50 blocks of image data within a specific space unit, WiMi collects 500 to 550 data blocks.

Safe Harbor / Forward-Looking Statements

This press release contains "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements can be identified by terminology such as "will," "expects," "anticipates," "future," "intends," "plans," "believes," "estimates" and similar statements. Statements that are not historical facts, including statements about the Company’s beliefs and expectations, are forward-looking statements. Among other things, the business outlook and quotations from management in this press release, as well as the Company’s strategic and operational plans, contain forward−looking statements. The Company may also make written or oral forward−looking statements in its periodic reports to the U.S. Securities and Exchange Commission ("SEC") on Forms 20−F and 6−K, in its annual report to shareholders, in press releases and other written materials and in oral statements made by its officers, directors or employees to third parties. Forward-looking statements involve inherent risks and uncertainties. A number of factors could cause actual results to differ materially from those contained in any forward−looking statement, including but not limited to the following: the Company’s goals and strategies; the Company’s future business development, financial condition and results of operations; the expected growth of the AR holographic industry; and the Company’s expectations regarding demand for and market acceptance of its products and services. Further information regarding these and other risks is included in the Company’s annual report on Form 20-F and current report on Form 6-K and other documents filed with the SEC. All information provided in this press release is as of the date of this press release, and the Company does not undertake any obligation to update any forward-looking statement, except as required under applicable laws. 

Contacts

WIMI Hologram Cloud Inc.
Email: pr@wimiar.com

ICR, LLC
Sharon Zhou
Tel: +1 (646) 975-9495
Email: wimi@icrinc.com

PR Newswire

300mm Fab Spending to Boom Through 2023 With Two Record Highs, SEMI Reports

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Chip industry to add 38 new 300mm fabs by 2024

MILPITAS, California, Nov. 3, 2020 — 300mm fab investments in 2020 will grow by 13% year-over-year (YoY) to eclipse the previous record high set in 2018 and log another banner year for the semiconductor industry in 2023, SEMI reported today in its 300mm Fab Outlook to 2024. The COVID-19 pandemic has sparked the 2020 surge in fab spending by accelerating digital transformations worldwide, and the increase is expected to stretch into 2021.

Figure 1: 300mm fab equipment spending from 2013 to 2024
Figure 1: 300mm fab equipment spending from 2013 to 2024

Powering the growth is rising demand for cloud services, servers, laptops, gaming and healthcare technology. Fast-evolving technologies such as 5G, Internet of Things (IoT), automotive, artificial intelligence (AI) and machine learning that continue to fuel demand for greater connectivity, large data centers and big data are also behind the increase.

"The COVID-19 pandemic is accelerating a digital transformation sweeping across nearly every industry imaginable to reshape the way we work and live," said Ajit Manocha, SEMI president and CEO. "The projected record spending and 38 new fabs reinforce the role of semiconductors as the bedrock of leading-edge technologies that are driving this transformation and promise to help solve some of the world’s greatest challenges."

Growth in semiconductor fab investments will continue in 2021 but at a slower rate of 4% YoY. Mirroring previous industry cycles, the report also predicts a mild slowdown in 2022 and another slight downturn in 2024 following a $70 billion record high in 2023. See figure 1.

Adding 38 New 300mm Fabs 

The SEMI 300mm Fab Outlook to 2024 shows the chip industry adding at least 38 new 300mm volume fabs from 2020 to 2024, a conservative projection that does not factor in low-probability or rumored fab projects. During the same period, per-month fab capacity will grow by about 1.8 million wafers to reach over 7 million. See figure 2.

Under a high-probability project forecast, the industry will add at least 38 new 300mm volume fabs from 2019 to 2024. Taiwan will add 11 volume fabs and Mainland China eight to account for half of the total. The chip industry will command 161 300mm volume fabs by 2024.

Capacity and Spending Growth by Region

Mainland China will rapidly increase its global share of 300mm capacity, from 8% in 2015 to 20% in 2024, reaching 1.5 million 300mm wpm in the final year of the reporting period. While non-Chinese companies will account for a substantial portion of that growth, Chinese-owned organizations are accelerating their capacity investments. These companies will represent about 43% of Mainland China’s fab capacity in 2020, a proportion expected to reach 50% by 2022 and 60% by 2024.

Japan’s share of 300mm installed capacity continues to trend downward, from 19% in 2015 to 12% in 2024. The Americas’ share is also ticking lower, from 13% in 2015 to a projected 10% in 2024.

The biggest regional spenders will be Korea, with investments between US$15 billion and US$19 billion, followed by Taiwan, which will pour between US$14 billion and US$17 billion into 300mm fabs, and then Mainland China, with between US$11 billion and $13 billion in investments. 

Regions spending less will see the steepest increases in investments between 2020 to 2024.  Europe/Mideast will lead the pack with impressive 164% growth, followed by Southeast Asia at 59%, Americas at 35%, and Japan at 20%.

Spending Growth by Product Sector

Memory accounts for the bulk of the increase in 300mm fab spending. Actual and forecast investments show a steady rise in the upper single digits for each year from 2020 to 2023, with a stronger increase of 10% in store for 2024.

DRAM and 3D NAND contributions to 300mm fab spending will be uneven from 2020 to 2024. Investments for logic/MPU, however, will see steady improvement from 2021 to 2023. Power-related devices will be the standout sector in 300mm fab investments, with over 200% growth in 2021 and double-digit increases in 2022 and 2023.

Tracking 286 fabs and lines from 2013 to 2024, the 300mm Fab Outlook to 2024 reflects 247 updates to 104 fabs, nine new fab and line listings, and two cancellations since the publication of the March 2020 report.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

Christian G. Dieseldorff/SEMI
Phone: 1.408.943.7940
Email: cdieseldorff@semi.org  

 

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Related Links :

http://www.semi.org

PR Newswire

LG Innotek’s high-efficiency ferrite, Advancing the Era of Ultra-Slim OLED TVs Under 2cm Thick

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  • Ultra-slim TV and lightweight vehicles with improved energy efficiency
  • Reduced development period to 1/4 of projected time, achieving world-class performance
  • Internalization of core materials to provide differentiated customer value

SEOUL, South Korea, Oct. 18, 2020 — LG Innotek announced on the 19th that it has successfully developed a high-efficiency ferrite with the lowest power loss in the world. This development has contributed to LG Innotek’s dominance in the TV and vehicle power markets.

LG Innotek’s high-efficiency ferrite
LG Innotek’s high-efficiency ferrite

Ferrite is a magnetic material with iron oxide as its primary raw material, and ferrite powder is hardened into a tile shape for industrial use. It is usually installed in TV power modules, vehicle power sources, and chargers (On Board Charge, OBC) to change the voltage or remove unnecessary signals generated by current surges. This provides a stable power supply to display panels for TVs and air conditioners, as well as audio systems for vehicles.

As home appliances and electric vehicles have become increasingly smaller and more functional, high-efficiency ferrite– which is advantageous for ultra-slim and high-efficiency products– is being touted as a next-generation material.

The high-efficiency ferrite developed by LG Innotek has a maximum of 40% less power loss from heat compared to general ferrite. In addition, its low-loss characteristics are maintained at temperatures of -40 degrees Celsius to 140 degrees Celsius, giving it the advantage of realizing perfect quality in high-temperature TV interiors and various driving environments.

  • Ultra-slim TV and lightweight vehicles with improved energy efficiency

LG Innotek’s high-efficiency ferrite is advantageous in making ultra-slim TVs and reducing the weight of vehicles to increase fuel efficiency for electric and hydrogen vehicles.

Using this material allows a 60% reduction in TV thickness by making the TV power module only 9.9mm, the thinnest in the world. The normal thickness of a 65-inch ultra-slim OLED TV equipped with a general power module is about 46.9mm. When a high-efficiency ferrite power module is applied, the thickness can be reduced to 20mm or less. This is because the number of components for securing the required power is reduced by 1/3 due to low power loss.

In addition, high-efficiency ferrite can increase the energy efficiency of TV power modules up to 5%points. As the energy efficiency of a component increases, heat generation is reduced and the damage caused by heat minimized, thereby extending the life of the component.

When this product is applied to a vehicle DC-DC converter, the volume and weight of the converter can be reduced by 10% compared to the previous model, and the energy efficiency of the converter can be increased up to 1.2%points.

It also helps reduce the risk of fire due to the overheating of vehicle power. The low heat generation of high-efficiency ferrite can lower the temperature of components by up to 20 degrees Celsius compared to previous models.

  • Reduced development period to 1/4 of projected time, achieving world-class performance

In the field of ferrite, Japanese companies have dominated the market with the No. 1 technology in the world. However, Japanese products have been expensive and difficult to supply.

In response to this, LG Innotek became fully engaged in the development of high-efficiency ferrite starting in 2018. Since LG Innotek decided it would be difficult to close the gap with Japanese products using existing development methods, LG Innotek has applied simulation techniques such as digital transformation (DX) and artificial intelligence (AI) methods to design materials for the first time in the industry.

LG Innotek automates the process of finding the best-performing material composition ratio with supercomputers, greatly reducing the time and frequency of experiments while enhancing the accuracy of results. In the past, researchers conducted thousands of direct experiments to find the optimal ratio, which took a long time and was susceptible to user errors.

By making active investments in employing the latest software, technical advices, and industry-university cooperation, LG Innotek has successfully shortened their development period from a projected four years to only one year and four months.

  • Internalization of core materials to provide differentiated customer value

LG Innotek’s strategy is to strengthen its competitiveness by expanding the application of high-efficiency ferrite, a core material for its products.

In addition, LG Innotek is actively pushing ahead with promotional activities for global electronic companies and automakers with the aim of mass production of materials in the first half of next year. Also, in order to solidify its position as the No. 1 technology company in the field of high-efficiency ferrite, LG Innotek is spurring the advanced development of materials with improved performance based on approximately 120 related patents.

"It is a significant achievement that LG Innotek’s unique method of internalizing core materials in a short time has enabled us to provide a stable product supply with the best performance and quality to customers," said Bae Seok, a research fellow of Magnetic Components Task in LG Innotek’s CTO Division. "We will continue to provide differentiated value to our customers by utilizing magnetic materials," he continued.

For more information, please refer to the website: www.lginnotek.com

 

Related Links :

http://www.lginnotek.com/

PR Newswire

RS Components launches 94% efficient POL converters covering most standard bus and battery voltages

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Versatile switching regulators are drop-in replacements for LMxx devices

SHANGHAI, Oct. 16, 2020 — RS Components (RS), a trading brand of Electrocomponents plc (LSE: ECM), a global omni-channel solutions partner for industrial customers and suppliers, has added the new TRACO Power TSR-WI Series of non-isolated POL (point of load) DC/DC converters to its product portfolio. TSR-WI devices offer high efficiencies of up to 94%, along with low standby current and excellent line/load regulation.

The TSR-WI Series comprises two families of single-output switching regulator — known as TSR-0.6WI and TSR-1WI, with 0.6A and 1A maximum output current ratings, respectively — and output voltage options of 3.3V, 5V, 6.5V, 9V, 12V, 15V and 24V. Each family offers input voltage ranges of up to 9–72VDC — an ultra-wide ratio of 8:1— easily covering the majority of standard bus and battery voltages that electronics designers may need to deal with together in distributed power systems. Allowing designers to standardise on one type of converter in different situations can effectively reduce the bill of materials (BOM) for many applications.

Housed in industry standard SIP-3 packages, TSR-WI devices are pin compatible with commonly used LMxx linear regulators and can function as more energy efficient drop-in replacements for these devices.

Standard features of the TSR-WI Series include protections against short circuit, over-voltage and over-temperature. The high efficiency of the devices allows a wide operating temperature range, from -40° to +80°C (TSR-1WI) or +85°C (TSR0.6WI) without the need for heat sinking.

TRACO TSR-WI Series DC/DC converters are supported by a three-year manufacturer’s warranty and are available now from RS in China.

About RS Components

RS Components is a trading brand of Electrocomponents plc, a global omni-channel solutions partner for industrial customers and suppliers involved in designing, building or maintaining industrial equipment and facilities. We offer customers unrivalled choice of product technologies, solve problems with innovative solutions and deliver a world-class customer experience, making it easy to do business with us.

We stock more than 500,000 industrial and electronic products, sourced from over 2,500 leading suppliers. We solve problems and provide a wide range of value-added solutions to over one million customers. With operations in 32 countries, we trade through multiple channels and ship over 50,000 parcels a day.

For more information, visit the website at https://rsonline.cn/web/.

Weibo: https://weibo.com/rscomponents?refer_flag=1001030103_&is_all=1 
Linkedin: https://www.linkedin.com/showcase/rs-components-asia-pacific/

Related Links :

https://rsonline.cn

PR Newswire

ChipMOS REPORTS SEPTEMBER 2020 AND 3Q20 REVENUE, REPRESENTING A QUARTERLY SIX YEAR HIGH

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HSINCHU, Taiwan, Oct. 8, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of September 2020 and for the third quarter ended September 30, 2020.  All U.S. dollar figures cited in this press release are based on the exchange rate of NT$28.95 to US$1.00 as of September 30, 2020.

Revenue for the third quarter of 2020 was NT$5,686.2 million or US$196.4 million, representing an increase of 5.3% from the third quarter of 2019, and an increase of 4.8% from the second quarter of 2020.

Revenue for the month of September 2020 was NT$1,897.1 million or US$65.5 million, representing an increase of 8.4% from September 2019, and a decrease of 0.3% from August 2020.  

The Company noted this represents a quarterly six year high.  ChipMOS continues to benefit from strong growth in its DDIC revenue following a tightening of the supply chain, inventory and capacity in the first half of 2020, as it works with customers to efficiently meet higher demand levels.

Consolidated Monthly Revenues (Unaudited)

September 2020

August 2020

September 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,897.1

1,902.5

1,749.6

-0.3%

8.4%

Revenues

(US$ million)

65.5

65.7

60.4

-0.3%

8.4%

Consolidated Quarterly Revenues (Unaudited)

Third Quarter
2020

Second Quarter

2020

Third Quarter

2019

QoQ Change

YoY Change

Revenues

(NT$ million)

5,686.2

5,428.1

5,399.1

4.8%

5.3%

Revenues

(US$ million)

196.4

187.5

186.5

4.8%

5.3%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 

PR Newswire

Media Alert: Supermicro Delivers the Latest Product Updates in Live Presentations at Nikkei X-TECH EXPO 2020

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Supermicro’s Japan Leadership Presents the Latest Storage System Innovations and Storage Solutions for Enterprise, Data Centers, and Cloud Markets

TOKYO, Oct. 7, 2020 — Supermicro will present at the virtual Nikkei X-TECH EXPO 2020 its latest server and storage system for AI, 5G, IoT, and enterprise markets. Nikkei X- TECH EXPO 2020 is one of the largest technology events in Japan. It brings together representatives from key Japanese and APAC companies to hear the latest global developments from leading hardware, software, and system integrators in storage and server technology.

What: Supermicro Delivers Live Product and Market Updates

Where: Nikkei X-TECH EXPO 2020 (Virtual)

When: (all times local in Japan)

  • October 12, 2020-11:10-11:40 – EnterpriseDX: Session No. E-1211
    • Speaker: Mitsuru Yabe
    • Topic: Optimizing the TCO meanwhile achieving both performance and efficiency improvement with the selection of the most suitable hardware
  • October 14, 2020-14:40-15:10 – Business AI: Session No. A-1441
    • Speaker: Akira Sano
    • Topic: AI / Deep Learning system optimization and its future development by Supermicro
  • October 16, 2020-15:50-16:20 – IoT: Session No. T-1651
    • Speaker: Hidetoshi Iwasa
    • Topic: Introducing use cases of IoT solutions that utilize intelligent edge devices

Who:

  • Mitsuru Yabe (Technical Marketing Director, Supermicro)
  • Akira Sano (Senior Director Solution Optimization Engineering, Supermicro)
  • Hidetoshi Iwasa (Senior FAE, Supermicro)

Please click here for more information and to register.

About Super Micro Computer, Inc.

Supermicro (Nasdaq: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners.

SMCI-F 

Related Links :

http://www.supermicro.com

PR Newswire

Picosun’s ALD technology boosts UVC LED performance

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ESPOO, Finland, Sept. 24, 2020 — Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, reports excellent results in UVC (ultraviolet-C) LED performance, achieved with the company’s ALD solutions.

Excellent reliability and lifetime improvements of UVC LEDs have been obtained at Picosun’s customer and collaboration partner site, National Chiao Tung University (NCTU), Taiwan, using passivation and barrier films deposited with PICOSUN® ALD equipment(*). ALD passivation layer could potentially replace the expensive hermetic seal package of the LEDs and thus lower the costs of the final device.

"We have used Picosun’s ALD technology already for years with great success. Our PICOSUN® ALD equipment yields superior quality films which has helped us to achieve several breakthroughs in our LED research. Picosun has local presence in Taiwan and we appreciate the prompt response of their customer support if we ever have any issues. At the phase when R&D results are to be ramped up to industrial-level production, the scalability of Picosun’s ALD technology is a huge benefit," comments Professor Hao-Chung Kuo from NCTU.

In order to reach maximum light output and long operating lifetime, LED chips require surface passivation to eliminate parasitic currents caused by traps and defects. Also barrier coating is typically needed as LED materials are sensitive to moisture. ALD is an ideal technique to manufacture both the passivation and barrier films – and when the LED size diminishes to micrometer dimensions, the only coating method capable of producing high enough quality films on the required minuscule scale. Ultra-thin, pinhole-free ALD films do not suppress the LED light intensity and they provide reliable protection against ambient conditions, whereas their superior conformality ensures no thickness variations between the facets of the LED chip. Thickness variations, typical side effect of other coating methods, can potentially lead to uneven distribution of film stress or thermal expansion behavior and risk physical damage of the chip.

Short-wavelength UVC radiation destroys bacteria and viruses so UVC LED technology is particularly topical now during the still ongoing COVID-19 pandemic. Small, lightweight LEDs enable versatile design of portable, compact disinfecting equipment, they consume less power than other UVC sources, they are durable, and they pose no risk of hazardous material leaks such as e.g. mercury lamps.

"We are happy of the achievements of Professor Kuo’s group at NCTU, and how Picosun’s ALD technology has helped them to achieve their goals in UVC LED development. Our long-term collaboration and networking with both the academia and prominent industries in this field gives us the perfect synergy advantage to facilitate implementation of these solutions in industrial manufacturing," says Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd.

(*) UVC LED with 50 nm ALD Al2O3 passivation and normal LED packaging (no hermetic seal) maintained 80% of its original efficiency even after 500 hours environmental test at 85% humidity and 85 oC temperature.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:

Mr. Edwin Wu
CEO, Picosun Asia Pte. Ltd.
Tel: +358 40 480 3449
Email: info@picosun.com
Web: www.picosun.com 

CONTACT:

Minna Toivola
D.Sc., Marketing Manager, Picosun Oy
Email: minna.toivola@picosun.com
Tel: +358 40 758 8748

 

This information was brought to you by Cision http://news.cision.com

https://news.cision.com/picosun-oy/r/picosun-s-ald-technology-boosts-uvc-led-performance,c3201590

The following files are available for download:

https://mb.cision.com/Main/16058/3201590/1309927.pdf

Picosun’s ALD technology boosts UVC LED performance
PR Newswire

AUTOCRYPT Announces Official Partnership with NXP for Integrated V2X Security Solutions

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SEOUL, South Korea, Sept. 24, 2020 — AUTOCRYPT Co., Ltd., a leading V2X and autonomous vehicle security solutions provider, announced its partnership with NXP Semiconductors in several automotive security related applications beginning with secure V2X.

As an official partner of NXP, support for AutoCrypt V2X will be streamlined across NXP’s V2X-related offerings, including the SAF5X00 modem chipsets and the SXF1800 Secure Element IC for V2X Communication, as well as the i.MX 8 Series Application Processor. By integrating AUTOCRYPT’s IEEE 1609.2-compliant V2X security solution onto NXP’s platform, secure exchange of V2X messages as well as performance optimization can be achieved more effectively.

Regarding the partnership, AUTOCRYPT CEO and co-Founder Daniel ES Kim stated, "As an increasing number of vehicles and infrastructure rely on connectivity, it is tantamount that processors have the highest ability to secure V2X communication. As a major player in the automotive market, NXP values security as much as AUTOCRYPT. We are looking forward to joint solution development to continue to progress in our target to keep connected cars secure."

AUTOCRYPT’s offerings across V2X, V2D, and V2G security are a natural match for NXP’s expansive automotive portfolio, paving the way for further joint solution development as global interoperability continues to become a crucial factor for enabling safe transportation and mobility.

AUTOCRYPT is the leading player in autonomous vehicle security. Recognized by TU-Automotive as the Best Auto Cybersecurity Product/Solution of 2019, AUTOCRYPT continues to pave the way in transportation and mobility security through a multi-layered, holistic approach. Through security solutions for V2X/C-V2X, V2G (including Plug & Charge security), in-vehicle security, and Fleet Management, AUTOCRYPT ensures that security is prioritized before autonomous vehicles hit the road.

Visit www.autocrypt.io for more information, and contact marketing@autocrypt.io for partnership inquiries.

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PR Newswire

Seoul Semiconductor’s WICOP Bi-Color LEDs Are Shining in the Headlamp of Audi A4 Model Year 2020

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ANSAN, South Korea, Sept. 22, 2020 — Seoul Semiconductor Co., Ltd. ("Seoul") (KOSDAQ 046890), a leading global innovator of LED products and technology, announced that it has supplied WICOP Bi-color (2 colors in one package) LED products for the daytime running lights and front turn signals of the 2020 Audi A4 (B9 facelift) headlamp.

2020 Audi A4 with Seoul Semiconductor’s WICOP Bi-Color LEDs (Source: Audi)
2020 Audi A4 with Seoul Semiconductor’s WICOP Bi-Color LEDs (Source: Audi)

This is the first example of Seoul Semiconductor’s WICOP product being mounted on an Audi headlamp. WICOP Bi-color LED is a core patented technology of Seoul Semiconductor that realizes both white and yellow in one package. It is designed to directly mount the LED chip on the board without additional package.

"Due to the narrow space between the light emitting surfaces of the bi-color LED, it is technically beneficial to light up one cavity with yellow for turn and white for DRL. This advantage opens up the possibility of slimmer headlamp designs," said Dr. Michael Hamm, the head of development headlamps of Audi.

In the meantime Seoul Semiconductor has already developed the more compact WICOP Gen2 mini bi-color emitter while including the advantages of the existing WICOP in combination with even slimmer footprint.

"The [WICOP Gen2] family has been developed as a light source suitable for automobile main functions, daytime running lights and turn indicators. Actually we are developing [WICOP UHL (Ultra High Luminance)] with excellent high luminance and heat dissipation performance for the next generation of slim headlamps. Accordingly, European headlamp customer inquiries for our innovative products have increased and we have been engaged with customers in more than 20 headlamp projects for next generation cars," said In Heum Park, vice president of automotive division of Seoul Semiconductor.

WICOP technology is widely applied not only to vehicle lighting, but also to high-brightness TVs and LCD backlights for mobile phones, flash for smartphone cameras, and high-power general lighting, as it has excellent thermal conductivity and is easy to configure light, thin and compact lenses.

About Seoul Semiconductor

Seoul Semiconductor is the world’s second-largest global LED manufacturer, a ranking excluding the captive market, and has more than 14,000 patents. Based on a differentiated product portfolio, Seoul offers a wide range of technologies, and mass produces innovative LED products for indoor and outdoor lighting, automotive, IT products, such as mobile phone, computer displays, and other applications, as well as the UV area. The company’s world’s first development and mass production products are becoming LED industry standard and leading the global market with a package-free LED, WICOP; a high-voltage AC-driven LED, Acrich; an LED with 10X the output of a conventional LED, nPola; a cutting edge ultraviolet clean technology LED, Violeds; an all direction light emitting technology, filament LED; a natural spectrum LED, SunLike; and more. For more information, please visit www.seoulsemicon.com/en.

Contacts:
Seoul Semiconductor Co., Ltd.
Jeonghee Kim
Email: jeonghee.kim@seoulsemicon.com

 

Related Links :

http://www.seoulsemicon.com/en

PR Newswire

QuantumClean and ChemTrace Show How to Reduce Cost of Ownership at SEMICON Taiwan

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HAYWARD, California, Sept. 15, 2020 — Ultra Clean Holdings, Inc. (Nasdaq: UCTT), today announced that its Service Businesses, QuantumClean and ChemTrace, will demonstrate how their ultra-high purity chamber tool part cleaning, proprietary coatings and micro-contamination analytical testing can help reduce Cost of Ownership (CoO) for wafer fabs and OEMs. QuantumClean and ChemTrace will showcase these solutions at booth I2130 at SEMICON Taiwan 2020 at the Nangang Exhibition Center in Taipei September 23 – 25, 2020.

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"Customers are increasingly recognizing the advantage of our cleaning and analytical technology that optimizes productivity and helps to reduce total CoO throughout the product’s lifecycle," said Bill Bentinck, President, UCT Semiconductor Services Business. "We are excited to demonstrate how our differentiated service offerings can improve operations by solving critical semiconductor process chamber part-related manufacturing challenges at SEMICON Taiwan."

A series of presentations will be offered to IDMs, OEMs, OPMs and foundries on how they may increase productivity and reduce CoO for ALD, CVD, diffusion, etch, ion implant and PVD process tools. Booth staff will show how cleaner chambers start-up quicker, faster part turnaround times reduce inventory, longer MTBCs improve productivity and reduce PM costs, and how less aggressive cleaning methods and recoating can extend part life.

About Ultra Clean Holdings, Inc.

Ultra Clean Holdings, Inc. is a leading developer and supplier of critical subsystems, ultra-high purity cleaning and analytical services primarily for the semiconductor industry. Ultra Clean offers its customers an integrated outsourced solution for major subassemblies, improved design-to-delivery cycle times, design for manufacturability, prototyping and component manufacturing, and tool chamber parts cleaning and coating, as well as microcontamination analytical services. Ultra Clean is headquartered in Hayward, California. Additional information is available at www.uct.com.

Forward-looking Statements

The foregoing information contains, or may be deemed to contain, "forward-looking statements" (as defined in the US Private Securities Litigation Reform Act of 1995) which reflect our current views with respect to future events and financial performance. We use words such as "anticipates," "projection," "outlook," "forecast," "believes," "plan," "may," "expect," "future," "intends," "may," "will," "estimates," "see," "predicts," and similar expressions to identify these forward-looking statements. Forward looking statements included in this press release include our expectations about the contributions of Ms. Seto to our Board of Directors. All forward-looking statements address matters that involve risks and uncertainties. Accordingly, the Company’s actual results may differ materially from the results predicted or implied by these forward-looking statements. These risks, uncertainties and other factors also include, among others, those identified in "Risk Factors," "Management’s Discussion and Analysis of Financial Condition and Results of Operations” and elsewhere in our annual report on Form 10-K for the year ended December 28, 2018 as filed with the Securities and Exchange Commission and subsequently filed quarterly reports on Form 10-Q. Ultra Clean Holdings, Inc. undertakes no obligation to publicly update or review any forward-looking statements, whether as a result of new information, future developments or otherwise unless required by law.

Contact:

Rhonda Bennetto
Vice President Investor Relations
rbennetto@uct.com

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Related Links :

http://www.uct.com