Tag Archives: SEM

PR Newswire

Taiwan’s innovative technology allows for germ eliminating fabric by making use of semiconductor mechanics

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TAIPEI, Jan. 29, 2021 — With COVID-19 becoming more deadly with mutations and secondary infections becoming more frequent, people have shifted our focus from using protective masks to rushing and cutting lines to get the new vaccine. A company has created a textile that is about to be a game changer in our virus invested world. A few days ago, ACTife released a new technology for antibacterial fabric. These textile materials utilize semiconductor sputtering technology, which uses silver, copper and titanium sputtering to produce a hydroxyl radical on the surface of the fabric. Because hydroxyl radicals can destroy viruses and bacteria in medicine and make their proteins lose their function. Therefore, the materials developed by ACTife can not only block viruses and bacteria, but also use hydroxyl radicals to prevent contact with the bacteria and viruses while they are adsorbed on the surface of the fabric. This technology has been verified by the SGS, Boken, Intertek, and Japan SEK to effectively sterilize 99.9% of bacteria and germs. FYI https://health-ecoforum.medium.com/ 

The research team of Fu Jen Catholic University Taiwan published an anti-virus research report on ACTife’s nano sputtered fabric and Stated "The fabric successfully blocked and absorbed the germs and bacteria on the cloth, which prevented secondary infection of the virus." M. L.Chang, Chairman of ACTife, said: "This sputtering technology was originally used in semiconductors. When the pandemic broke out, our research team discovered that the three-metal nano-atoms of silver, copper and titanium used in medical materials had an excellent sterilization effect, so we began to develop products such as masks and protective gears. We look forward to this technology and what it can contribute to global pandemic prevention." This technology generates free radicals which causes the side chains of amino acids on the surface make proteins lose their function, thereby making germs harmless and greatly reducing the risk of infection. Not only can it apply to masks, but anything that uses fabric like towels, socks, clothing or air filters. CEO of ACTife Dr. Y. P. Lu also pointed out: "The advantage of physical antibacterial properties is that it makes the material more durable and does not precipitate any toxic or undesirable substances. As of now, the most used antibacterial chemical is bleach and the substance of bleach is actually a high concentration of sodium hypochlorite, which is well known for killing germs but it is harmful to the human body and the environment in terms of smell and touch.

The silver, copper, and titanium with splashes of ACTife Plating technology is a physical antibacterial technology that produces a free radical shield on the surface of the fabric. This highly active free radical shield eliminates bacteria and viruses that pass through it. It has the excellent function of long-lasting and washable resistance. In addition, the surface of the material does not stick to bacteria and viruses, and can be safely reused. Compared with ordinary masks and protective clothing on the market, it is not only more environmentally friendly, but also does not cause pollution and other infection risks. With its innovative antibacterial and antiviral technology, Actife has now entered the medical material market and is looking to use their innovative technology to further enhance our protection against coronavirus. ACTife website: https://www.actife.com.tw/

Related Links :

https://www.actife.com.tw

PR Newswire

Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4×4:4 Transceiver

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SANTA CLARA, Calif., Jan. 28, 2021 — Palma Ceia SemiDesign, a fabless semiconductor company specializing in wireless connectivity solutions, today announced the PCS1100, a Wi-Fi 6E 4×4 transceiver. The PCS1100 is the first chip announced as part of Palma Ceia’s family of Wi-Fi 6 products which support the growing deployment of Wi-Fi 6 networks, and it will provide essential platform technology for a series of upcoming Wi-Fi 6E chipsets.

The PCS1100 supports up to four spatial streams and can operate in the newly allocated 6 GHz spectrum (5.925–7.125 GHz) for Wi-Fi devices, in addition to the 2.4 GHz and 5 GHz bands. The transceiver supports dual-concurrent operation, allowing simultaneous operation on two frequency bands.

The PC1100 operates as the RF radio part of a wireless system enabling the operation of a Wi-Fi 6 AP-Access Point or STA-Station. It can interface with a host system-level ASSP or ASIC supporting Wi-Fi 6 MAC and baseband digital operation. It is also the ideal companion chip to premium-tier access point architectures.

Designers who integrate the AP or STA Wi-Fi 6 digital modem functionality on their system-level ASIC or ASSP chip can use the PCS1100 as the RF companion chip supporting the radio operation of Wi-Fi 6. This reduces the risk of RF integration and allows use of advanced process nodes with the highest logic gate density.

"As system-level chips grow in functionality to support advanced AI applications that require Wi-Fi connectivity, they must use advanced process nodes to minimize the chip area, and so using an external RF chip reduces the risk of low yield resulting from failure of an integrated RF radio," said Chief Technology Officer Robert Young of Palma Ceia. "The PCS1100 benefits from the experience and expertise of our RF team, and I expect to see those skills reflected in our subsequent products."

Designers who integrate STA modem functionality can use 1×1, 2×2, 3×3 or 4×4 operational configurations, with each additional incremental configuration providing more data throughput. In each configuration, the radio can operate at 2.4 GHz, 5 GHz or 6 GHz, or simultaneously on two frequency bands subject to a maximum of four spatial streams. Customers who integrate the AP Wi-Fi 6 modem functionality on their system-level ASSP or ASIC can use multiple PCS1100 chips to support as many as 12 spatial streams, eight in 5 GHz or 6 GHz, and four in 2.4 GHz (using three PCS1100s) in both the uplink (UL) and downlink (DL) directions.

The PCS1100 Wi-Fi 6E 4×4:4 transceiver features a robust RF architecture offering key features and performance indicators including:

  • Support for 2.4 GHz, 5 GHz and 6 GHz (5.925–7.125 GHz) frequency bands
  • Up to four spatial streams
  • Support for dual-concurrent operation, allowing simultaneous operation on two frequency bands
  • Excellent receiver sensitivity for reliable connections at longer range
  • Support for 1024-QAM modulation that delivers increased throughput
  • Excellent phase noise and linearity performance to ensure Tx and Rx EVM (Error Vector Magnitude) requirements are met with significant margin
  • Integrated data converters for channel bandwidths up to 80 MHz, with a high-speed SerDes digital interface to the system-level chip; support for 160MHz channels through an analog I/Q interface
  • Integrated digital functionality for calibration, production test and signal path compensation, including an embedded RISC-V processor core

"We are extremely excited about the launch of the PCS1100, the first chip in our family of Wi-Fi-6-based products," said Roy E. Jewell, chief executive officer at Palma Ceia. "The workplace in 2021 can be anywhere we are, and users are increasingly dependent on wireless connectivity. We anticipate a growing demand for the PCS1100 as an RF companion chip as Wi-Fi 6E and use of the 6G spectrum continue to expand."

Availability
The PCS1100 is scheduled to tape out in early Q2 of 2021, with customer samples available in Q3. Contact Palma Ceia SemiDesign via email at info@pcsemi.com for details.

About Palma Ceia SemiDesign
Palma Ceia SemiDesign (PCS) is a fabless semiconductor company and leading provider of communication semiconductors and IP for next-generation Wi-Fi and cellular applications. With a focus on emerging Wi-Fi and LTE standards, particularly for IoT (Internet of Things), PCS targets the design of ICs for broadband, wireless, medical and automotive applications. Palma Ceia SemiDesign solutions are differentiated by low power, high performance and ease of integration. Headquartered in the Cayman Islands, the company has design and sales support centers in Cambridge (United Kingdom), mainland China, China Hong Kong, and McKinney, Texas (United States). PCS is soon expanding to provide direct support for Israel, Japan, Korea and China Taiwan. Visit Palma Ceia SemiDesign on the web at pcsemi.com.

Palma Ceia SemiDesign and the Palma Ceia SemiDesign logo are trademarks of Palma Ceia SemiDesign, a Cayman Islands corporation, and are protected by trademark laws of the United States and other jurisdictions. All other product and company names are trademarks or registered trademarks of their respective companies.

Palma Ceia SemiDesign Media Contact
Milan G. Lazich
press@pcsemi.com
+1 650-464-1132

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PR Newswire

Arasan announces its Total eMMC IP solution for TSMC 22nm process

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Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automobile SoCs today announced the immediate availability of its eMMC PHY IP for TSMC 22nm process technology

SAN JOSE, Calif., Jan. 21, 2021 — Arasan Chip Systems expands its IP offering for TSMC’s industry-leading 22nm process technology with the immediate availability of its eMMC PHY IP for SoC Designs on TSMC 22nm process. The eMMC PHY IP on TSMC 22nm process is seamlessly integrated with Arasan’s eMMC 5.1 Host Controller IP and Software thereby providing customers a Total eMMC IP Solution for TSMC 22nm process.

Arasan TSMC 12nm eMMC PHY IP & SD UHS-II Card IP Test Chips
Arasan TSMC 12nm eMMC PHY IP & SD UHS-II Card IP Test Chips

Arasan offers a comprehensive portfolio of IP for TSMC 22nm process with its D-PHY v1.1 IP @1.5ghz, D-PHY v1.2 IP @2.5ghz, C-PHY / D-PHY Combo @2.5ghz and now the eMMC PHY available for this process.  All the MIPI PHY’s are available as Tx only or Rx only in addition to the standard Tx/Rx IP.

Compared to its 28nm high-performance compact (28HPC) technology, TSMC’s 22nm ultra-low power (22ULP) provides 10% area reduction with more than 30% speed gain or more than 30% power reduction for applications including image processing, digital TVs, set-top boxes, smartphones and consumer products. Meanwhile, the TSMC 22nm ultra-low leakage (22ULL) technology provides significant power reduction crucial for designs in IoT and wearables market segments. 

Our Total eMMC IP solution is silicon proven and also available for TSMC’s 40nm, 28nm, 16nm, 12nm, and 7nm processes. An eMMC HDK containing our TSMC 12nm FFC Test Chip is available for customers who wish to prototype their SoCs.

The eMMC 5.1 Specification from JEDEC, improves the HS400 speeds operating at 3.2Gbps, with "command queuing" – making the data transfers highly efficient by offloading the software overhead into the controller. eMMC 5.1 further improves the reliability of operation by utilizing an "enhanced strobe" at the PHY layer. The eMMC5.1 is backward compatible with the existing eMMC 4.51 and eMMC 5.0 Devices.

Arasan has been a member of the JEDEC eMMC Standards Body since its inception. Prior to eMMC, Arasan offered its solution for Multimedia Cards (MMC) starting in 2001.

About Arasan

Arasan Chip Systems is a leading provider of IP for mobile storage and mobile connectivity interfaces. Arasan’s high-quality, silicon-proven, Total IP Solutions include Digital IP, AMS PHY IP, Verification IP, HDK and Software.  Arasan has a focused product portfolio targeting mobile SoCs. The term Mobile has evolved over our two decade history to include all things mobile – starting with PDA’s in the mid 90’s to Smartphones & Tablets of the 2000’s to today’s Automobiles, Drones and IoTs.  Arasan is at the forefront of this evolution of "Mobile" with its standards-based IP at the heart of Mobile SoCs.

Over a billion chips have been shipped with Arasan IP including with all of the top 10 semiconductor companies.

Contact:
Dr. Sam Beal
Mktg1@arasan.com

 

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Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology

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SAN JOSE, California, Jan. 15, 2021 — Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, today announced the immediate availability of its 2nd Generation MIPI D-PHY v1.1 IP supporting speeds of up to 1.5 Gbps on TSMC 22nm process technology for SoC designs. The MIPI D-PHY IP is further optimized for lower power targeting wearables and IoT Display applications which require low throughput for their small lower resolution screens, but where power is of paramount importance. The D-PHY IP is also available as a Tx only IP for companies looking to save silicon area and further improve power consumption. The MIPI D-PHY IP is seamlessly integrated with Arasan’s own DSI Tx and DSI Rx IP Cores as part of its Total MIPI Display IP Solution for wearables and IoT.

Arasan Sirius MIPI C-PHY / D-PHY ASIC on TSMC Foundry
Arasan Sirius MIPI C-PHY / D-PHY ASIC on TSMC Foundry

Arasan’s D-PHY IP is available on both TSMC’s industry-leading 22nm ultra-low power (22ULP) and 22nm ultra-low leakage (22ULL) process technologies. TSMC 22nm ultra-low power (22ULP) is an ideal foundry technology for applications including image processing, digital TVs, set-top boxes, smartphones and consumer products in terms of its power, performance and area (PPA) optimization, while its 22nm ultra-low leakage (22ULL) technology provides significant power reduction to support IoT and wearable device applications.  

Arasan has been a contributing member to the MIPI Association 2005 with over a billion chips shipped with its MIPI IP. Arasan MIPI D-PHY IP is proven on its own test chip on TSMC 28nm process, which has been licensed by multiple customers since 2016 and validated along with its CSI IP and DSI IP with 3rd Party VIP as a Total IP Solution. The company’s MIPI CSI, DSI, DPHY and CPHY IP are also used in compliance and production testers further attesting the quality and compliance of Arasan IP.

The MIPI D-PHY IP is also available off the shelf on the TSMC 40nm, 28nm, 16nm and 12nm process technologies.

A D-PHY / C-PHY Combo HDK based on Arasan’s ASIC applications on TSMC 28nm process is also available to licensees of Arasan’s DPHY IP or CPHY IP to prototype their Display or Imaging products before going to production. Customers can license with confidence in Arasan’s MIPI D-PHY IP knowing they can prototype with the real silicon on TSMC 28nm process, which is used in a MIPI Compliance Tester to test for MIPI CSI, DSI, D-PHY and C-PHY Standards Compliance. We are Compliance!

About Arasan

Arasan Chip Systems, a contributing member of the MIPI Association since 2005 is a leading provider of IP for mobile storage and mobile connectivity interfaces. Arasan’s high-quality, silicon-proven, Total IP Solutions include digital IP, AMS PHY IP, Verification IP, HDK and Software. Arasan has a focused product portfolio targeting mobile SoCs. The term Mobile has evolved over our two-decades history to include all things mobile – starting with PDAs in the mid 90s to Smartphones & Tablets of the 2000s to today’s Automobiles, Drones and IoTs. Arasan is at the forefront of this evolution of "Mobile" with its standards-based IP at the heart of Mobile SoCs.

Over a billion chips have been shipped with Arasan IP including with all of the top 10 semiconductor companies.

Contact:
Dr. Sam Beal
Mktg1@arasan.com

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PR Newswire

ChipMOS REPORTS 20.1% YoY INCREASE IN DECEMBER 2020 REVENUE; 13.3% YoY INCREASE IN 4Q20 REVENUE; 13.1% YoY INCREASE IN FY20 REVENUE

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HSINCHU, Jan. 8, 2021 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of December 2020 and for the fourth quarter ended December 31, 2020. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$28.08 to US$1.00 as of December 31, 2020.

Revenue for the fourth quarter of 2020 was NT$6,310.3 million or US$224.7 million, representing an increase of 13.3% from the fourth quarter of 2019, and an increase of 11.0% from the third quarter of 2020. Revenue increased 13.1% for the full year 2020 compared to the full year 2019, representing the highest level since 2014. The Company noted that it benefitted from continued strong memory and DDIC demand throughout 2020, with improvements in both volumes and pricing. The Company achieved higher utilization levels led by end-market demand strength in cloud infrastructure, gaming, mobile and industrial.

Revenue for the month of December 2020 was a new record high at NT$2,190.6 million or US$78.0 million, representing an increase of 20.1% from December 2019, and an increase of 6.8% from November 2020. 

Consolidated Monthly Revenues (Unaudited)

December 2020

November 2020

December 2019

MoM Change

YoY Change

Revenues

(NT$ million)

2,190.6

2,051.0

1,823.5

6.8%

20.1%

Revenues

(US$ million)

78.0

73.0

64.9

6.8%

20.1%

 

Consolidated Quarterly Revenues (Unaudited)

Fourth Quarter 2020

Third Quarter

2020

Fourth Quarter

2019

QoQ Change

YoY Change

Revenues

(NT$ million)

6,310.3

5,686.2

5,571.5

11.0%

13.3%

Revenues

(US$ million)

224.7

202.5

198.4

11.0%

13.3%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 

Related Links :

https://www.chipmos.com

PR Newswire

Infineon takes lead in MEMS microphone market, launches new technologies for further improved acoustical performance and power consumption

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MUNICH, Jan. 8, 2021 — According to research consultancy Omdia*1, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has successfully positioned itself as the market leader for MEMS microphones. Based on MEMS chip unit sales, the market share was reported to have been catapulted to a staggering 43.5 percent. This positions Infineon at with a lead of almost 4 percent over second place and more than 37 percent over third place. This positive development is due also to Infineon’s long-term experience in MEMS microphone design and high volume manufacturing for delivering an unmatched consumer experience.

Infineon’s XENSIV™ MEMS microphone IM73A135A features a 73 dB SNR and a high acoustic overload point (135 dB SPL) for a very high dynamic range microphone with a small footprint of 4 x 3 x 1.2 mm3 with the industry’s lowest power consumption of 170 microampere.
Infineon’s XENSIV™ MEMS microphone IM73A135A features a 73 dB SNR and a high acoustic overload point (135 dB SPL) for a very high dynamic range microphone with a small footprint of 4 x 3 x 1.2 mm3 with the industry’s lowest power consumption of 170 microampere.

 

Now Infineon is launching a next-generation analog MEMS microphone that renders even better results – the XENSIV™ MEMS microphone IM73A135. In microphones, designers often have to accept trade-offs: high signal-to-noise ratio (SNR), a small package, high acoustic overload point, low power consumption, MEMS versus electret condenser microphones (ECM). For this reason, applications that require highest performance microphones may have previously still used ECMs instead of MEMS. The IM73A135 reduces the need to compromise.

A 73 dB SNR and a high acoustic overload point (135 dB SPL) make for a very high dynamic range microphone with a small footprint of 4 x 3 x 1.2 mm3. Infineon’s new MEMS microphone also features tight frequency curve matching for the most effective audio signal processing and the industry’s lowest power consumption of 170 microampere. The IM73A135 thus allows designers to reach a level of high audio performance restricted to ECMs while at the same time reaping the benefits inherent in MEMS technology.

Infineon’s new MEMS microphone offers excellent characteristics to enhance active noise cancellation in headphones, a market that will grow to approximately 250 million devices by 2025 with a CAGR of 16 percent*2. Additionally, the low self-noise makes the IM73A135 especially suited for high-quality audio capturing required in conference systems, cameras, or audio recorders. A market that is also expected to increase significantly.

New digital low power technology for wearables

Infineon is not only expanding its portfolio of branded MEMS microphones but also extending its lead via a new low power digital ASIC technology. This lowest power technology will be used in various next-generation digital microphones manufactured and branded by the "Infineon-inside" microphone partner network. An industry-leading low power mode current consumption of as little as 110 microampere makes it a perfect match for the wearables segment, including smartwatches, fitness bands, etc. The growing demand for aesthetically appealing products with the ability to serve the consumers’ daily needs better will grow this market to reach approximately 650 million units by 2025, at a CAGR of almost 20 percent over a forecast period from 2020 to 2025*3.

Availability

The XENSIV MEMS microphone IM73A135 will be available for the distribution market in March 2021. The new MEMS microphone technology for wearables will be launched by the "Infineon-inside" partners in the next months. More information is available at www.infineon.com/mems, for "Infineon-inside" microphone partner network: www.infineon.com/cms/en/product/sensor/mems-microphones/infineon-inside/.

*1 Source: Omdia, MEMS Microphones Dice Market Shares 2020, October 2020

*2 Source: Mordor Intelligence: Smart wearable market – growth, trends, forecasts (2020 – 2025), July 2020 

*3 Source: Infineon, Marketing Elevator for IM73A135

 

PR Newswire

uCloudlink and China Mobile UK Fuel Multinational Business Development with Superior Mobile Connectivity Experience

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HONG KONG, Jan. 4, 2021 — UCLOUDLINK GROUP INC. ("uCloudlink") (NASDAQ: UCL), the world’s first and leading mobile data traffic sharing marketplace, and China Mobile International (UK) Limited ("China Mobile UK"), a subsidiary of China Mobile International Limited (CMI), continue their six-year strong partnership, providing high-quality network connection support for multinational companies.

Since 2014, China Mobile UK has provided support to global businesses headquartered in the UK using uCloudlink’s terminal Wi-Fi devices and associated data services. The partnership significantly broadens uCloudlink’s reach in the UK market as the company strives to redefine and elevate the mobile data connectivity experience. Powered by uCloudlink’s innovative Cloud SIM technology, China Mobile UK’s multinational enterprises users can tap into uCloudlink’s global ecosystem of mobile network operators (MNOs), mobile virtual network operators (MVNOs) and business partners to enjoy superior mobile connectivity at anywhere and at any time.

uCloudlink’s global ecosystem allows partners to operate more efficiently by providing mobile data services both at domestic and international markets. As of September 30 2020, uCloudlink has aggregated mobile data traffic allowances from more than 200 MNOs, MVNOs and business partners in more than 140 countries and regions as part of its global Cloud SIM ecosystem.

Adopting a platform-centric approach, uCloudlink’s PaaS and SaaS platform consolidates uCloudlink’s core capabilities – Cloud SIM technology and architecture – while allowing other functions to its business partners, such as sales and marketing. In addition, as part of uCloudlink’s global ecosystem, uCloudlink partners can also procure customized Original Design Manufacture (ODM) hardware and data packages from proprietary sources to fully exploit their potential in their local markets.

Benefiting from uCloudlink’s Cloud SIM technology and architecture, business partners such as China Mobile UK can elevate multinational companies’ user experience with superior mobile data services that offer reliable connectivity and high speeds, at a competitive price.

uCloudlink’s Cloud SIM technology enables compatible terminals to use local data networks without changing physical SIM cards. Users can easily and dynamically switch SIM cards over the Cloud platform, which allows for better network quality and connection. Meanwhile, Cloud SIM architecture allows mobile terminal brands, MVNOs, MNOs, mobile Wi-Fi terminal rental companies and distribution channels to participate in uCloudlink’s ecosystem. Cloud SIM architecture mainly consists of two components: a distributed SIM card pool and a cloud SIM management platform (i.e. PaaS and SaaS platform), which supports business partners to improve their connectivity services.

The cooperation between uCloudlink and China Mobile UK forms part of uCloudlink’s vision of "connecting and sharing without limitations". Over the years, uCloudlink has established extensive partnerships with a variety of businesses in various industries. uCloudlink is also at the forefront of innovation, and has partnered with China Unicom Shenzhen recently to deliver superior user experiences and network quality in the 5G Cloud era.

About UCLOUDLINK GROUP INC.

uCloudlink is the world’s first and leading mobile data traffic sharing marketplace, pioneering the sharing economy business model for the telecommunications industry. The Company’s products and services deliver unique value propositions to mobile data users, handset and smart-hardware companies, mobile virtual network operators (MVNOs) and mobile network operators (MNOs). Leveraging its innovative CloudSIM technology and architecture, the Company has redefined the mobile data connectivity experience by allowing users to gain access to mobile data traffic allowance shared by network operators on its marketplace, while providing reliable connectivity, high speeds and competitive pricing.

PR Newswire

LG Display to showcase lifestyle of future with Transparent OLED at CES 2021

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SEOUL, South Korea, Dec. 31, 2020 — LG Display, the world’s leading innovator of display technologies, announced today brand-new Transparent OLED applications to be showcased at the upcoming all-digital CES 2021. The company has applied its cutting-edge transparent OLED displays to objects and situations that people encounter on a daily basis, thereby presenting an upgraded lifestyle of the future.

LG Display Transparent OLED on Subway Train
LG Display Transparent OLED on Subway Train

Among LG Display’s most exciting and practical Transparent OLED products is a Smart Bed to be showcased in a Smart Home Zone at the company’s online showroom, featuring a frame that can be moved to the foot of a bed of the user’s choice. At the push of a button, the Smart Bed’s 55-inch Transparent OLED display rises from its frame to show information or TV contents in various screen ratios without compromising its clear image quality that does not rely on backlights. With immersive Cinematic Sound OLED (CSO) embedded in the frame, there is also no need to clutter bedroom space with external speakers. In addition, the Smart Bed display’s movable frame can easily be taken to various locations in a house to serve the diverse needs of users.

LG Display Transparent OLED at Restaurant
LG Display Transparent OLED at Restaurant

LG Display is also offering a game-changer to its customers at CES 2021 in a Restaurant Zone, where a sushi bar can utilize a 55-inch Transparent OLED display to deliver information with clear image quality while benefiting from high transparency to maintain a connection between people on both sides of the screen. As guests wait for their order, they can watch a movie or TV program, while at the same time viewing the chef preparing their food on the other side of the display. This innovative product naturally stands out more in the contactless era as it can not only act as a partition but also serve up some fun.

LG Display will additionally demonstrate how the company’s 55-inch Transparent OLED display can be applied to a subway train in a Metro Zone. While on board a virtual train carriage, passengers may look outside through the transparent display that has replaced a traditional window. Its high transparency enabled by OLED means passengers can still enjoy the passing scenery while viewing clear information such as subway line maps, weather information, and other news.

"Transparent OLED is a technology that maximizes the advantages of OLED and can be used in various places in our daily lives, from stores, shopping malls, and architectural interiors to autonomous vehicles, subway trains, and aircraft," said Jong-sun Park, Senior Vice President & Head of the Commercial Business Unit at LG Display. He added, "It will grow into a next-generation display that can change the existing display paradigm."

The company’s Transparent OLED realizes 40% transparency, providing clear image quality while being crystal clear like glass compared to the existing transparent LCD with only 10% transparency. With its superior transparency, Transparent OLED can be used in various fields such as smart homes, smart buildings, and mobility, including autonomous vehicles, aircraft, and subways. LG Display, the only transparent OLED manufacturer in the world, is seeing growing demand for Transparent OLED from these industries.

The company will demonstrate its cutting-edge products online at CES 2021 where all general visitors can enjoy them for the first time.

About LG Display

LG Display Co., Ltd. [NYSE: LPL, KRX: 034220] is the world’s leading innovator of display technologies, including thin-film transistor liquid crystal and OLED displays. The company manufactures display panels in a broad range of sizes and specifications primarily for use in TVs, notebook computers, desktop monitors, and various other applications, including tablets and mobile devices. LG Display currently operates manufacturing facilities in Korea and China, and back-end assembly facilities in Korea, China, and Vietnam. The company has approximately 60,000 employees operating worldwide. For more news and information about LG Display, please visit www.lgdisplay.com.

Media Contact:

Jean Lee, Senior Manager, Global Communications
jean.lee@lgdisplay.com

Sue Kim, Executive Vice President
Insight Communications Consultants
sue.kim@insightcomms.com

Related Links :

http://www.lgdisplay.com/

PR Newswire

ITRI’s VLSI-TSA and VLSI-DAT Symposia will Kick Off in April 2021

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Focusing on AI, 5G, Deep Learning, Smart Skins and In-Memory Computing

HSINCHU, , Dec. 29, 2020 — AI, 5G, deep learning, and biomedical electronics are reshaping industries and experiences in the semiconductor industry. To address these key trends, the Industrial Technology Research Institute (ITRI) will host the 2021 International Symposia on VLSI Technology, Systems and Applications (VLSI-TSA) and Design, Automation and Test (VLSI-DAT) on April 19-22, 2021 at the Ambassador Hotel, Hsinchu, Taiwan. Experts from top companies and prestigious academic institutions, including TSMC, IBM, Hitachi, Stanford University, Massachusetts Institute of Technology (MIT), The University of Tokyo, and Olin College of Engineering will share their insights and latest research findings on 5G and AI product innovations, techniques of efficient deep learning, in-memory computing, DTCO and advanced packaging, hardware security, biomedical applications, and low dimensional materials and devices.

The 2021 VLSI-TSA and VLSI-DAT Symposia early bird registration will be available from January 1, 2021 to March 15, 2021.
The 2021 VLSI-TSA and VLSI-DAT Symposia early bird registration will be available from January 1, 2021 to March 15, 2021.

The VLSI-TSA and VLSI-DAT symposia were first held in 1983, hosting premiere conferences in semiconductor-related fields and attracting up to 1,000 participants every year. VLSI-TSA and VLSI-DAT provide a unique opportunity to network leading experts worldwide and allow participants to explore advanced technologies in the semiconductor industry. In the 2021 event, six esteemed experts will give keynote speeches. Prof. Evan Reed from Stanford University will discuss the success stories of data mining and machine learning for electronic materials selection. Dr. Lipen Yuan from TSMC will explore the technology innovations that will enable continued scaling, including 3D stacking and other advanced packaging trends. Dr. Masanao Yamaoka from Hitachi will introduce the CMOS annealing machine and present how it solves combinatorial optimization problems. Prof. Song Han from MIT will talk about "Putting AI on Diet" and focus on techniques to reduce the computation recourse, human resource, and data resource for deep learning. Prof. Takao Someya from The University of Tokyo will review recent progresses of stretchable thin-film electronics for applications to robotics and wearables and address the future prospect of smart skins. Prof. Richard K. Miller, President Emeritus of Olin College of Engineering, will share his insights into remaking engineering education for the innovation economy.

The 2021 VLSI-TSA and VLSI-DAT symposia will be held in a hybrid format, incorporating an in-person conference and a virtual platform with on-demand presentations. The in-person conference will be held on April 19-22, 2021 at the Ambassador Hotel, Hsinchu, Taiwan. Following the physical event, there will be a virtual conference providing online access to on-demand video presentations from April 23 to May 22, 2021. Over 150 outstanding papers will be presented during the symposia.

Online registration will be open from January 1, 2021. The early bird registration is valid until March 15, 2021, and students are eligible for an up to 80% discount on their registration fee. Registration link: https://reg.itri.org.tw/2021VLSI.

For further information, please visit the conference websites:
2021 VLSI-TSA: https://expo.itri.org.tw/2021vlsitsa
2021 VLSI-DAT: https://expo.itri.org.tw/2021vlsidat

About ITRI

Industrial Technology Research Institute (ITRI) is one of the world’s leading technology R&D institutions aiming to innovate a better future for society. Founded in 1973, ITRI has played a vital role in transforming Taiwan’s industries from labor-intensive into innovation-driven. To address market needs and global trends, it has launched its 2030 Technology Strategy & Roadmap and focuses on innovation development in Smart Living, Quality Health, and Sustainable Environment. It also strives to strengthen Intelligentization Enabling Technology to support diversified applications.

Over the years, ITRI is dedicated to incubating startups and spinoffs, including well-known names such as UMC and TSMC. In addition to its headquarters in Taiwan, ITRI has branch offices in the U.S., Europe, and Japan in an effort to extend its R&D scope and promote international cooperation across the globe. For more information, please visit https://www.itri.org/eng.

PR Newswire

Oceanpine Capital Hits $400Mn Final Close of Fund II

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In the time of unprecedented uncertainties, Oceanpine Capital Fund II successfully held its $400M final closing of Fund II as scheduled.

Partnering with world-class entrepreneurs; investing in DeepTech arena and innovative growth companies in both TMT and Biotech sectors that are the driving force of the future economy in the New Norm.

BEIJING, Dec. 28, 2020 — This is the first time Oceanpine has sought funding from external LPs since its inception in Dec 2016. That year, the firm set up its $400 million debut fund using GP’s internal capital. Founder Dave Chenn, who previously established a multi-billion-dollar conglomerate company in 2005, has participated as an LP in 15 technology-focused venture capital and private equity funds, and has co-invested in a number of highly successful deals.

The final closing LPs included the GP management team itself and other top-tier international institutional investors from U.S. and Asia, including reputable insurance pockets, prominent technology company leaders (mostly listed) and their founders, asset management allocators, family offices, and seasoned Midas List venture capitalists.

Oceanpine has invested over $1 billion across more than 40 companies in both China and the US with Fund I and other investment vehicles. Among them are AI computing-power specialist Enflame Technology, Ansun Biopharma, Horizon Robotics, Black Sesame, and US graphical database platform TigerGraph. Fund I has been fully invested and has secured two full exits and four IPOs with 50% DPI. Three more companies will file for IPO in the next twelve months.

Oceanpine is investing its Fund II in a number of innovative companies following DeepTech-focused remit of its predecessor. About $200 million has already been deployed across ten deals, including a Series B for Enflame, drug developer Apexigen, Enterprise Software provider XforcePlus, leading AI solution provider Black Sesame, innovative biopharmaceutical leader Apollomics, advanced bio-tech player Creative Biosciences, Series C & C+ for clinical stage biologics company Sinovent, AI pharmaceutical technology company XtalPi, next-gen AI recruiting super platform Hiretual, and a top domestic IC equipment supplier BEST. Five more companies are expected to go public within 2021.

About Oceanpine Capital

With offices in Beijing (headquarters), Hong Kong and Silicon Valley, Oceanpine Capital was formed in 2016 to invest in category-defining market leaders in semiconductor, AI, 5G, IoT, big data, enterprise software, as well as Biotech companies. Our sweet spots are early to late growth companies that distinguish themselves with applied disruptive technologies and proven innovative business model that address mass market demand.

Oceanpine’s seasoned and indigenous investment team, combined with in-depth industrial knowledge, network, and business relationships with top business enterprises in China and U.S., enable us to have significant advantage in deal creation and value-add service. Team’s capital market insights and experience is another critical aspect of Oceanpine’s competitive advantage. As a result, Oceanpine is able to deliver tremendous value to the portfolio companies and grow together.

Michelle Chen
michelle.chen@oceanpine.com