Tag Archives: SoC

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Mediatek Dimensity 8200 launch claims best power efficiency and smooth gaming

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Mediatek launches its latest platform, the Dimensity 8200, claiming best-in-class power efficiency for premium 5G smartphones and impressive gaming performance.

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Mediatek makes bold claims for the Dimensity 8200 with power efficiency and gaming performance.
Image source: 9to5Google

4nm process brings power efficiency while retaining performance

Mediatek’s new chipset targets the bracket of smartphones just below the flagship range and succeeds the Dimensity 8100 and 8000 launched early this year. The Dimensity 8200 improves upon its predecessors with a 4nm process, instead of a 5nm process. Apart from that, the new chipset shares many hardware similarities with its predecessors, with some tuning to improve its performance. This brings improved performance at a reduced rate of power consumption. It is an octa-core CPU with four ARM Cortex A78 cores, with one at 3.1 GHz and three at 3.0 GHz clock speeds respectively. Following suit with connectivity, it supports dual 5G connectivity like its predecessor, WiFi 6E and Bluetooth 5.3 as seen previously.

Mediatek HyperEngine 6.0 features improves gaming performance

Gaming has also been a focus of the Dimensity 8200. It retains the ARM Mali G610 graphics platform as seen before, with some performance improvements expected over the Dimensity 8100. To further enhance the GPU, Mediatek is also featuring the HyperEngine 6.0 Gaming Technologies. The biggest upgrade that comes with this feature is support for ray tracing thanks to Vulkan SDK. Better framerates are also expected with the Frame Rate Smoother 2.0 and AI-enhanced Variable Rate Shading technology (AI-VRS). With MediaTek Intelligent Display Sync 2.0, the display refresh rates adjust according to gaming or conventional use, to help preserve battery during regular use.

Improved camera and video recording features

Camera improvements are also touted with the MediaTek Imagiq 785 Camera. The main shooter is now a 320MP camera, up from 200MP of its predecessors. There is now support for recording HDR video on up to three cameras simultaneously with its 14-bit HDR-ISP. It also supports cinematic video by double camera capture and up to 3 additional 32MP sensors.

Overall, the Mediatek Dimensity 8200 remains a strong contender for flagship-like performance at an affordable price, a worthy successor to its predecessors. We expect to see more devices bearing it soon, with the first one already announced in the iQOO Neo7 SE.

Sources: 9to5Google, GSMArena

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OPPO MariSilicon Y Promises High Fidelity Bluetooth Audio

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After announcing their MariSilicon X last year, OPPO is continuing their foray into the silicon space with a new dedicated processing unit they’ve named the MariSilicon Y. This year, they aren’t focusing on optics though, they’ve set their eyes on Bluetooth Audio. The MariSilicon Y comes with a dedicated neural processing unit (NPU) and is capable of up to 509 GOPS of on-device computing.

MariSilicon Y
Source: OPPO

The new System on a Chip (SoC) is made using N6RF technology – the same technology used to create cutting edge 5G technology. OPPO has utilised the fabrication to create a dedicated chip that helps increase the fidelity of Bluetooth audio by increasing Bluetooth bandwidth by up to 50%. This is in comparison to currently available Bluetooth SoCs. OPPO has developed an in-house Pro Bluetooth pack that enables this increase. It allows for transmission of 24-bit audio at 192kHz. That’s the same lossless quality we used to get with audio CDs! Simply put, this processor is able to give you more detailed audio over the same Bluetooth connection that you have with your wireless earbuds.

The unprecedented bandwidth, 12Mbps transmission ratge and audio quality empowers a more robust listening experience complete with the capabilities for spatial audio experiences. OPPO also uses an in-house codec to achieve this. OPPO touts that their new URLC codec is supposedly able to have better compression rates than current codecs like LDAC, LHDC, AAC and AptX. However, the MariSilicon Y still supports these codecs for universal compatibility and is one of the first SoCs with next generation L3C codec support.

MariSilicon Y Key Art
Source: OPPO

The MariSilicon Y also has built-in AI that is able to take listening experiences to the next level. It is able to recognise and isolate different layers of music and even change the spatial location of given layers. In the demo during the INNO Day 2022, they isolated a single instrument – the guitar – in the audio and were able to up the volume as well as swap the space which the sound occupied during playback. Of course, this would be more obvious with headphones than on a speaker.

Being in the sound technology space is not very new for OPPO. Prior to being a big name in the mobile space, the company built its reputation with some of the best audio products on the market until 2018. However, they have recently been returning to the audio space with products like their OPPO Enco line up of earbuds.

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Snapdragon 8 Gen 2 announced at Snapdragon Summit 2022

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The Snapdragon Summit 2022 has unveiled the highly anticipated Snapdragon 8 Gen 2 platform, promising to revolutionize the flagship smartphone experience.

Snapdragon 8 Gen 2 Chip and QRD
The new Snapdragon 8 Gen 2 unveiled at the Snapdragon Summit 2022

Snapdragon’s highlight event of 2022 held in Hawaii from November 15th to 16th centered around the announcement of the Snapdragon 8 Gen 2. The platform will be adopted by global brands including ASUS, HONOR, iQOO, OnePlus, OPPO, and Redmi to name a few. Expect to see it in commercial devices as early as the end of 2022.

Key Experience Pillars show AI integration systemwide

Snapdragon 8 Gen 2 QRD Outdoor
The new features highlighted by Key Experience Pillars”; Snapdragon Smart, Sight, Elite Gaming, Connect, Sound and Secure

With the latest iteration of the SoC, the Snapdragon 8 Gen 2 offers better performance with the new Qualcomm® Hexagon™ Processor that has a 3.2GHz Arm-Cortex X3 prime core. The mobile platform offers a host of new features, described as six “Key Experience Pillars” by Qualcomm. The first and most central pillar is Snapdragon Smart, which utilizes AI integration across the system. This integration allows faster natural language processing, multi-language translation and advanced AI camera features.

Expect camera performance improvements with Snapdragon Sight, which uses AI to better recognize facial features, hairs and even the sky to allow professional grade image tuning. The platform will support new image sensors and features from other brands such as Sony’s quad digital overlap HDR technology and Samsung’s ISOCELL HP3, the first 200-megapixel image sensor. It also has an AV1 codec with support for video playback up to 8K HDR at 60 frames per second.

Elite Gaming Performance

Snapdragon 8 Gen 2 QRD Gaming
Enhanced gaming visuals with Ray Tracing thanks to Snapdragon 8 Gen 2

Snapdragon Elite Gaming will be welcome news to gaming fans as the 8 Gen 2 comes with an improved Adreno GPU. The highlight is the mobile platform will have Ray Tracing to further elevate gaming visuals. This will also be the first platform to support Vulkan 1.3 API on top of improved and more efficient performance.

High Speed Connectivity with Wi-Fi 7, improved 5G and dual Bluetooth

Qualcomm FastConnect7800 Snapdragon 8 Gen 2
Stay connected with low latency WiFI 7, peak 5G speeds and dual Bluetooth.

Connectivity will be improved on the Snapdragon 8 Gen 2 as described in the Snapdragon Connect Experience pillar. Sporting the new Snapdragon X70 5G Modem-RF System with Qualcomm® 5G AI Processor, expect faster than ever 5G speeds and first-in-market to support 5G+5G/4G Dual-SIM Dual-Active. It also features the Qualcomm® FastConnect™ 7800 connectivity system, for low latency Wi-Fi 7 and dual Bluetooth connectivity.

Soundly secure

Snapdragon has also beefed-up security on its new platform, with Snapdragon Secure. Described as premium level protection, it offers the latest tech available to protect your data and privacy with features such as the Qualcomm® 3D Sonic Sensor a Max fingerprint sensors. Finally, expect better audio performance with Snapdragon Sound. It features spatial audio with dynamic head-tracking for better surround-sound experience and supports 48kHz lossless music. Gamers will benefit from the built-in voice backchannel for clearer in-game voice chat and lowest-ever latency at 48ms.

In short, Snapdragon has brought out all the features of a flagship-level mobile platform with more intricate AI utilization as icing on the cake. For a full list of specifications and features, visit the official Snapdragon 8 Gen 2 webpage.

Mobile, News

Qualcomm Announces the Snapdragon 782G

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The new age of mobile computing is pretty much here. Qualcomm kicked it off with their new Snapdragon 8 Gen 2 System on a Chip (SoC) for flagship devices. This one will definitely go on powering the greats of the industry like the upcoming Samsung Galaxy S devices, next generation OPPO Find X device, the anticipated next-generation OnePlus flagship, and even Xiaomi’s next high-end device.

While flagships are highly popular in terms of branding and hype, they are not the devices that sells most. Google recognized it and scratched their Nexus project a few years ago and started their mid-range Pixel project that was met with welcome arms by users. The new Google Pixel devices are powered by their own Google Tensor processors. This was not the case a few generations ago though. Google’s Pixel project would not have been possible if Qualcomm did not introduce their very intriguing Snapdragon 700 series.

Qualcomm’s Snapdragon 700 series was introduced to fulfil a rather unique, but popular demand. It was made to fill the gap between their exclusive mid-range Snapdragon 600 series and number crunching high-end flagship Snapdragon 800 series processors for smartphone device. It was made to be sit in a smartphone that performs pretty much like a flagship device with an affordable price tag.

Alongside the new Snapdragon 8 Gen 2, they introduced their new high-performing Qualcomm Snapdragon 782G platform. The new platform will replace the older Snapdragon 778G+ that currently powers some of the most innovative devices out there like the unique Nothing Phone 1, Honor 60 Pro 5G, and even Motorola’s Edge 30 5G.

Qualcomm Snapdragon 782G
Source: SamMobile

The new Qualcomm Snapdragon 782G comes in with a the same eight-core configuration from the Snapdragon 778G+. The SoC is a more powerful one and is clocked faster than before though. It packs Qualcomm’s eight Kryo cores that clocks up to 2.7 GHz compared to the 2.5 GHz that was extracted from the older Kryo 670 platform.

The new platform also brings a whole host of improvements across the board that makes new mid-range class devices even more enticing than some flagship devices. For one, it packs a Qulcomm’s latest Quick Charge 4+ technology that allows your smartphones to charge at up to a theoretical 100W. In theory, it should allow most smartphones to charge well within an hour while maintaining an optimum temperature. There is Qualcomm’s new Quick Charge 5, but that is reserved for flagships at this point. Still, 100W is plenty fast for smartphones.

They have also improved their AI (Artificial Intelligence) engine that adds several features and capabilities in camera functions. At the same time, the improved AI is also supposed to improve video performance by enhancing the mic and speaker switching function to reduce interference and make video chats feel a lot more natural even without headphones. Of course, the AI engine is also supposed to help reduce battery consumption by cleverly understanding how individual users use the device and turn off apps based on those usages.

We mentioned camera, the processor is also supposedly a better image processor than before. It now supports up to 200-Megapixel resolution cameras for photographs. At the same time, the new processor also captures videos at up to 4K at 30 fps, with HDR on top of that. If you are going to capture action photos, it does 30 22-Megapixel photos in a second.

Of course, 5G has to be now included as a standard. It only makes sense since the SoC it replaces also packs 5G. The 5G antenna on this piece of kit supports both mmWave and Sub-6GHz frequencies, which means you are not going to have to worry about getting it to work with 5G standards across the globe. At home, the Snapdragon 782G supports up to 2.9 Gbps wireless transmission via 6GHz (WiFi 6/6E) standards.

The new mid-range SoC will find its way into the new generation of mid-range devices you will find in 2023. There is no announcements and confirmations on which devices will get the Snapdragon 782G powering them just yet. We are guessing that manufacturers like Xiaomi, OPPO, and even Samsung will be jumping on the platform and announce a device packing the new hardware in the coming months. More information on Qualcomm’s latest mid-range Snapdragon 782G SoC can be found on their website.

Business, Mobile, News

3nm is Not the Future – It Is Now with Samsung 

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Before we go any further; yes, the global chip shortage phenomenon is still a thing. Yes also, things are recovering, and it is looking much better now than last year, at least. Yes, 5nm chips are also already mighty impressive, the most powerful mobile devices are powered by 5nm chips.  

The Apple M1 chips and its variant powering all kinds of things are also 5nm chips, technically the most advanced computing solution you can find today. They introduced the M2 chip, also a 5nm chip to power their next generation devices, The most powerful mobile chip today, the Qualcomm Snapdragon 8 Gen 1 is built on the 5nm process too, and it is technically the most technologically impressive integrated processing chip made for smartphones today. 

This leads us to a question. What could possibly be better? How could anyone top off 5nm in the current generation? Is 4nm even possible? Turns out, it is. But Samsung did not just stop there, they went ahead and did one better with 3nm. 

Ahead of their closest rival in chip making, Samsung has kickstarted their 3nm fabrication line just today. If this goes into Samsung’s next generation Exynos, the Exynos chips will be the most advanced integrated processing chips the world has ever seen. That is also if there is no pushback from TSMC (Taiwan Semiconductor Manufacturing Co.).  

Samsung foundrys first 3nm chip production 4
Source: Samsung

TSMC’s foundries are responsible for more than half the world’s supply of chips. You can find TSMC produced chips in Apple devices, and more than half the Android devices in the world today with Qualcomm relying mostly on the Taiwanese foundry. They are expected to start their 3nm mass production as well later this year.  

Currently though, the only reference for 3nm chips is from Samsung. They say that 3nm chips are now 45% more efficient than 5nm chips. Samsung also says that 3nm chips are 23% more powerful comparatively.  

While this is a good step in the right direction for the technological world, it could mark a more important step in the chip industry. While the 3nm fabrication process could be more intensive and expensive than before, smaller more efficient chips could lower the strain on the entire global supply chain. Then again, it really depends on the overall demand for 7nm, 5nm, and 3nm chips in the current market.  

While Samsung has started their mass production efforts, and TSMC is looking to start their own 3nm production soon, we will not be seeing devices coming with 3nm chips anytime soon. You can expect 3nm chips to star in devices starting 2023, if we are lucky enough. Still, the Qualcomm Snapdragon 8 Plus Gen 1 is coming soon, and we are still excited about that.  

Android, Gaming, Mobile, News

MediaTek Takes on Flagships with Dimensity 9000+

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The absolute king of the hill right now when it comes to raw processing power on a smartphone platform is the Qualcomm Snapdragon 8 Gen 1 system on a chip (SoC). It is also what everybody, at least in the Android world, wants in their flagship smartphones currently. It is the most powerful SoC your smartphone can get today with only the Samsung Exynos as a distant challenger. They are introducing a new one too, very soon.

The second-generation Qualcomm Snapdragon SoC is not coming until the end of the year, as far as we know. In the meantime, there is MediaTek making their steps in high-end smartphone chips.

MediaTek APU 590 copy 3
Source: MediaTek

To be fair, the name MediaTek does not bring a lot of confidence in terms of high-end SoC for mobile applications. They are mostly known for their budget friendly SoCs in entry-level and mid-range smartphones. In that regards though, MediaTek’s SoCs have been solid performers in their class, in some cases probably better than what you can expect from price equivalent Qualcomm devices.

The new Dimensity 9000+ from MediaTek is their hope that the “budget king” perception ends. It is also MediaTek’s most powerful SoC to date with 5G in tow. The new Dimensity, in this case, goes head-to-head with Qualcomm’s current best.

At its core is the ARM Cortex-X2 architecture, the same one the Snapdragon 8 Gen 1 boasts in their Kryo CPUs. The single ARM Cortex-X2 core works with three powerful Cortex-A710 cores and low-power high-efficiency Cortex-A510 cores. The 4nm octa-core CPU arrangement makes ARM’s v9 architecture.

Vector Smart Object
Source: MediaTek

Besides the obvious CPU and GPU improvements, and 5G capabilities the SoC comes with a slew of compelling upgrades. One of which is LPDDR5X support with 8MB L3 CPU cache and 6MB system cache support for new-generation smartphones with ultra-fast memory. Instead of a Neural Processing Unit (NPU) that is widely boasted by its competitors, MediaTek opted for something a little more practical in a dedicated Application Processor Unit (APU 5.0) for all its A.I. purposes.

MediaTek also packs a powerful imaging processor withing the Dimensity 9000+. They call it the MediaTek Imagiq 790. Rivaling the Qualcomm’s own image processor, the new processor supports up to 18-bit HDR-ISP at up to 320-Megapixel. Of course, you there is no camera sensor in the world currently that packs that many pixels into an area less than an inch. It is good to know that you can super sample your photos to up to 320-Megapixel though.

The Imagiq 790 also allows the MediaTek Dimensity 9000+ equipped devices to record three videos simultaneously at up to 18-bit HDR formats. It even does 4K HDR with AI noise reduction, especially useful in low-light conditions.

pngegg 1
Source: MediaTek

The new MediaTek Dimensity 9000+ can support up to 144Hz WQHD+ or even 180Hz Full HD+ displays thanks to the new MiraVision 790 engine. The new display engine also has something called Intelligent Display Sync 2.0 technology that optimizes the power efficiency of the display. Thanks to the engine, the Wi-Fi display now supports up to 4K resolution at 60fps with HDR10+ streaming.

Of course, the latest and greatest SoC cannot be the latest and greatest if it does not pack the latest connectivity and networking technology. For that the 3GPP Release-16 5G modem can hit downlink speeds of up to 7Gbps. The new SoC also supports the latest WiFi 6E standards, new Bluetooth 5.3 standards, and even a new more accurate GNSS.

img mobile pic
Source: MediaTek

MediaTek is expecting their new Dimensity 9000+ to make its way to flagship devices starting Q3 2022. As mentioned, the Dimensity 9000+ is meant to be a direct competitor to the Snapdragon 8 Gen 1. At the same time, the second-generation Snapdragon 8 is meant to be announced by Q4 2022. How the Dimensity 9000+ will fare against the Qualcomm Snapdragon 8 Gen 1 remains to be seen. We think you might have to wait for the first Dimensity 9000+ devices to roll out. There are no confirmed devices sporting the new Mediatek flagship SoC currently too.

Mobile, News

Samsung Unleashes New Exynos 1080 SoC

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Samsung’s next-generation midrange SoC (system on a chip) is the newly introduced Exynos 1080. The new chipset offers the latest Cortex-A78 CPU cores paired with the latest Mali-G78 graphics core. It’s the first SoC in which Samsung is adopting a new 1+3+4 CPU configuration with one core clocked at 2.8GHz and 3 others at 2.6GHz. This is supplemented by 4 more Cortex-A55 cores which are clocked at 2.0GHz.

The chipset is built on a 5nm process, which has until now only been used by Apple in their A14 processor. The new 5nm, octa-core Exynos 1080 touts better performance with the new architecture and also boasts significant power efficiency boosts. According to Samsung, the single-core performance has been boosted by 50% while the multi-core performance is boosted by 100%.

Source: Samsung (weibo)

In addition to the power savings from the architecture itself, Samsung has also introduced a power-saving solution it calls “Amigo Power”. The new solution will help monitor and optimize battery consumption. Samsung is touting that the solution will make the Exynos 1080 10% more power-efficient than its predecessor. Samsung has also spent some time optimising the NPU and DSP which boast a machine-learning interference power of 5.7TOPs indicating that any AI programs running on the SoC should be able to crunch more data at any given time. This should indicate better, quicker image post-processing and optimizations in both user experience and response speed.

Power consumption isn’t the only area Samsung is focusing on. The Exynos 1080 SoC can support a single 200MP camera or dual 32MP + 32MP sensors. On the video end of things, the processor is able to support shooting up to 4K resolution at 60fps.

Connectivity-wise, the Exynos 1080 is going to be able to support 5G on both the sub-6GHz and mmWave spectrum which indicates that the SoC could be making it to the U.S. given that, until now, the U.S. is the only country with official rollout of 5G on the Sub-6 wavelength. Aside from 5G, the SoC supports Cat.18 4G LTE connectivity. The Exynos 1080 will also support Bluetooth 5.2 connectivity. In addition to this, the SoC will support up to 144Hz refresh rate, LPDDR5 RAM and has UFS 3.1 compatibility.

Source: Samsung (weibo)

The Exynos 1080 will be available in the market in Q1 of 2021. That said, it looks like it will be making its way to consumers in a new Vivo device first. It has been confirmed that the SoC will see its debut in the Vivo X60 series come 2021. Vivo will also be using last year’s Exynos 980 in their upcoming X30 series smartphones.

Mobile, News

OPPO dipping their hands into the bag of microchips

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OPPO is reportedly getting into the chip making game. This is not the first time a phone manufacturer creates its own chipsets to be used in their own smartphones. You know these brands too, they are Samsung and Huawei with Exynos and Kirin respectively. They call it the Mariana Plan. Not to be confused with the Mariana Trench, the plan will be led by Qualcomm’s former technical director in collaboration with engineers from Oppo’s sister companies, OnePlus and Realme.

In the past, OPPO mentioned of a big R&D push for an ecosystem of smart devices with an investment of RMB 50 billion which is just slightly over US$ 7 billion. Yes, that is what it takes to get into the game with the likes of Qualcomm and MediaTek.

There is no obvious reasons yet on why OPPO would make their own chipset. At the moment as OPPO has been great partners with Qualcomm and Mediatek. There is no indication as well on OPPO dropping the partners anytime soon. Possibly, OPPO sees a market that its missing out on or just a long term cost effective move to install its own chipsets into their phones. The chipsets could also be sold to other phone manufacturers to integrate them into their phones expanding the variety of chipset and value. 

With the on going US trade ban, HUAWEI is unable to integrate Qualcomm’s chipset into their phones. Fortunately HUAWEI has their own chipset to lessen the blow of the ban. Based on this logic, OPPO could be developing this new project as their own safety net.

At this point, OPPO has developed one of the best and best known Android iteration in ColorOS. There is no telling yet on what they can do with their chips. If their Android UI development is any indication, they could develop great chips at a fraction of the price of other manufacturers.

Business, Mobile, News

HiSilicon No Longer HUAWEI Exclusive

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You know that CPU in your HUAWEI smartphones that you are so used to? Yes, the HUAWEI branded processing chip that has been a staple in HUAWEI’s flagships and other smartphones. Yes, HiSilicon, as the title named. No, they are still HUAWEI’s subsidiary.

From 2020 onward though you might not just see HUAWEI devices fitting in chips from their in-house chip maker. They are starting to sell their chip technologies and processing chips to other manufacturers, expanding their business opportunities.

It does make a lot of sense this move of opening themselves up to the bigger market. HiSilicon makes some of the world’s cleverest and powerful processing chips to be put in a smartphone. The HiSilicon Kirin 990 for example, is proven to be one of the most powerful System on a Chip (SoC) to be found on a smartphone. So it is not like they make subpar products, they do make some compelling stuff. It is just that we have never seen anyone other than HUAWEI using the chips due to HUAWEI’s agreement with their subsidiary.

These years where Shanghai HiSilicon operates exclusively for HUAWEI too sees the Chinese telecommunication giant benefit from the clever chip designs of the chip manufacturer. The Kirin SoC series is partly responsible for HUAWEI’s successful P series and Mate series line-ups thanks to the clever dedicated Neural Processing Unit (mostly known as an AI chip) integration, first in the world in the HiSilicon Kirin 970.

The expansion does not just cover smartphone SoC sales though. The expansion also extends to Shenzhen HiSilicon expanding their manufacturing scope to more than just smartphone chips. They will be responsible for making processing chips for things like smart TVs, set-top boxes, and other smart home electronics that needs a processing chip.

Source: Android Central