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Invitation to Electrolux Q3 presentation

STOCKHOLM, Oct. 9, 2020Electrolux results for the third quarter of 2020 will be published on October 23, 2020, at approximately 08.00 CET.

A telephone conference will be held following the release of the results, starting at 09.00 CET. Jonas Samuelson, President and CEO and Therese Friberg, CFO will comment on the report.

Slides used in the presentation will be available at Electrolux website, www.electroluxgroup.com/ir. The third quarter report will also be available at the same address.

You can listen to the presentation here.

The details for participation by telephone are as follows:

Participants in Sweden should call +46-8-566-426-51

Participants in UK/Europe should call +44-3333-000-804

Participants in US should call +1-631-9131-422

Pin code: 36830556#

For further information, please contact:

Sophie Arnius, Head of Investor Relations, +46-70-590-80-72

Electrolux Press Hotline, +46-8-657-65-07

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TietoEVRY and Zwipe join forces to deliver biometric payments to banks in the Nordic and Baltic regions

OSLO, Norway and HELSINKI, Oct. 8, 2020 — Biometric fintech Zwipe and TietoEVRY, the leading provider of software and digital banking services in the Nordics, have agreed to jointly roll-out biometric payment solutions based on the Zwipe Pay ONE platform.

With the recent surge in demand for safer and more secure payments, TietoEVRY is embracing biometric payment innovations that enable more hygienic, secure and convenient payments for consumers.   

"We are excited to roll-out the Zwipe Pay ONE platform in close collaboration with Zwipe, a pioneer and innovator in biometric payments. We selected Zwipe as the most interesting partner for mass market deployment. Together, we will support banks to roll-out biometric payment cards and wearables at scale. From recent discussions with issuers, we already see broad interest for such innovations. Clearly, now is the time to take action," says Jarmo Rouhiainen, Head of TietoEVRY Card Production and Personalization Services.

As part of this commercial agreement, Zwipe will provide TietoEVRY with technical support towards biometric payment card integration, enrollment solutions, and a complete end-to-end advisory offering aimed at helping banks successfully deploy biometric payment solutions. TietoEVRY will source their Zwipe Pay ONE-based cards through their network of card manufacturers.

"Partnering with TietoEVRY is a significant milestone for Zwipe. TietoEVRY’s deep relations with a large number of banks in the Nordics, Baltics and beyond will be a strategic complement to Zwipe’s technology leadership, accelerating the deployment of next generation contactless payments. Partnering closely with one of Europe’s strongest players in payment services, we are further showcasing the value-add we deliver to the ecosystem," says André Løvestam, CEO of Zwipe.

This is information that Zwipe AS is obliged to make public pursuant to the Continuing obligations of companies admitted to trading on Oslo Børs Merkur Market, Nasdaq First North Growth Market and the EU Market Abuse Regulation. Certified Adviser on Nasdaq First North is FNCA Sweden AB, info@fnca.se, +46 (0) 8528 00 399. The information was submitted for publication, through the agency of the contact person set out above, at 12:00 CET on 8 October 2020.

CONTACT:

Contact persons:

Zwipe: 
André Løvestam, CEO
Email: info@zwipe.com
Tel: +47 991 66 135  

TietoEVRY: 
Jarmo Rouhiainen – Head of Card Personalisation
Email: jarmo.rouhiainen@tietoevry.com  
Tel: +358 40 558 3077

About Tieto EVRY

TietoEVRY creates digital advantage for businesses and society. We are a leading digital services and software company with local presence and global capabilities. Our Nordic values and heritage steer our success. TietoEVRY Financial Services Solutions create digital advantage for millions of customers every day, helping a wide range of Nordic and global companies in the financial services industry to digitalize business processes, secure operational efficiency and growth in an environment of constant regulatory change. Our portfolio provides a comprehensive range of services and processes, based on flexible modules and innovative scalable software platforms, from innovative real-time solutions within payments, cards and credit to running full stack operations and BPO services. To learn more, visit tietoevry.com

About Zwipe

Zwipe is pioneering the next generation contactless payments experience, providing biometric payment cards and wearables that enable consumers to authorize transactions with their fingerprints without compromising their privacy. Together with an ecosystem of partners including global brands within digital security and financial services, Zwipe is "Making Convenience Safe & Secure" for banks, merchants and consumers. Zwipe’s solutions address the hygiene and data theft pitfalls inherent in traditional authentication methods. Headquartered in Oslo, Norway, with a global presence, Zwipe is leading the next great shift in payments from contactless to contact free. To learn more visit www.zwipe.com

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TietoEVRY and Zwipe join forces to deliver biometric payments to banks in the Nordic and Baltic regions

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Tieto Evry Media Cover 1

 

AB Electrolux to propose reinstated dividend based on recovery in earnings and cash flow

STOCKHOLM, Sept. 25, 2020After assessing the company’s financial position and the impact of the coronavirus pandemic, the Board of Directors of AB Electrolux has decided to propose a dividend of SEK 7 per share for the fiscal year 2019. Electrolux has seen a substantial recovery in earnings and cash flow during the third quarter, with pent-up demand and government stimulus programs impacting consumer spending patterns and thus driving a positive development in all business areas.

On March 23, 2020, the Board of Directors withdrew its SEK 8.50 per share dividend proposal for the AGM 2020, in light of the then considerable uncertainty relating to the medium-term effects of the pandemic. Since then however, as was communicated in the second quarter report on July 17, market demand has begun to recover. In line with the outlook, demand has remained strong during the third quarter. Electrolux estimates that the negative impact initially seen related to the pandemic will largely be recovered in the operating profit for the nine-month period ending September 30, including a strong improvement in cash flow. Looking into the fourth quarter, visibility remains limited as demand may be impacted by several factors – both positive and negative – but at present, Electrolux anticipates financial performance to gradually normalize.

The Board of Directors therefore has concluded that a dividend can be proposed without jeopardizing Electrolux financial position. It will call for an Extraordinary General Meeting on November 3, 2020, to decide on a proposal for a dividend for the fiscal year 2019 of SEK 7 per share, to be paid in one installment. The Board will also propose that a performance based long-term share program for 2020 is implemented in line with its original proposal for the AGM 2020.

The Extraordinary General Meeting will also decide on a proposal from the Board of Directors to include a possibility in the Articles of Association to allow voting by post and to collect proxies before general meetings. Further details regarding the Extraordinary General Meeting will be provided shortly in a separate notice for the meeting.

Electrolux report for the third quarter of 2020 will be published on October 23, 2020 at about 0800 CET. The company will then provide an updated market and business outlook for the full year 2020.

This is information that AB Electrolux is obliged to make public pursuant to the EU Market Abuse Regulation. The information was submitted for publication, through the agency of the contact person set out above, at 0830 CET on September 25, 2020

For further information, please contact:                                          
Daniel Frykholm
Electrolux Press Hotline
+46 8 657 65 07

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Nomination Committee appointed for Electrolux Annual General Meeting 2021

– The members of the Nomination Committee for Electrolux Annual General Meeting in 2021 have now been appointed

STOCKHOLM, Sept. 22, 2020 — In accordance with decision by the Annual General Meeting, Electrolux Nomination Committee shall consist of six members. The Nomination Committee shall include members selected by each of the four largest shareholders in terms of voting rights that wish to participate in the committee, together with the Chairman of the Electrolux Board and one additional Board member.

The members of the Nomination Committee have now been appointed based on the ownership structure as of August 31, 2020. Johan Forssell, Investor AB, is the Chairman of the committee. The other members are Carina Silberg, Alecta, Tomas Risbecker, AMF – Försäkring och Fonder, and Marianne Nilsson, Swedbank Robur Funds. The committee will also include Staffan Bohman and Fredrik Persson, Chairman and Director, respectively, of Electrolux.

The Nomination Committee will prepare proposals for the Annual General Meeting in 2021 regarding Chairman of the Annual General Meeting, Board members, Chairman of the Board, remuneration for Board members, Auditor, Auditor’s fees and, to the extent deemed necessary, proposal regarding amendments of the current instruction for the Nomination Committee.

The Annual General Meeting will be held on March 25, 2021, in Stockholm, Sweden.

Shareholders who wish to submit proposals to the Nomination Committee should send an email to nominationcommittee@electrolux.com.

For further information, please contact:

Electrolux Press Hotline, +46-8-657-65-07

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ReTo Eco-Solutions Signs Cooperation Agreement to Build Large Scale Industrial Park and Elderly Wellness Town in Yangbi County

BEIJING, Sept. 16, 2020 — ReTo Eco-Solutions, Inc. (the "Company," "we" or "ReTo") (NASDAQ: RETO), a one-stop, total technology solutions provider for the healthy improvement of ecological environments, today announced that it signed a cooperation agreement with the People’s Government of Yangbi Yi Autonomous County.  Under the agreement, in Yangbi County the Company will be responsible for the planning, design and construction of an industrial park and elderly wellness town, which development is promoted by the government.

The large scale project covers 125 hectares, with 58 hectares designated for an ecologically-friendly industrial park and 67 hectares designated for an elderly wellness town providing healthcare, and serving as a destination for travel and vacations.  The geological survey for the project site is already underway, with preliminary work expected to take about four months, allowing for construction to commence in the first quarter of 2021.

Yangbi County is fast becoming an alternative eco-tourism center given its proximity to the historic, but over developed Dali City. Yangbi County is an hour’s drive from the Dali Airport and is close to Cangshan, another famous Chinese tourist attraction.  The natural environment and rich natural resources provide beneficial conditions for the development and operation of an elderly wellness town.  The area also benefits from active government support and attractive financial incentive programs designed to encourage development, eco-tourism and environmental protections.

Mr. Li Hengfang, ReTo’s Chairman and Chief Executive Officer, commented, "We greatly appreciate and value the confidence, support and partnership of the Yangbi government.  This important agreement further extends our relationship, as it builds on the previous projects we have signed in Yangbi County, for solid waste treatment, and ecological restoration, among others.  Our model of ecological restoration and industrial integration is unique and we believe offers compelling long-term benefits to the communities we operate in.  Our sustainable projects are scalable by design and help our partners achieve a better balance of social capital and environmental protection polices to the benefit of the broader society."

About ReTo Eco-Solutions, Inc. (NASDAQ: RETO)

Founded in 1999, ReTo (NASDAQ: RETO) is a leader in ecological innovation, with sustainable environmental priorities and seeks to empower communities through its proprietary technologies, systems and solutions, which have been used to bring clean water and fertile soil to villages and cities worldwide. The Company is founded on its strategy of Technology Improves Ecology and is a full spectrum provider of products and services, ranging from the production of environmentally-friendly construction materials, environmental protection equipment and manufacturing equipment used to produce environmentally-friendly construction materials, to project consulting, design and installation for the health and improvement of ecological environments,  such as ecological soil restoration, through solid waste treatment.  For more information, please visit: http://en.retoeco.com

Forward-Looking Statements

This press release contains forward-looking statements as defined by the Private Securities Litigation Reform Act of 1995. Forward-looking statements include statements concerning plans, objectives, goals, strategies, future events or performance, and underlying assumptions and other statements that are other than statements of historical facts. When the Company uses words such as "may," "will," "intend," "should," "believe," "expect," "anticipate," "project," "estimate" or similar expressions that do not relate solely to historical matters, it is making forward-looking statements.  Specifically, the Company’s statements regarding: 1) its ability to assist in environmental protection; and 2) its ability to complete the construction of the industrial park and elderly wellness town are forward-looking statements.  Forward-looking statements are not guarantees of future performance and involve risks and uncertainties that may cause the actual results to differ materially from the Company’s expectations discussed in the forward-looking statements. These statements are subject to uncertainties and risks including, but not limited to, the following:  the Company’s goals and strategies; the Company’s future business development; product and service demand and acceptance; changes in technology; economic conditions; the growth of construction and ecological solutions in China and internationally; reputation and brand; the impact of competition and pricing; government regulations; fluctuations in general economic and business conditions in China and internationally and assumptions underlying or related to any of the foregoing and other risks contained in reports filed by the Company with the Securities and Exchange Commission.  For these reasons, among others, investors are cautioned not to place undue reliance upon any forward-looking statements in this press release. Additional factors are discussed in the Company’s filings with the U.S. Securities and Exchange Commission, which are available for review at www.sec.gov. The Company undertakes no obligation to publicly revise these forward-looking statements to reflect events or circumstances that arise after the date hereof.

 

Related Links :

http://en.retoeco.com

ChipMOS REPORTS AUGUST 2020 REVENUE

HSINCHU, Sept. 9, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported its unaudited consolidated revenue for the month of August 2020.  All U.S. dollar figures cited in this press release are based on the exchange rate of NT$29.37 to US$1.00 as of August 31, 2020.

Revenue for the month of August 2020 was NT$1,902.5 million or US$64.8 million, an increase of 0.8% as compared to July 2020 and a decrease of 0.5% compared to August 2019.  The Company noted it is benefiting from increased DDIC and bumping demand driven by new HD-grade smartphone models, along with large- and mid-size panels to meet TDDI, TV, notebook tablet growth, respectively.  Wafer test capacity of high end platform for DDIC is almost fully utilized due to increased demand combined with required longer TDDI test times.

Consolidated Monthly Revenues (Unaudited)

August 2020

July 2020

August 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,902.5

1,886.6

1,912.2

0.8%

-0.5%

Revenues

(US$ million)

64.8

64.2

65.1

0.8%

-0.5%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

Related Links :

https://www.chipmos.com

Semiconductor Manufacturing International Corporation Responses to Media on the U.S. Government’s Consideration to Add the Company to a Trade Blacklist

SHANGHAI, Sept. 5, 2020 — Reuters reported Friday, September 4 (EST), citing a Defense Department official that the Trump administration is considering whether to add China’s top chipmaker SMIC to a trade blacklist.

SMIC solemnly declares that the Company, a public company listed on the Hong Kong Stock Exchange and the Sci-Tech Innovation Board (STAR Market), is an international semiconductor foundry strictly complying with the laws and regulations of all jurisdictions where it performs its businesses.  Since its inception, the Company has been fully compliant with all rules and laws. SMIC has maintained long-term strategic partnerships with multiple U.S.-based semiconductor equipment suppliers.  Over the years, the Bureau of Industry and Security (BIS) has granted numerous export licenses for the Company.  With a large and diverse customer base, serving companies in the U.S., Europe, and other Asian regions, SMIC plays an important role in the global semiconductor supply chain.  The Company manufactures semiconductors and provides services solely for civilian and commercial end-users and end-uses.  We have no relationship with the Chinese military.  In and before 2016, SMIC had been granted Validated End-User (VEU) authorization by the BIS and the company hosted several visits from U.S. Government officials.  Any assumptions of the Company’s ties with the Chinese military are untrue statements and false accusations.  The Company is in complete shock and perplexity to the news.  Nevertheless, SMIC is open to sincere and transparent communication with the U.S. Government agencies in hope of resolving potential misunderstandings.

About SMIC
Semiconductor Manufacturing International Corporation ("SMIC", SSE STAR MARKET: 688981; SEHK: 00981; OTCQX: SMICY) and its subsidiaries collectively constitute one of the leading foundries in the world, is Mainland China’s most advanced and largest foundry, broadest in technology coverage, and most comprehensive in semiconductor manufacturing services. SMIC Group provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 14 nanometer. Headquartered in Shanghai, China, SMIC Group has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab), a 200mm fab and a majority-owned joint-venture 300mm fab for advanced nodes (under construction) in Shanghai; a 300mm fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin. SMIC Group also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan China, and a representative office in Hong Kong China. For more information, please visit www.smics.com.

 

 

Related Links :

http://www.smics.com

Hebron Announces Results of Annual General Meeting

SHANGHAI and WENZHOU, China, September 5, 2020 — Hebron Technology Co., Ltd. ("Hebron" or the "Company") (Nasdaq: HEBT), a provider of innovative comprehensive solutions through an integration of technology, industry, and finance, today announced the results of its 2020 Annual General Meeting of Shareholders ("AGM" or the "Meeting") held on September 4, 2020. All of the proposals brought forward to shareholders for consideration and approval at the 2020 AGM were approved.

Shareholders representing 44.48% of the outstanding shares voted in favor of all the proposals submitted before the AGM, including:

(i) 

to elect six members of the Board of Directors, each to serve a term expiring at the Annual  Meeting of Shareholders for their respective terms or until their successors are duly elected and qualified;

(ii)  

to ratify the appointment of Wei, Wei & Co., LLP as the Company’s independent registered public accounting firm for the fiscal year ending December 31, 2020;

(iii)   

to approve and adopt an amendment to the Company’s Memorandum of Association, as amended to change the Company’s corporate name to "Nisun International Enterprise Development Group Co. Ltd."; and

(iv)    

to transact any other business properly coming before the meeting.

The Company mailed a proxy statement that describes the proposals to be considered at the Meeting and a proxy card on or about August 14, 2020. For more information, please see the Company’s Proxy Statement relating to the Meeting, which was filed to the Securities and Exchange Commission (the "SEC") on Form 6-K on August 14, 2020. A detailed notice of the AGM is available on Hebron’s website at http://www.fintaike.com.

About Hebron Technology Co., Ltd.

Hebron Technology Co., Ltd. (NASDAQ: HEBT) provides innovative comprehensive solutions for governments, financial institutions, small and micro businesses, and individuals in China by integrating technology, industry, and finance. Through its subsidiaries, the Company provides fintech services, consulting services, business services, and intermediary services to clients in a variety of industries. Its innovations include an open fintech ecosystem for financial institutions, a government credit system, an efficient capital liquidity system for the agriculture sector, and financial advisory intermediary services. Hebron’s technology-driven model deepens the link between industry and finance, serving the real economy and capturing opportunities in the new technology era. For more information, please visit http://www.fintaike.com.

Cautionary Note Regarding Forward-Looking Statements

This press release contains information about Hebron’s view of its future expectations, plans and prospects that constitute forward-looking statements. Actual results may differ materially from historical results or those indicated by these forward-looking statements as a result of a variety of factors including, but not limited to, risks and uncertainties associated with its ability to raise additional funding, its ability to maintain and grow its business both in legacy and new segments, variability of operating results, its ability to maintain and enhance its brand, its development and introduction of new products and services, the successful integration of acquired companies, technologies and assets into its portfolio of products and services, marketing and other business development initiatives, competition in the industry, general government regulation, economic conditions, dependence on key personnel, the ability to attract, hire and retain personnel who possess the technical skills and experience necessary to meet the requirements of its clients, and its ability to protect its intellectual property. Hebron encourages you to review other factors that may affect its future results in Hebron’s registration statement and in its other filings with the Securities and Exchange Commission. Hebron assumes no obligation to update or revise its forward-looking statements as a result of new information, future events or otherwise.

Contacts:

Hebron Technology Co., Ltd.
Investor Relations
Shaokang (Ken) Lu
Tel: +86 (21) 2357-0055
Email: lushaokang@cnisun.com

ICR, LLC
Tel: +1 203 682 8233
Email: hebron@icrinc.com 

 

Hebron Announces Appointment of Chief Executive Officer

SHANGHAI and WENZHOU, China, Sept. 4, 2020 — Hebron Technology Co., Ltd. ("Hebron" or the "Company") (Nasdaq: HEBT), a provider of innovative comprehensive solutions through an integration of technology, industry, and finance, today announced the appointment of Mr. Xiaoyun Huang as Chairman and Chief Executive Officer ("CEO"), effective immediately.

Mr. Huang has over 10 years of experience in the fintech industry. Prior to joining Hebron, Mr. Huang served as President and CEO of Huizhong Business Consulting, where he played an instrumental role in the formation of development plans and as a major driver of growth for the overall business. Previously, he served as Chairman and General Manager of Beijing Hengtai Puhui Information Services and as President and CEO of Hangzhou Rongdu Technology. He has participated many high-profiled projects including CSRC, NEEQ, E-Capital Transfer, Shanghai Clearing House, Beijing Financial Assets Exchange, Hundsun Technologies, etc. Mr. Huang holds a B.S. degree in Computer Science and Technology from Shanghai University of Electric Power.

"I am honored to lead the company as Hebron’s Chairman and Chief Executive Officer," Mr. Huang said. "I look forward to working closely with our exceptional senior leadership team and our entire board of directors. Together, we plan to take Hebron to the next phase of growth by remaining focused on serving our clients and creating value for our stakeholders."

About Hebron Technology Co., Ltd.

Hebron Technology Co., Ltd. (NASDAQ: HEBT) provides innovative comprehensive solutions for financial institutions, small and micro businesses, and individuals in China by integrating technology, industry, and finance. Through its subsidiaries, the Company provides fintech services, consulting services, business services, and intermediary services to clients in a variety of industries. Its innovations include an open fintech ecosystem for financial institutions, a credit system, an efficient liquidity system for the agriculture sector, and financial advisory intermediary services. Hebron’s technology-driven model deepens the link between industry and finance, serving and enabling the real economy and capturing opportunities in the new technology era. For more information, please visit http://www.fintaike.com.

Cautionary Note Regarding Forward-Looking Statements

This press release contains information about Hebron’s view of its future expectations, plans and prospects that constitute forward-looking statements. Actual results may differ materially from historical results or those indicated by these forward-looking statements as a result of a variety of factors including, but not limited to, risks and uncertainties associated with its ability to raise additional funding, its ability to maintain and grow its business both in legacy and new segments, variability of operating results, its ability to maintain and enhance its brand, its development and introduction of new products and services, the successful integration of acquired companies, technologies and assets into its portfolio of products and services, marketing and other business development initiatives, competition in the industry, general government regulation, economic conditions, dependence on key personnel, the ability to attract, hire and retain personnel who possess the technical skills and experience necessary to meet the requirements of its clients, and its ability to protect its intellectual property. Hebron encourages you to review other factors that may affect its future results in Hebron’s registration statement and in its other filings with the Securities and Exchange Commission. Hebron assumes no obligation to update or revise its forward-looking statements as a result of new information, future events or otherwise.

Contacts:
Hebron Technology Co., Ltd.
Investor Relations
Shaokang (Ken) Lu
Tel: +86 (21) 2357-0055
Email: lushaokang@cnisun.com

ICR, LLC
Tel: +1 203 682 8233
Email: hebron@icrinc.com

  

Related Links :

http://www.fintaike.com

Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States

MediaTek’s Dimensity 1000C delivers premium 5G experiences, advance AI capabilities, enhanced display features and ultra-fast connectivity

TAIPEI, Sept. 3, 2020MediaTek today announced its newest 5G smartphone chip, the Dimensity 1000C, which debuted first in the United States.

MediaTek's Dimensity 1000C 5G smartphone chipset debuts first in the US powering the new LG Velvet on T-Mobile's nationwide 5G network.
MediaTek’s Dimensity 1000C 5G smartphone chipset debuts first in the US powering the new LG Velvet on T-Mobile’s nationwide 5G network.

The Dimensity 1000C will power LG’s newest device, the LG VELVET™ on T-Mobile’s nationwide 5G network, and deliver advance AI capabilities, enhanced display features, fast connectivity and improved multimedia capabilities for a premium user experience.

"From the world’s first standalone 5G data call to collaborating on their first 5G chipset in America, T-Mobile and MediaTek have partnered to move 5G innovation forward," said Ryan Sullivan, VP of Product Development at T-Mobile. "This is another step towards #5GforAll on America’s largest nationwide 5G network."

The 7nm Dimensity 1000C features super fast 5G speeds and expands MediaTek’s  5G family of chipsets and its flagship series that delivers full premium 5G experiences for smartphone users.

"Compared to other parts of the world, consumers in the U.S. haven’t had much choice on the chipset side when it comes to 5G smartphones," said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. "MediaTek is focused on giving consumers more options and expanding access to 5G devices so that everyone can enjoy the premium features and speeds that are defining the next era of mobile computing."

The Dimensity 1000C features four Arm-Cortex-A77 CPU cores and four power-efficient Arm Cortex-A55 cores operating up to 2GHz, with a large, low-latency communal cache that improves performance and power-efficiency even further. Five Arm Mali-G57 GPU cores mean avid gamers have powerful graphics at their fingertips. The MediaTek AI processing unit (APU 3.0) combines three different types of AI processors. This versatile and unique design meets the needs of the latest AI-camera, AI-assistant, in-app and OS-enhancements for superior smartphone experiences.

Key features and specs include:

  • AV1 with Netflix: The Dimensity 1000C enables AV1 HDR on Netflix, and AV1 video streaming on YouTube. MediaTek is also working with Twitch, the world’s leading live streaming channel, to bring AV1 video streaming to mobile.
  • Dual Voice Wake Up: The Dimensity 1000C is MediaTek’s first SoC model with dual integrated Voice Wakeup (VoW) function in US that minimizes the power of applications in the Android OS such as the always-on Google Assistant.    
  • Dual Display: The Dimensity 1000C is MediaTek’s first model to support dual display.
  • Advanced Camera Support: For stronger and more precise face detection, the Dimensity 1000C is equipped with an advanced AI face detection hardware engine.

MediaTek Dimensity 1000 powered devices have already launched with key smartphone brands in other markets. The Dimenstiy  1000C was developed and tailored for the US market. The 1000 series joins MediaTek’s other popular Dimensity 5G chips including the Dimensity 800 and Dimensity 700 series. MediaTek offers a full range of 5G chips to bring the promise of 5G to everyone.

MediaTek  5G technologies are integrated across product lines – including in smartphones and 5G connectivity for routers and PCs.

For more details on MediaTek’s Dimensity series, visit: https://i.mediatek.com/mediatek-5g 

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 1.5 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek Press Office:

PR@mediatek.com
Kevin Keating, MediaTek
+1 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

Related Links :

http://www.mediatek.com