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PR Newswire

ARTERY AT32 MCU-based Solutions for High-speed Multi-Functional Peripheral

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HSINCHU, Jan. 5, 2024 /PRNewswire/ — Office facilities are always fundamental to business. To save manpower and promote efficiency, more and more user-friendly office equipment have been introduced, and one of the most brilliant device is the multi-functional peripheral (MFP) that integrates copier, printer, scanner and fax machine. It also supports networking, which brings risks of privacy leakage. To eliminate such risks and guarantee stable operation, microcontrollers are used to manage communication and collaboration among functional modules by executing complex instructions with the help of its programmability and powerful processing and control capabilities.

AT32F435/437 series, powered by ARM® Cortex®-M4, have excellent data processing performance and can reach up to 288 MHz computing speed. It supports up to 4032 KB Flash memory and 512 KB SRAM, and features a single precision floating-point unit (FPU), digital signal processor (DSP) and rich peripherals such as 2x QSPIs, 2x OTGs, DVP, communication interfaces and XMC interface (for SDRAM, SRAM and PSRAM) for flexible applications. In addition, it has 3x high-speed ADC engines (5.33 Msps), which supports MFPs to perform for printing, scanning, copying and faxing with fast responses and efficient algorithms.

Main features of AT32F435/437 in MFP applications:

  • High-performance CPU capability, providing a configurable hardware pipeline to support printing, scanning, copying and faxing
  • Support multiple high-speed PWM outputs for simultaneous motor control
  • Multi-channel ADC/DAC designed with sensors for accurate sensing and printing control
  • Up to 18 timers to realize highly integrated motion control for printing unit output, and lower system cost and complexity
  • Small-sized PCB, with built-in high-speed oscillator and providing various package types
  • Support security library (sLib) settings to protect the defined area with a code, thus improving security
  • Integrate high-speed communication interfaces including USART/UART, USB OTG, CAN, SDIO and Ethernet (AT32F437 only) to improving networking efficiency and stability
  • Support software OTA update, which allows users to update, iterate and expand MFP functions

Diagram of hardware system:

Diagram of AT32 MCU MFP applications
Diagram of AT32 MCU MFP applications

About ARTERY:

ARTERY Technology is a global MCU design company focusing on promoting innovative development of ARM® Cortex®-M4/M0+ 32-bit MCUs. As of the year 2023, ARTERY has launched a total of 15 AT32 MCU product series including nearly 200 parts, bringing about 80~288 MHz computing speed and supporting 16~4032 KB FLASH and 9~512KB SRAM. AT32 MCUs also designed with 12-bit ADC to capture external signals, rich communication interfaces and multi-channel PWM to offer solutions for applications such as IoT, industrial control, motor control, consumer electronics and commerce. https://www.arterychip.com 

PR Newswire

Zero Zero to Bring HOVERAirX1 Pocket-Sized Self-Flying Camera to CES

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The brand will preview its upcoming Gesture Control feature, which leverages advanced computer vision to control the camera with arm movements

LAS VEGAS, Jan. 5, 2024 /PRNewswire/ — Zero Zero Robotics, experts in user-friendly devices featuring machine vision and precise control systems, is excited to announce its participation at the 2024 Consumer Electronics Show (CES) in Las Vegas. They are set to showcase their best-selling HOVERAir X1 pocket-sized 2.7K self-flying camera at the Venetian Expo Halls A-D, Global Pavilions, booth no. 55745 from January 9 – 12, 2024. Attendees will get a first look at the camera’s new Gesture Control feature, a breakthrough in user interaction that utilizes advanced computer vision to direct the camera through simple arm movements.

Fun-Filled Flight, Zero Zero at CES 2024
Fun-Filled Flight, Zero Zero at CES 2024

2023 marked a significant milestone for HOVERAIR X1, with the initial Indiegogo campaign generating overwhelming support, attracting over 5,000 backers and raising $1.8M USD. This success was followed by a robust direct sales launch, and subsequent introductions on Amazon USA, Canada, and Australia. To date, the HOVERAIR X1 has sold tens of thousands of units across nearly 40 countries.

Meet HOVERAir in Real Life
Meet HOVERAir in Real Life

Weighing a mere 125g, HOVERAir X1 is a lightweight device that frees users from the hassles of registration in most parts of the US, thanks to its compact design. The HOVERAir X1 epitomizes the fusion of fun, portability, and performance. Launching effortlessly from the palm within seconds, it offers a suite of autonomous flight modes, ensuring crisp visuals, stabilized recordings, and uniquely, outstanding audio clarity, all housed within a safety-first, cage-like design.

“We’re excited to bring HOVERAir X1 to CES this year and introduce our new Gesture Control feature which levels up the ability of users to easily and intuitively create unique and creative videos,” said MQ Wang, Founder & CEO of Zero Zero. “This new technology is a testament to our commitment to pushing the boundaries, enhancing the user experience, and opening up new creative possibilities.”

The device boasts a rapid 3-second launch and landing protocol, springing to action from the palm and returning with equal ease. Its enclosed design prioritizes user safety, while the recording specs, ranging from 2.7K@30fps to 1080P HDR, offer a plethora of high-definition filming options. Features like Burst mode and hybrid stabilization promise fluid, high-quality footage. Its sleek, foldable design makes it the perfect travel companion, fitting seamlessly into pockets or purses.

An array of five cinematic flight modes (Hover, Follow, Zoom Out, Orbit, Bird’s Eye) offer unique perspectives and are easily activated with a single touch. For those desiring finer control, a dedicated app allows for real-time composition adjustments, editing, and instant sharing on social platforms. The device’s cutting-edge computer vision and robust tracking capabilities allow it to follow users at speeds over 15mph. Utilizing Visual Inertial Odometry (VIO) technology and a ToF laser altitude system, it ensures centimeter-level precision, facilitating seamless transitions between indoor and outdoor environments.

“Through HOVERAir X1, we aim to redefine the way people capture and share their moments,” continued Wang. “Gesture Control is just the beginning of a series of new capabilities we plan to introduce, revolutionizing personal photography and content creation.”

The HOVERAir X1 defines what a flying camera is—no controller, no app, just intuitive, hands-free operation. With its light frame, enclosed design, and versatile flight modes, this camera is an indispensable tool for capturing life’s fleeting moments.

Media wishing to experience a live demo of HOVERAir X1 at CES or interview Zero Zero’s personnel should contact PR agency representative Borjana Slipicevic.

About Zero Zero              

Zero Zero was co-founded in 2014 by Stanford Phds, MQ Wang and Tony Zhang. Zero Zero specializes in embedded AI technology to create intelligent devices characterized by machine vision and high-precision control systems. Zero Zero’s team members are dreamers, engineers, inventors, and builders hailing from top universities and research institutions around the world. Its investors include IDG, ZhenFund, and other top US investors. Zero Zero holds more than 120 core patents and has pioneered new technologies, such as fully enclosed portable propeller design and bi-copter design.

CONTACT:
Borjana Slipicevic
Proper Propaganda
borjana@properpropaganda.net

PR Newswire

GEEKOM Unveils its Presence at CES 2024

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TAIPEI, Dec. 21, 2023 /PRNewswire/ — GEEKOM, renowned as the Green Mini PC Global Leader, proudly announces its participation in the long-awaited CES 2024, solidifying its standing as the global leader in Mini PCs. With two decades of industry expertise, GEEKOM has consistently delivered high-quality, environmentally friendly Mini PCs, establishing itself as the go-to brand for reliable computing solutions. As CES 2024 approaches, GEEKOM is gearing up to showcase its latest innovations.

Besides exhibiting its already diversified lineup of mini PCs, GEEKOM has also promised to release a few new exciting products at CES 2024.

First up is the IT14 Pro. The 0.7L mini PC will feature up to an Intel Meteor Lake Core Ultra 7-155H processor, with dual-channel DDR5-5600 RAM and dual SSDs. Built on the all new 4nm process, the Ultra 7 chip is 20% faster compared to last generation’s Intel Core i7-1360P in terms of CPU multi-core performance, delivering ample oomph for even the most demanding productivity tasks. Also, the new Intel Arc i-GPU offers up to 90% performance boost over the Intel Iris Xe Graphics eligible i-GPU found in previous generations of Intel Core chips, allowing you to experience more efficient work and play. Furthermore, the GEEKOM IT14 Pro comes with a Neural Processing Unit (NPU) with dedicated AI acceleration support, which will fundamentally change how you interact with your mini PC.

In addition, GEEKOM will launch the world’s first mini PC with an AMD Hawk Point Ryzen 8040 chip, demonstrating the brand’s commitment to diverse, powerful computing solutions. The A8Max is available in two processor options: Ryzen 7 8840HS and Ryzen 9 8940HS. Both SoCs have incorporated an NPU dedicated to AI, their Zen 4 CPU cores and Radeon 780M i-GPU are also optimized for AI workloads.

Last but not least, GEEKOM plans to reveal a new mini PC designed for gaming enthusiasts! Boasting a powerful AMD Ryzen 8940H CPU, and an AMD RX 7600M XT discrete graphics card, the APro8 Max is a true beast! The AMD RX 7600M XT GPU is basically on par with the Nvidia GeForce RTX 4060 (for laptop) in terms of gaming performance, enabling you to run the most graphics-intensive AAA titles at medium to high quality settings. The AMD SmartShift technology dynamically shifts power between the Ryzen 8940H processor and the RX 7600M XT GPU. Not only will it enhance your experiences in gaming, video editing and 3D rendering on the APro8 Max, but it will also handily improve the mini PC’s power efficiency.

The highly anticipated unveiling of a Mini PC featuring a discrete graphics card raises expectations. This innovation is poised to set new standards in performance and visual capabilities. Attendees can expect to witness a stunning array of GEEKOM’s technological ace products at CES 2024.

GEEKOM invites all tech enthusiasts and industry professionals to be part of this extraordinary event. To enhance your CES experience, GEEKOM encourages you to register for the event. As a token of appreciation, attendees who register and visit GEEKOM’s booth will receive a special gift, providing the perfect memento for capturing moments at the venue. Your presence at CES 2024 is not just attendance; it’s an immersive experience into the future of technology. Don’t miss the opportunity; join GEEKOM at CES 2024 and witness the future of Mini PCs.

Event Details:
Event Time: January 9, 2024 – January 14, 2024
Venue:
Hall: Venetian Expo, Level 1 Meeting Rooms
Booth Number: 75111
Venice Pavilion Address: 201 Sands Ave, Las Vegas, NV 89169

For more information and event registration, please visit GEEKOMPC.COM or follow GEEKOM on social media for real-time updates and behind-the-scenes glimpses: Instagram, Facebook, and Twitter.

PR Newswire

Chipsea Technologies (Shenzhen) Co., Ltd., a “new player” in the global PC industry chain, has once again been awarded an Intel Platform Component List (PCL) certification, for its new EC product E2010

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SHENZHEN, China, Nov. 25, 2023 /PRNewswire/ — Recently, China’s A-share listed company Chipsea Technologies (stock code: 688595) has seen its new generation EC chip CSCE2010 successfully passed Intel PCL (Platform Component List) certification, turning it into the world’s first EC product to meet the advanced process requirements of Intel MTL. Over the past two years, Chipsea Technologies has successively launched two 32-bit high-performance EC chips, namely the product CSC2E101 (E2101) for the commercial PC market and the product CSCE2010 for the consumer PC market. Both of them have met Intel PCL certification, fully demonstrating the company’s rich technological accumulation and strong innovation power in EC field, and have achieved the company’s breakthroughs both in technology and business circles. Chipsea Technologies is rapidly establishing itself as a dynamic and innovative force in the global PC industry. Through a series of forward-looking product innovations, the company has kicked off multiple products such as EC, PD, USB Hub, HapticPad® solutions, and BMS (battery management system), and signed a cooperation memorandum and established a good cooperative relationship with Intel. Looking  ahead, Chipsea is planning to build a global supply system to provide global and diversified supply guarantees and offer customers with more competitive products.

Established 20 years ago, Chipsea Technologies is an integrated circuit design company that integrates sensing, computing, control and connection. The company has rich technical accumulation in the fields of analog signal chain and MCU (microprogrammed control unit), and has become a global leader in the fields of pressure touch and health measurement chips. The company debuted on China’s A-share market in 2020, and has become “China’s first stock in the field of signal chain chip.”

new EC product E2010
new EC product E2010

Currently, Chipsea Technologies is on a fast development track, with its products and businesses spanning multiple market segments such as automotive electronics, computers and communications, BMS (battery management system), industrial measurement and control, health measurement, and AIoT (AI + IoT). Meanwhile, Chipsea Technologies has built a total quality management (TQM) system that can meet international standards such as ISO9001, GB/T29490, ISO27001, ISO26262, IATF16949, covering the full-lifecycle quality management of products from chip definition to design, through manufacturing and package testing, to final mass production and delivery, to ensure high reliability, high performance and high quality of products, and bring more novel ideas and surprising experiences to customers around the world. Chipsea’s commitment to reliability, performance, and quality not only meets but exceeds global benchmarks, fostering innovative and enriching experiences for customers worldwide.

Contact: sales@chipsea.com; lutt@chipsea.com 

www.chipsea.com

Source: Chipsea Technologies (Shenzhen) Corp.

PR Newswire

SINGAPORE’S NOZAMA TEAM EMERGES CHAMPION IN HUAWEI DEVELOPER COMPETITION 2023 UNDER ASIA PACIFIC REGION CATEGORY

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 DONGGUAN, China, Nov. 22, 2023 /PRNewswire/ — The 2023 edition of the Huawei Developer Competition, which attracted more than 19,000 developers and 3,000 teams from more than 30 countries and regions, came to its finale on November 19, 2023.

Themed “Spark Infinity”, the event’s Finals and Awards Ceremony were wrapped up successfully at Huawei’s Songshan Lake in Dongguan, Guangdong province, China.

For Asia Pacific, the five-month long competition, which focus on cloud foundation segment, attracted 136 teams from 12 countries and regions with a 116 entries submitted.

After rigorous selection, three teams from Singapore successfully made it to the Top 9 in the Huawei Developer Competition Asia-Pacific Region segment, while the rest were from Malaysia (two teams) and one apiece from Hong Kong, mainland China, Indonesia, Thailand and the Philippines.

The nine teams pitched their solutions at the final round held in Songshan Lake.

Kang Ning, President of Huawei Cloud Ecosystem
Kang Ning, President of Huawei Cloud Ecosystem

Kang Ning, President of Huawei Cloud Ecosystem, said in his speech: “The global digital economy is thriving, with foundational models emerging that are reshaping the industry. Developers, who are at the heart of this ecosystem, are also experiencing unprecedented opportunities. Huawei stands ready to collaborate with developers to explore the realms of multi-architecture computing, AI, and cloud native technologies, paving the way for a digital future.”

Singapore’s Nozama, comprising Cedric Khua, Daren Tan, Daniel Choo and Glenda Teo emerged the grand winner and took home US$10,000 with their entry “Magik” that targeted children’s development through play.

Grand prize winner - team Nozama from Singapore
Grand prize winner – team Nozama from Singapore

“Kids need play. But when busy parents choose to rely on electronic devices to provide entertainment for their children, it leads to adverse effects such as a decreased attention span, addiction, overstimulation, and a lack of motor skills and problem solving skills,” the team said in their presentation.

According to Nozama, their Magik bridges the gap between physical toys and digital ones by offering a hybrid play experience, combining the benefits of both mediums of play to provide engaging and fun filled games for children.

The first runner-up and prize money of US$5,000 went to Thailand’s Netizen team which focused on the surge in food delivery services that has led to a complex accounting process for businesses to reconcile revenue received.

Their “Reconcile Process Automation” solution allows accounting departments to check the reconciled balance, and executives can see the daily sales summary of each branch the next day.

1st runner-up winners - Netizen from Thailand and DecentraRating from Singapore
1st runner-up winners – Netizen from Thailand and DecentraRating from Singapore

Singapore’s DecentraRating team also win the first runner-up prizes with their solution on addressing fake reviews and malicious content on E-commerce platforms.

In his speech, Andy Jin Hui, Huawei Cloud APAC Vice President and Head of Marketing and Industry Development, said the Huawei Developer Competition is a global initiative opened for global developers aimed at promoting technological achievements, identifying outstanding projects and applications, and building an open, thriving developer ecosystem with the cloud as its foundation.

“Many excellent projects unfortunately did not make it past the shortlisting rounds, but they still deserve our applause, and we welcome them to participate again next year,” said Mr Andy.

Mr Andy also proclaimed that in addition to the main programs, Huawei also organized two technical empowerment training sessions, answering over 100 questions raised by participants during the competition.

About 400 individuals participated in the competition, making it a tremendous achievement for garnering such a response from developers.

Throughout the competition, a plethora of interesting and community-based projects that could benefit from integration with various applications from Huawei were exhibited.

Among other projects that made it to the final round were Thailand’s entry on “Watchable Content in Native Language” that looks at the Soca’s AI platform that power’s seamless communication and creation across any language.

The CyberWhiz team from University Putra Malaysia on the other hand flaunted a transparent and friendly complaint lodge system for the public, highlighting the need for a system to report and complain about potholes and bad roads in the country.

City University of Hong Kong’s Laboratory for SMART Animal Management came out with an innovative AI-driven solution that revolutionizes livestock management.

Not only did the winning teams and individuals in the competition received accolades and prize money, Huawei also offered support through four major programs: Huawei Developer Program, Spark Program, HCDG, and HCSD.

At the award ceremony, Huawei also presented the Huawei Cloud Campus Ambassador Certificate to the Top 9 student team leaders in the competition.

Among the selected students were Cao Yuxuan (Nanyang Technological University of Singapore), Jet Maquiling, from STI College of Philippines , Cedric Khu Yan Han from National University of Singapore, Nidhi Mahejabeen Hossain from City University of Hong Kong and Muhammad Anas Mohd Marzuki from Universiti Putra Malaysia.

Huawei is committed to advancing the integration of software, hardware, edge, device, and cloud, as well as partnering with development ecosystems, increasing investment in R&D innovation, and collaborating with developers across different industries to drive global technological progress.

For more than 30 years, Huawei has been committed to technological innovation, making new breakthroughs and using technology to propel the world forward.

The Huawei Developers Competition provides huge opportunities for hundreds of ambitious developers to reach new heights and embrace the challenging world.

About HUAWEI CLOUD

HUAWEI CLOUD has been committed to building an open and win-win ecosystem with the cynosure placed on developers. Currently, HUAWEI CLOUD has more than five million global developers, more than 42,000 partners, and exceeding 10,000 cloud store SaaS applications. HUAWEI CLOUD has cooperated with more than 110 universities across the country to cultivate tens of thousands of professionals and have deeply integrated production, learning, research, and application, resulting in a far reaching and stable core technology ecosystem. In the era of rapid development of big models, HUAWEI CLOUD provides the Pangu big model R&D engineering suite for developers to build an open model community and big model cloud school, helping developers quickly develop big models. In the past, it took five months to complete an end-to-end development of a 100 billion parameters-large model. Now, with current cutting-edge AI cloud services and the large model development suite, the development preparation can be significantly diminished to just one month. HUAWEI CLOUD hopes that developers can build a prosperous ecosystem based on Huawei’s root technologies and leverage the computing power of the cloud and the powerful capabilities of the Pangu model.

PR Newswire

UL Solutions Announces First Demonstration of UL Procyon® AI Inference Benchmark for Windows at Snapdragon Summit

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The UL Procyon® AI Inference Benchmark for Windows helps the technology industry address consumer expectations for faster machine learning performance.

NORTHBROOK, Ill., Nov. 18, 2023 /PRNewswire/ — UL Solutions, a global leader in applied safety science, today announced that its UL Procyon® Artificial Intelligence (AI) Inference Benchmark for Windows demonstrated the AI inference performance of the Snapdragon® X Elite Platform during the 2023 Snapdragon Summit.

UL Solutions announced that its UL Procyon® Artificial Intelligence (AI) Inference Benchmark for Windows demonstrated the AI inference performance of the Snapdragon® X Elite Platform during the 2023 Snapdragon Summit.
UL Solutions announced that its UL Procyon® Artificial Intelligence (AI) Inference Benchmark for Windows demonstrated the AI inference performance of the Snapdragon® X Elite Platform during the 2023 Snapdragon Summit.

An inference engine comprises hardware and software that make decisions based on the rules and information stored in a knowledge base, and its performance can vary based on the device and other factors.

The UL Procyon AI Inference Benchmark for Windows compares multiple inference engines from different vendors, measuring the machine learning inference performance of Windows operating system devices using common machine vision models. These insights help technology companies evaluate inference performance and compare devices for AI use cases.

“With the unprecedented access to machine learning and artificial intelligence tools that consumers now have in their daily lives, technology vendors are utilizing performance insights to optimize inference engines for better performance with hardware and specific use cases,” said Jukka Makinen, managing director in the Software and Advisory group at UL Solutions. “Our UL Procyon AI Inference Benchmark for Windows empowers the technology industry with a performance measurement tool and insights that can assist in the development of faster AI-driven products and features. The close work between UL Solutions and Qualcomm Technologies helps enhance benchmark accuracy, relevancy and impartiality as AI continues to evolve at a rapid pace — particularly with the Snapdragon X Elite Platform.”

The AI workloads used in the UL Procyon AI Inference Benchmark for Windows are standard machine vision tasks, such as image classification, image segmentation, object detection and super-resolution. These tasks are executed using various neural networks and run on the device’s central processing unit (CPU), graphics processing unit (GPU) or a dedicated AI accelerator for comparing hardware performance.

“The insights gained from the UL Procyon AI Inference Benchmark for Windows enabled Qualcomm Technologies to optimize the performance of our machine learning tools and present data to highlight the new capabilities of our leading Snapdragon X Elite Platform,” said Surya Chittuluri, director of product management at Qualcomm Technologies, Inc. “We are pleased to be among the industry partners working with UL Solutions in the ongoing development of its AI benchmark in support of faster machine learning.”

Learn more about the UL Procyon AI Inference Benchmark for Windows.

About UL Solutions
A global leader in applied safety science, UL Solutions transforms safety, security and sustainability challenges into opportunities for customers in more than 100 countries. UL Solutions delivers testing, inspection and certification services, together with software products and advisory offerings, that support our customers’ product innovation and business growth. The UL Certification Marks serve as a recognized symbol of trust in our customers’ products and reflect an unwavering commitment to advancing our safety mission. We help our customers innovate, launch new products and services, navigate global markets and complex supply chains, and grow sustainably and responsibly into the future. Our science is your advantage.

Press contacts:
Tyler Khan
UL Solutions
ULNews@UL.com
T: +1 (847) 664.2139

Steven Brewster
UL Solutions
ULNews@UL.com
T: +1 (847) 664.8425

PR Newswire

STL develops 160-micron fibre, the world’s slimmest fibre and cable technology

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–  Unveiled by Shri Ashwini Vaishnaw, Union Minister for Communications, Electronics & Information Technology & Railways, at IMC 2023

NEW DELHI, LONDON and COLUMBIA, S.C., Oct. 28, 2023 /PRNewswire/ — In a proud achievement for India’s R&D capability, STL [NSE: STLTECH], a leading optical and digital solutions company, today announced that it has developed the world’s slimmest fibre for telecommunications – 160-micron Optical Fibre. Commending the technology innovations which are Designed in India and Made in India, Mr Ashwini Vaishnaw, Union Minister for Communications, Electronics & Information Technology & Railways, unveiled this world-leading product at STL’s booth in IMC 2023. Post unveiling the 160-micron Fibre, the H’onable minister ‘spliced’ or ‘joined’ two strands of optical fibre – a highly calibrated process of perfectly connecting the cores of two hair-thin optical fibres.

Shri Ashwini Vaishnav at STL's booth at IMC 2023
Shri Ashwini Vaishnav at STL’s booth at IMC 2023

Cable made with STL’s 160-micron fibre can pack 3X more capacity than traditional 250-micron fibre. This has been conceptualised and developed indigenously at STL’s Centre of Excellence in Maharashtra, making STL among the first companies globally to develop and patent this industry-leading technology.

As India becomes the fastest-growing digital economy in the world, there’s a need for densely fiberised networks, both in backhaul and closer to customers. Laying ducts account for ~60% of the entire fibre deployment cost, making duct space a precious asset. Network builders all over the globe are in a continued quest to reduce fibre size to pack in more and more capacity in the available duct space.

By packing more capacity in limited duct space with a reduced diameter cable of 6.4mm (~32% reduction compared to 250-micron fibre), STL’s 160-micron fibre will revolutionise deployment, bandwidth capacity and green quotient of the networks. The at-scale impact of this innovation on India’s broadband landscape can be immense. For example – In a large-scale project like Bharatnet, where India needs to deploy ~20 Million fibre km cable by 2025, using 160-micron fibre instead of the standard 250-micron fibre can potentially reduce the deployment time by ~15%. This enables the use of ducts with a smaller diameter, thereby reducing the plastic footprint in the ground by ~30%.

“This slimmest fibre is a noteworthy development and depicts our commitment to innovation and continuous R&D efforts in photonics and materials science,” said Dr Badri Gomatam, Group CTO, STL.

Incremental reduction in fibre size is an incredibly challenging feat which has captured the imagination of optical experts across the world. Some of the key challenges in reducing fibre size below 250-micron include enhanced sensitivity towards micro-bending and increased complexity in the fibre drawing process.

Talking about solving these challenges, Dr Badri added, “Through highly calibrated process and material engineering, we have achieved a breakthrough in manufacturing processes and glass compositions to realise micro bend insensitivity. ”

This product meets telecom-grade optical performance standards and complies with the ITU G.657A2 standard. This announcement comes after a series of innovations by our R&D experts, including India’s first multicore fibre with 4X capacity and 180-micron fibre.

“This groundbreaking innovation exemplifies our passion to put Indian technology and R&D on the world map. I am extremely excited to imagine the future of India’s digital networks with this disruptive fibre design,” said Ankit Agarwal, Managing Director, STL.

About STL – Sterlite Technologies Ltd:

STL is a leading global optical and digital solutions company providing advanced offerings to build 5G, Rural, FTTx, Enterprise and Data Centre networks. Read more, Contact us, stl.tech | Twitter | LinkedIn| YouTube

Shri Ashwini Vaishnav unveils 160 micron - the slimmest fibre at IMC 2023
Shri Ashwini Vaishnav unveils 160 micron – the slimmest fibre at IMC 2023
PR Newswire

Huntkey Appeared at the Global Sources Consumer Electronics 2023, Highlighting the Theme of Safety and Efficiency

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SHENZHEN, China, Oct. 19, 2023 /PRNewswire/ — The Global Sources Consumer Electronics was held at the AsiaWorld-Expo in Hong Kong from October 11-14, 2023. Huntkey showed high-demand electronic products with cutting-edge innovative designs to global buyers, including its best-selling safe and fast chargers, desktop charging stations, PC power supplies and industrial power supplies. The following is an introduction to some of the main products.

Safe and Fast Chargers
240W GaN safe and fast charger (Model: S240) is the newly launched product that fills a gap in the market. It has 3 USB-C ports, a single port that has a maximum output of 140W, and supports PD 3.1 fast charging protocol. It is foldable and can charge three laptops at the same time, making it suitable for meetings and business trips. Another new 35W GaN charger (Model: G35) supports simultaneous fast charging of iPhone 15 and Apple Watch. Huntkey also provides other peripheral products, such as data cables, phone cases, power banks, docking stations and so on.

Desktop Charging Stations
The charging station is designed for people who need to charge multiple devices on their desk. It can be used for mobile phones, tablets, notebooks and small household appliances. Compared with the traditional power strip, this can make the desktop tidier and the data cables will not be cluttered. The most popular is the PD 100W charging station(Model: W100), which can charge 6 devices at the same time and has 10 types of circuit protection to ensure charging safety.

PC Peripherals
The highlight of the PC power supply MVP P1200X is its ability to provide stable power to components in the computer system. With advanced design and technology, this power supply helps ensure that the processor, graphics card, and other components receive a stable power supply, thereby improving performance and extending the life of the system. Additionally, the power supply is ATX3.0 ready, supports stricter peak power consumption requirements, and meets the power supply requirements of RTX40 series graphics cards. With its 80 Plus Platinum certification, MVP P1200X ensures optimum energy efficiency and reduces unnecessary power consumption.

Industrial Power Supplies
Recently, Huntkey launched its latest POE power supply series. This power supply has the characteristics of low temperature resistance and is suitable for use in some outdoor boxes such as traffic lights. The interfaces are complete, ranging from 4 ports to 24 ports, including power supplies for hard disk video recorders and network video recorders, namely DVR and NVR. The high voltage has been specially processed to adapt to areas with unstable power grids.

As a partner of 10+ Fortune Global 500 companies, Huntkey continues to manufacture safe, efficient and reliable products that are sold around the world, creating a portable environment for consumers to work, play and study.

About Huntkey
Founded in 1995, Huntkey is a leading provider of PC power supplies, power strips, surge protectors, laptop adapters, phone chargers, monitors and air purifiers. Huntkey is a member of Power Sources Manufacturers Association (PSMA) and China Power Supply Society (CPSS). Covering approximately 1,000,000 square meters added up from three industrial parks, Huntkey is one of the most famous brands and largest companies in mainland China. It is headquartered in Shenzhen. By 2022, Huntkey has been practicing low-carbon economy for more than ten years. Practicing a low-carbon lifestyle with Huntkey.

Website: http://www.huntkey.com
Facebook: https://www.facebook.com/HuntkeyGlobal
Instagram: https://www.instagram.com/huntkey_global
LinkedIn: https://www.linkedin.com/company/huntkey

Media Contact: Ms.Lava Huang, E-mail: marketing@huntkey.com 
Business Contact: Ms.Ferris Liao, E-mail: huntkey@huntkey.com 

PR Newswire

Open Compute Project Tackles Data Center Hardware and Firmware Security

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Launches New Community Led Security Program Improving IT Device Security Posture

SAN JOSE, Calif., Oct. 18, 2023 /PRNewswire/ — Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, announced a new program, OCP Security Appraisal Framework and Enablement (S.A.F.E.) designed to improve the trustworthiness of devices across all data center IT infrastructure. The OCP S.A.F.E. program is expected to reduce cost overhead and redundancy of device security audits with an OCP Community developed per device security checklist, and advance the security posture of device hardware and firmware components across the supply chain.

The S.A.F.E. program adds a new dimension to the services offered by the OCP Foundation. It all starts with the OCP Community developing a standardized device specific audit checklist and criteria for selecting 3rd party device security review auditors. Both the device audit checklist and auditor selection criteria will be open sourced and available to all. Device auditors will do a self-assessment and those that qualify will be designated as OCP Security Review Providers (SRP). Device vendors will commission an OCP recognized SRP to conduct a device specific security review based on the appropriate OCP Community provided checklist.

“The OCP S.A.F.E. Program is designed to be a catalyst for upleveling the effort on security across the OCP Community and the industry. The OCP S.A.F.E. program is an OCP Community led effort to bring standardizations to device firmware security validation to help data center operators maintain a consistent security posture with reduced costs through removing duplication of efforts which can be replicated by other market segments. Security is the underlying foundation which makes OCP core tenets of efficiency, openness, scale, impact and sustainability possible,” said Steve Helvie, VP Emerging Markets at the Open Compute Project Foundation.

“Creating a standardized approach for provenance, code quality and software supply chain for firmware releases and firmware patches that run on data center IT devices benefits the broader community; from democratizing the review process to streamlining efforts. Google is pleased to be a founding member of the OCP S.A.F.E. program and together, with the community, we will accomplish our mutual goal of increased security assurance for the industry,” said Phil Venables, CISO, Google Cloud.

Independent third-party audits present significant challenges. These results are often available only to a certain set of customers, limiting their market impact. Also, these reviews are often commissioned by device consumers at the time of purchase, with device reviews are only performed once and subsequent security issues introduced by firmware upgrades and patches go undetected. The OCP driving a standardized approach, across all data center operators, will effectively and efficiently address these issues.

“We have partnered with OCP to create SAFE, a framework that promotes systematic security evaluations across the hardware ecosystem. This initiative provides enhanced levels of quality and security assurance to all hardware consumers,” said Mark Russinovich, Azure CTO.

The OCP S.A.F.E. Program is designed to reduce cost overhead and redundancy of device security audits, (1) provide security conformance assurance to device consumers (2) increase the number of devices whose firmware and associated updates are reviewed on a continuous basis, rather than only once when the device is 1st manufactured. (3) advance the security posture of device hardware and firmware components, through iterative refinement of review areas, testing scopes and reporting requirements.

The program has received strong support from both 3rd party auditors, device and silicon vendors. Currently Atredis Partners, IO Active, and NCC Group are enrolled as OCP Security Review Providers, with participating device vendors AMD and SK Hynix, and silicon vendor Intel.

“The OCP S.A.F.E. program with the increased level of security assurance it can provide should bring a new level of confidence to the market for data center IT device consumers and ultimately end users of cloud provider provided services. The efficiencies it drives at the same time as improving security is refreshing for the industry. This is just one example of how open collaboration within a community such as the OCP can benefit everyone,” said Ashish Nadkarni, Group Vice President and General Manager, Worldwide Infrastructure at IDC.

About the Open Compute Project Foundation
The Open Compute Project (OCP) is a collaborative Community of hyperscale data center operators, telecom, colocation providers and enterprise IT users, working with the product and solution vendor ecosystem to develop open innovations deployable from the cloud to the edge. The OCP Foundation is responsible for fostering and serving the OCP Community to meet the market and shape the future, taking hyperscale-led innovations to everyone. Meeting the market is accomplished through addressing challenging market obstacles with open specifications, designs and emerging market programs that showcase OCP-recognized IT equipment and data center facility best practices. Shaping the future includes investing in strategic initiatives and programs that prepare the IT ecosystem for major technology changes, such as AI & ML, optics, advanced cooling techniques, composable memory and silicon. OCP Community-developed open innovations strive to benefit all, optimized through the lens of impact, efficiency, scale and sustainability. Learn more at www.opencompute.org.

Media Contact

Dirk Van Slyke
Open Compute Project Foundation
Vice President, Chief Marketing Officer
dirkv@opencompute.org
Mobile: +1 303-999-7398
(Central Time Zone/CST/Houston, TX)

PR Newswire

Huawei Launches the F5.5G-Oriented All-Optical Target Network Architecture for Three Phases

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DUBAI, UAE, Oct. 13, 2023 /PRNewswire/ — During UBBF 2023, Richard Jin, President of Huawei Optical Business Product Line, delivered a keynote speech entitled “Bring F5.5G to Reality: Milestones on Our Way to Intelligent World”. In the speech, Richard proposed the concept of three-phase network construction for the first time. Specifically, there are three driving forces for network development, that is, video (100Mbps network), experience (1Gbps network), and intelligence (10Gbps network). Against this backdrop, Huawei launched the F5.5G-oriented three-phase all-optical target network architecture — all-optical coverage for 100Mbps home broadband, all-optical connections extending 1Gbps to each room, and all-optical computing for 10Gbps Everywhere. The three-phase construction of the all-optical target network can meet the network connection requirements of hot services in each phase, bringing F5.5G into reality and striding towards an intelligent world.

Richard Jin delivering his keynote speech at UBBF 2023
Richard Jin delivering his keynote speech at UBBF 2023

Phase 1: Video-Driven, All-Optical Coverage for 100Mbps Home Broadband

With the continuous improvement of video resolution and the rapid popularization of video interaction and immersive XR, the bandwidth is upgraded from 10 Mbps to 100 Mbps and 1000 Mbps. In this phase, HD video and video interaction become the major driving force to realize the goal of building an all-optical network with a 100 Mbps home broadband rate. Operators need to fully move towards FMC, and replace cooper lines and cables with FTTH all-optical network. Serialized AirPON can accelerate FTTH construction and support GPON and 10G PON compatibility, enabling rapid provision of gigabit services in hotspot areas. Meanwhile, operators need to deploy OTN to metro aggregation layer, and build 3D-mesh 400G ready backbone networks, supporting non-blocking bandwidth and zero video lagging. Typical technological innovations in this phase include FlexPON, DQ ODN, and high-performance 400G.

Phase 2: Experience-Driven, All-Optical Connections Extending 1Gbps to Rooms

With increasingly diversified digital applications, fibers are extended from living rooms to bedrooms, studies, and kitchens, enabling click-and-start applications and delivering an immersive network experience. All these developments pose higher requirements on network coverage, bandwidth, latency, and roaming. In this phase, users are willing to pay for a more premium home network experience. Therefore, End-to-end (E2E) service experience assurance becomes the key to achieving the goal of all-optical connections and 1 Gbps extending to each room. Operators need to upgrade 10G PON to fully deliver gigabit services, introduce fiber-to-the-room (FTTR), metro 100G OTN to CO, backbone 400G non-blocking ultra-broadband. Typical technological innovations in this phase are FTTR, metro pooling WDM, and the intelligent network management and control system.

Phase 3: Intelligence-Driven, All-Optical Computing for 10Gbps Everywhere

AI accelerates content manufacturing and promotes the intelligent transformation of industries. To cope with traffic surges and migration of massive data to the cloud, a computing-centric network is required to provide bus-level connection capabilities. Similar to the CPU, bus, and accessories of a computer, the computing power and storage of the data center (DC) need to exchange information with end-users in real time through a high-performance network to achieve the goal of all-optical computing for 10Gbps Everywhere.

In this phase, the FTTR-based all-optical home bus supports connect-and-play of IoT devices and integrates connection, sensing, computing, and storage capabilities for 10Gbps throughout the house. In addition, the all-optical cloud bus based on 50G PON and 800G OTN implements all-optical one-hop user-DC or DC-DC connections. Typical technological innovations in this phase include 50G PON, metro OTN completely to CO, and backbone 800G. In addition, OTN needs to be designed for DC scenarios. Upon this, Huawei launched Kepler, the next-generation OTN platform, delivering more than 100T single-subrack switching capacity. Leveraging new materials and structures, Kepler reduces power consumption per Gbit by 65%, and the power usage effectiveness (PUE) to 1.2. It also provides intelligent computing units to comprehensively improve connection efficiency.

The three-phase all-optical target network can ensure parallel evolution and smooth upgrade from F5G to F5.5G. According to Richard, “Operators need the most appropriate all-optical target network construction solution in different development phases. So far, 100Mbps has changed the content, 1Gbps is changing the broadband experience, and 10Gbps will change society. Let’s work together to bring F5.5G into reality and stride towards an intelligent world.”