Tag Archives: HRD

PR Newswire

MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones

Leave a comment

TAIPEI, Taiwan, May 18, 2020 /PRNewswire/ — MediaTek today announced the Dimensity 820 system-on-chip (SoC) which is optimized for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek’s latest multimedia, AI and imaging innovations.   

MediaTek Dimensity 820 5G chipset
MediaTek Dimensity 820 5G chipset

“Our Dimensity 1000 is already powering impressive flagship 5G devices in a number of markets. With the new Dimensity 820, we’re now making 5G much more accessible,” said Dr. Yenchi Lee, Assistant General Manager of MediaTek’s Wireless Communications Business Unit.  “The Dimensity 820 stands out beyond competitors by offering four high-performance Arm Cortex-A76 cores at 2.6GHz within its octa-core CPU, delivering superb performance and responsiveness, among its incredible AI, gaming and photography experiences.”

Dimensity 820 packs high performance Arm Mali G57 GPU graphics plus HyperEngine 2.0 enhancements so users can immerse themselves in the latest mobile games. Brands can embrace support for 120Hz high frame-rate displays, while leading HDR features with MediaTek MiraVision showcases the most vivid visuals in videos and streams.

MediaTek’s Dimensity 820 integrates a 5G NR (sub-6GHz) modem into this single-chip solution with MediaTek’s 5G UltraSave technologies, including exclusive 5G UltraSave Network Environment Detection and 5G UltraSave OTA Content Awareness, that altogether provides best-in-class energy efficiency. The 5G modem design also uses dynamic bandwidth part (BWP) adaption and connected mode discontinuous reception (C-DRX) power-saving technologies.

5G Carrier Aggregation (CA) technology delivers higher average speeds and a seamless handover between two 5G connection areas for the most reliable connectivity on the go. The Dimensity 820 also supports dual SIM, dual standby (DSDS) 5G technology for access to the fastest speeds and Voice over New Radio (VoNR) services on both SIMs.

The MediaTek Dimensity 820 includes:

  • Dedicated APU 3.0 (AI Processing Unit): MediaTek APU 3.0 provides more powerful AI-camera capabilities so users can capture stunning images and videos at the same time, without any quality loss.
  • HyperEngine 2.0 gaming technologies: MediaTek’s HyperEngine 2.0 provides whole smartphone enhancements for gaming. Combined with the chipset’s premium five-core GPU it delivers a superb gaming experience with optimizations that reduce network latency for smoother gameplay, support faster response times and enhance display quality. HyperEngine 2.0 also intelligently adjusts the CPU, GPU and memory resources to optimize power and performance.
  • MediaTek’s Imagiq 5.0: The flagship-class, HDR-native image signal processor (ISP) supports up to four concurrent cameras and up to 80MP sensors, giving brands more design flexibility.
  • Multi-frame 4K Video HDR: Easily to record stunning 4K HDR video even in bright and dark environments. The chip automatically captures frames at different exposures and intelligently fuses them into a single video stream, all in real-time.

The Dimensity 820 delivers best in class 5G Experiences, featuring the latest MediaTek technologies, bringing impressive big core performance to premium experience devices. 

The Dimensity 820 is designed for global sub-6GHz 5G networks in Asia, North America and Europe. For more information and specifications visit the MediaTek Dimensity 5G solutions page.

# # #

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 1.5 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek Press Office:

PR@mediatek.com
Kevin Keating, MediaTek
+1 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

MediaTek Dimensity 820 Infographic 0520
MediaTek Dimensity 820 Infographic 0520

Photo – https://photos.prnasia.com/prnh/20200515/2804901-1-a?lang=0
Photo – https://photos.prnasia.com/prnh/20200515/2804901-1-b?lang=0

Source: MediaTek Inc.

PR Newswire

Supermicro Expands Portfolio with Fully Integrated NVIDIA A100 GPU-Powered Systems Delivering 5 PetaFLOPS of AI Performance in a Single 4U Server

Leave a comment

SAN JOSE, California, May 14, 2020 /PRNewswire/ — Super Micro Computer, Inc. (Nasdaq: SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, today announced two new systems designed for artificial intelligence (AI) deep learning applications that fully leverage the third-generation NVIDIA HGX™ technology with the new NVIDIA A100™ Tensor Core GPUs as well as full support for the new NVIDIA A100 GPUs across the company’s broad portfolio of 1U, 2U, 4U and 10U GPU servers. NVIDIA A100 is the first elastic, multi-instance GPU that unifies training, inference, HPC, and analytics.

“Expanding upon our industry-leading portfolio of GPU systems and NVIDIA HGX-2 system technology, Supermicro is introducing a new 2U system implementing the new NVIDIA HGX™ A100 4 GPU board (formerly codenamed Redstone) and a new 4U system based on the new NVIDIA HGX A100 8 GPU board (formerly codenamed Delta) delivering 5 PetaFLOPS of AI performance,” said Charles Liang, CEO and president of Supermicro. “As GPU accelerated computing evolves and continues to transform data centers, Supermicro will provide customers the very latest system advancements to help them achieve maximum acceleration at every scale while optimizing GPU utilization. These new systems will significantly boost performance on all accelerated workloads for HPC, data analytics, deep learning training and deep learning inference.”

As a balanced data center platform for HPC and AI applications, Supermicro’s new 2U system leverages the NVIDIA HGX A100 4 GPU board with four direct-attached NVIDIA A100 Tensor Core GPUs using PCI-E 4.0 for maximum performance and NVIDIA NVLink™ for high-speed GPU-to-GPU interconnects. This advanced GPU system accelerates compute, networking and storage performance with support for one PCI-E 4.0 x8 and up to four PCI-E 4.0 x16 expansion slots for GPUDirect RDMA high-speed network cards and storage such as InfiniBand™ HDR™, which supports up to 200Gb per second bandwidth.

“AI models are exploding in complexity as they take on next-level challenges such as accurate conversational AI, deep recommender systems and personalized medicine,” said Ian Buck, general manager and VP of accelerated computing at NVIDIA. “By implementing the NVIDIA HGX A100 platform into their new servers, Supermicro provides customers the powerful performance and massive scalability that enable researchers to train the most complex AI networks at unprecedented speed.”

Optimized for AI and machine learning, Supermicro’s new 4U system supports eight A100 Tensor Core GPUs. The 4U form factor with eight GPUs is ideal for customers that want to scale their deployment as their processing requirements expand. The new 4U system will have one NVIDIA HGX A100 8 GPU board with eight A100 GPUs all-to-all connected with NVIDIA NVSwitch™ for up to 600GB per second GPU-to-GPU bandwidth and eight expansion slots for GPUDirect RDMA high-speed network cards. Ideal for deep learning training, data centers can use this scale-up platform to create next-gen AI and maximize data scientists’ productivity with support for ten x16 expansion slots.

Customers can expect a significant performance boost across Supermicro’s extensive portfolio of 1U, 2U, 4U and 10U multi-GPU servers when they are equipped with the new NVIDIA A100 GPUs.  For maximum acceleration, Supermicro’s new A+ GPU system supports up to eight full-height double-wide (or single-wide) GPUs via direct-attach PCI-E 4.0 x16 CPU-to-GPU lanes without any PCI-E switch for the lowest latency and highest bandwidth. The system also supports up to three additional high-performance PCI-E 4.0 expansion slots for a variety of uses, including high-performance networking connectivity up to 100G. An additional AIOM slot supports a Supermicro AIOM card or an OCP 3.0 mezzanine card.

As the leader in AI system technology, Supermicro offers multi-GPU optimized thermal designs that provide the highest performance and reliability for AI, Deep Learning, and HPC applications. With 1U, 2U, 4U, and 10U rackmount GPU systems; Utra, BigTwin™, and embedded systems supporting GPUs; as well as GPU blade modules for our 8U SuperBlade® , Supermicro offers the industry’s widest and deepest selection of GPU systems to power applications from Edge to Cloud.

To deliver enhanced security and unprecedented performance at the edge, Supermicro plans to add the new NVIDIA EGX™ A100 configuration to its edge server portfolio. The EGX A100 converged accelerator combines an NVIDIA Mellanox SmartNIC with GPUs powered by the new NVIDIA Ampere architecture, so enterprises can run AI at the edge more securely.

For more on Supermicro’s new GPU systems, please visit www.supermicro.com/A100.

Follow Supermicro on LinkedIn, Twitter, and Facebook to receive their latest news and announcements.

About Super Micro Computer, Inc.
Supermicro (Nasdaq: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced Server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green®” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, Server Building Block Solutions, BigTwin, SuperBlade, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners.

SMCI-F

Video – https://mma.prnewswire.com/media/1168093/RedStone_SuperMinute_100.mp4  

Source: Super Micro Computer, Inc.

PR Newswire

Pininfarina to Launch AutonoMIA, a Responsive Driving Experience for the Mobility of the Future

Leave a comment

TURIN, Italy, May 13, 2020 /PRNewswire/ — Pininfarina’s 90th anniversary celebrations focus on the value that have guided it since its foundation: designing the future.

Pininfarina’s responsive User Experience for the mobility of the future.
Pininfarina’s responsive User Experience for the mobility of the future.

A leader in automotive design and engineering, the Turin-based company further expands its offering to automotive customers through the conception, design and realization of User Experiences, in the form of a highly responsive, multi-sensorial on-board experience demonstrator, named AutonoMIA.

AutonoMIA is an immersive exploration of how technology, from AI to 5G, from display to haptics, from sensors to natural interfaces, can be leveraged to reenchant the driving experience. It is a tool that designers will use to continue iterating on the thinking on the future of driving. The different parties build knowledge on the data extracted from its usage. But AutonoMIA is also an asset that can be leveraged, customized and developed further for Pininfarina’s clients.

AutonoMIA was made possible thanks to several new strategic partnerships.

The main collaboration is with ART. The Umbrian company made available its experience in creating user interfaces for automotive cockpits, and provided its highly advanced and customizable infotainment platform. ART provided all of AutonoMIA’s hardware and developed all the needed middleware.

In turn, the application layer was designed in close cooperation with and developed by Siili_auto, a leading Finnish automotive software development company.

The seats and all the padded parts were supplied by ARAS.

“AutonoMIA”, explains CEO Pininfarina, Silvio Pietro Angori, “shows how Pininfarina may combine experience design with creative technology, reinventing the on-board experience at a time when digitalisation, connectivity, data and artificial intelligence are substantially redefining mobility. With its Experience Design team and Partners, Pininfarina today helps its customers through mobility experiences which are getting more and more digital“.

AutonoMIA is an experience designed to adjust and respond to people and contexts of use, leveraging the different interface elements it builds on to create a multi-sensorial and responsive experience that creates magic, strong meaning and positive impact in and around the car. Among others, AutonoMIA revisits notably the function, position, individual and combined use of screens inside the car.

In the future, AutonoMIA will be able to build on the true augmented reality experience provided by Pininfarina’s partner WayRay and its advanced holographic, full-color head-up display technology and new applications for autonomous driving, urban mobility and infotainment.

Pininfarina's responsive User Experience for the mobility of the future.
Pininfarina’s responsive User Experience for the mobility of the future.

Photo – https://techent.tv/wp-content/uploads/2020/05/pininfarina-to-launch-autonomia-a-responsive-driving-experience-for-the-mobility-of-the-future-2.jpg
Photo – https://techent.tv/wp-content/uploads/2020/05/pininfarina-to-launch-autonomia-a-responsive-driving-experience-for-the-mobility-of-the-future.jpg
Logo – https://techent.tv/wp-content/uploads/2020/05/pininfarina-to-launch-autonomia-a-responsive-driving-experience-for-the-mobility-of-the-future-1.jpg

PR Newswire

L-com Launches Ruggedized USB 3.0 Cable Assemblies with Die-Cast Shells and Thumbscrews

Leave a comment

IRVINE, California, May 8, 2020 /PRNewswire/ — L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, announced today that it has launched a new series of ruggedized USB 3.0 cables that feature die-cast metal back shells and optional thumbscrews that are commonly used in machine vision applications. 

L-com’s new CAU3DCVIS-series cables were developed to address demanding connectivity applications including industrial and factory automation, process engineering, machine vision, data acquisition and PLC communications.

These unique and hard to find cables feature specialized die-cast back shells with optional thumbscrews for securing the connectors to ensure connectivity is not disrupted in the event of pull or impact. The cables are available off-the-shelf with the following connector combinations: Type-A male to Micro-B male, Type-A male to Type-C male and Type-A male to Type-B male. Other features include black PVC cable jackets, double shielding and 22AWG power conductors which provide maximum USB power transfer.

“Our new ruggedized USB 3.0 cables are perfect for use in industrial settings where high vibration, impacts and other harsh conditions prevail. These unique cables can be mated to any standard USB 3.0 Type-A jack and allow for the use of thumbscrews for applications requiring extra secure connections,” said Dustin Guttadauro, Product Line Manager.

L-com’s new ruggedized USB 3.0 cable assemblies with die-cast back shells are in-stock and available for immediate shipment.

About L-com:

L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. L-com is headquartered in North Andover, Mass., is ISO 9001: 2015 certified and many of its products are UL® recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:

Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMe Cables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.

Press Contact:

Peter McNeil
L-com
17792 Fitch
Irvine, CA
978-682-6936

Logo – https://techent.tv/wp-content/uploads/2020/05/l-com-launches-ruggedized-usb-3-0-cable-assemblies-with-die-cast-shells-and-thumbscrews.jpg

PR Newswire

Huntkey Adds the SCA109C to Its Wireless Charger Family

Leave a comment

SHENZHEN, China, May 8, 2020 /PRNewswire/ — Huntkey, a leading global provider of power solutions, increases its selection of wireless chargers with the SCA109C, a wireless charger complemented with one USB-C (also known as USB Type-C) port and two USB-A ports.

The Huntkey USB-C Wireless Charger:
https://en.huntkey.com/product/sca109c/

The SCA109C’s wireless charger provides a maximum 10W power output for Qi-certified devices such as Samsung and iPhone smart phones. The USB-C port delivers 5V3A, 9V2A or 12V1.5A power intelligently to fit different devices. The two USB-A ports share a combined 5V2.1A power output.

It is paired with a durable AC cable that is equipped with a two-pin US plug, which is targeted at the North America market. To ensure safety, it is FCC listed and built with multiple protections including OVP (Over Voltage Protection), OCP (Over Current Protection), OTP (Over Temperature Protection) and SCP (Short Circuit Protection). Not only will it protect itself, but also keep the charging devices safe under any circumstances. For more information, please visit: https://en.huntkey.com/

About Huntkey

Huntkey Enterprise Group, founded in 1995 and headquartered in Shenzhen, is a member of The International Power Supply Manufacturer’s Association (PSMA) and a member of The China Power Supply Society (CPSS). With branch companies in the USA, Japan and other areas, and cooperating factories in Brazil, Argentina, India and other countries, Huntkey has specialized in the development, design, and manufacturing of PC power supplies, industrial power supplies, surge protectors, adapters and chargers for many years. With its own technologies and manufacturing strength, Huntkey has served Lenovo, Haier, DELL, Bestbuy and many other large enterprises for years, and has received unanimous recognition and trust from most of the customers.

Cision View original content:http://www.prnewswire.com/news-releases/huntkey-adds-the-sca109c-to-its-wireless-charger-family-301055508.html

PR Newswire

TrustKey Solutions, a new entity headquartered in the United States, is focused on bringing advanced FIDO2 security solutions to the world

Leave a comment

DALLAS, May 7, 2020 /PRNewswire/ — Announcing TrustKey Solutions (“TrustKey”). eWBM is a diverse business of which FIDO security keys is just one part. Due to the surge in global demand for its FIDO security keys, the company is spinning off its FIDO key business into a new entity headquartered in the United States.

TrustKey is founded by Dr. Stephen Oh and a carefully selected group of US based executives. The team of executives are solely focused on bringing advanced FIDO2 security solutions to the world and will oversee growth into the global identity security marketplace.

TrustKey has several hardware security keys in its lineup including the flagship line, the G-series keys. The G-series keys are the world’s first and only FIDO2 Level2 certified biometric security keys, making it impossible for side channel attacks, man-in-the-middle attacks, or phishing. The biometric (fingerprint) sensor allows the added security of user identity verification to make them the highest level of security available. TrustKey offer the G-series keys in both USB-A and USB-C. The next line of keys are the T-series keys.

The T-series keys are implemented on the same platform as the G-Series series keys. This allows the company to provide the same high security performance of the G-series while keeping the key affordable. The non-biometric touch sensor on the keys allows for user presence verification protecting against remote hacking attacks. T-series keys are great for consumer or enterprise deployment – they are fast, easy to use, and affordable.

TrustKey is committed to supporting true passwordless login via the FIDO2 standard to help protect the online identities of all people, everywhere. The company is a board member of the fido alliance, ensuring that they are able to help shape the passwordless future and protect the identity of all people throughout the world. The company is pleased to move forward as TrustKey to support the goal of providing secure, reliable, and simple identity solutions to everyone, and are excited about the future products currently under development with new features and form factors.

For more information about TrustKey, please visit us at www.trustkeysolutions.com.

About TrustKey Solutions.

TrustKey Solutions, www.trustkeysolutions.com, is a security technology company providing hardware security keys. Headquartered in Dallas, TX, USA, TrustKey is committed to supporting true passwordless login via the FIDO2 standard to help people protect their online identities with hardware security keys.

About eWBM Co, Ltd.

eWBM, www.ewbm.com, is a fabless SoC company which provides security MCUs and modules for variety of IoT applications such as MS500, Secure LoRa Module, Secure Sensor to Ethernet module, Secure NB-IoT module, and Secure IP Cameras. The next generation security SoC chip, MS1200, will be introduced in 2020. The chip supports FIPS 140-2 and the ultra-low power deep sleep mode optimized for battery-powered IoT applications.

Contact:
Andrew Jun, +1 ‪408 471 6849

Cision View original content:http://www.prnewswire.com/news-releases/trustkey-solutions-a-new-entity-headquartered-in-the-united-states-is-focused-on-bringing-advanced-fido2-security-solutions-to-the-world-301054537.html

PR Newswire

ChipMOS REPORTS APRIL 2020 REVENUE; NEW RECORD HIGH FOR APRIL

Leave a comment

HSINCHU, May 6, 2020 /PRNewswire/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of April 2020.  All U.S. dollar figures cited in this press release are based on the exchange rate of NT$29.72 to US$1.00 as of April 30, 2020.

Revenue for the month of April 2020 was NT$1,854.3 million or US$62.4 million, which is a new record high revenue level for the month of April.  This represents an increase of 18.9% as compared to April 2019 and a decrease of 5.7% from March 2020.  The Company noted that it benefitted from stable memory demand, including DRAM and NOR flash.  These improvements were partially offset by softness in DDIC and gold bumping due to macro weakness in TV and smart phone demand, combined with one less calendar day of operations in the month of April compared to March.

Consolidated Monthly Revenues (Unaudited)

April 2020

March 2020

April 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,854.3

1,966.8

1,559.5

-5.7%

18.9%

Revenues

(US$ million)

62.4

66.2

52.5

-5.7%

18.9%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

Contacts:

Cision View original content:http://www.prnewswire.com/news-releases/chipmos-reports-april-2020-revenue-new-record-high-for-april-301053578.html

Source: ChipMOS TECHNOLOGIES INC.

PR Newswire

Power and Compound Fab Spending to Rebound in Second Half of 2020, Set New Record in 2021, SEMI Reports

Leave a comment

MILPITAS, California, May 5, 2020 /PRNewswire/ — Global fab equipment spending for power and compound devices is expected to rebound in the second half of 2020 to meet resurgent end-product demand and jump 59 percent to a segment record US$6.9 billion in 2021, SEMI reported today in its Power & Compound Fab Report to 2024. The 2020 rally will help blunt a drop in annual spending, now projected at 8 percent, as fabs ride the COVID-19 recovery wave.

Power and compound devices are used to control electrical energy for devices across an array of industries such as computing, communications, energy and automotive. Since the widespread enactment of stay-at-home orders to curb the spread of COVID-19, demand for servers, laptops and other electronics at the heart of online communications has surged.

The SEMI Power & Compound Fab Report to 2024 lists more than 800 power- and compound-related facilities and lines and covers investments and capacities for the 12 years from 2013 through 2024. In 2019, the report tracked 804 facilities and lines with installed capacity of 8 million wafers per month (in 200mm equivalent wafers). By 2024, 38 new facilities and lines will begin operation, fueling installed capacity growth of a cumulative 20 percent to 9.7 million wafers per month. 

In breakdowns by region, mainland China will expand power and compound fab capacity by 50 percent and 87 percent, respectively, from 2019-2024, more than any other region. Over the same period, Europe/Mideast and Taiwan will lead the way in adding power fab capacity, while the Americas and Europe/Mideast will be among those regions adding compound fab capacity.

For more information about The SEMI Power & Compound Fab Report to 2024 or to download sample data from the report, please click here.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

Photo – https://techent.tv/wp-content/uploads/2020/05/power-and-compound-fab-spending-to-rebound-in-second-half-of-2020-set-new-record-in-2021-semi-reports-1.jpg 
 Logo – https://techent.tv/wp-content/uploads/2020/05/power-and-compound-fab-spending-to-rebound-in-second-half-of-2020-set-new-record-in-2021-semi-reports.jpg

PR Newswire

Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds

Leave a comment

MILPITAS, Calif., May 4, 2020 /PRNewswire/ — Worldwide silicon wafer area shipments rose 2.7 percent to 2,920 million square inches in the first quarter of 2020, compared with fourth-quarter 2019 shipments of 2,844 million square inches, but dropped 4.3 percent year-over-year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

“Global silicon wafer shipments rebounded slightly in the first quarter of 2020 after declining for one year,” said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering at Shin Etsu Handotai America. “However, with the disruptions caused by the coronavirus, market uncertainty will prevail in the upcoming quarters.”

Silicon Area Shipment Trends – Semiconductor Applications Only

Millions of Square Inches

4Q 2018

1Q 2019

2Q 2019

3Q 2019

4Q 2019

1Q 2020

Total

3,234

3,051

2,983

2,932

2,844

2,920

Source: SEMI (www.semi.org), April 2020

All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

A sub-committee of the SEMI Electronic Materials Group (EMG), the SMG is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,260 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

Logo – https://techent.tv/wp-content/uploads/2020/05/global-silicon-wafer-area-shipments-edge-up-in-first-quarter-2020-despite-covid-19-headwinds.jpg

PR Newswire

Percepto Lauded by Frost & Sullivan for Accelerating Clients’ Decision-Making with its Emerging Technology-led Autonomous Drone Solution

Leave a comment

Percepto incorporates proprietary AI, ML, and analytics capabilities into its solutions to execute and manage events autonomously and ultimately, reduce operational downtime

SANTA CLARA, Calif., April 29, 2020 /PRNewswire/ — Based on its recent analysis of the global autonomous drones market, Frost & Sullivan recognizes Israel-based Percepto with 2020 Global Enabling Technology Leadership Award for its best-in-class, end-to-end autonomous drone-in-a-box solution. Comprising the Sparrow drone, Percepto Base, and comprehensive data management and analytics software, the Percepto Solution performs a range of tasks such as inspections, measurements, and surveillance. Its proprietary advanced analytics, Artificial Intelligence (AI), computer vision, and machine learning (ML) boosts the functionality and value of the platform, giving it a significant competitive edge over other solutions.

Percepto
Percepto

“Operators can remotely start, monitor, and complete tasks with Percepto’s autonomous, intelligent drones through the cloud-based, user-intuitive dashboard, allowing them to continue their business operations from anywhere in the world,” said Michael Blades Industry Analyst and VP of Aerospace, Defense & Security. “It notifies operators in real time, enabling operations and security teams to respond to incidents proactively, ultimately optimizing productivity, safety, and security. Further, it monitors a client’s worksite for any external interference, such as a malicious or unauthorized individual, drone, or vehicle; safety risks such as leaking pipes, or improper safety practices such as an employee not wearing a hard hat or high-visibility safety vest.” The main cost savings comes from consistent and persistent inspection, proactive monitoring and active reporting that the system provides.

Meanwhile, with the outbreak of COVID-19, businesses are rethinking their business continuity strategies, their ability to maintain efficiencies while many employees cannot get to the site, and the response to emergencies. In this scenario, autonomous solutions that take critical actions on behalf of operators are emerging as new best practices, The Percepto Solution’s ability to operate in harsh weather conditions and integrate seamlessly with third-party technologies makes it the ideal tool for operators in diverse industries including automotive, critical infrastructure, defense, industrial, mines, ports, and utilities.

The company works closely with the Federal Aviation Administration (FAA) in the United States to stay abreast of new drone regulations and flight programs and to obtain regulatory approvals. Approvals such as remote flight controls and operations without a visual observer when flying beyond visual line of sight (BVLOS) increase the versatility and ROI of each system deployed. Percepto’s drones enable clients to optimize security and inspection practices by autonomously completing tasks such as perimeter patrols and infrastructure inspections.

“Percepto complements its technology with stellar customer support and an unwavering commitment to meeting business-specific needs for clients,” noted Blades. “In 2019, Percepto added fully-automated high-resolution two-dimensional mapping capabilities and three-dimensional modeling to meet customer and market demands. The company’s customer base and revenues continue to grow as potential clients and existing customers recognize its unique drone offering and price/performance value.”

Each year, Frost & Sullivan presents this award to a company that has developed a pioneering technology that not only enhances current products, but also enables the development of new products and applications. The award recognizes the high market acceptance potential of the recipient’s technology.

Frost & Sullivan Best Practices awards recognize companies in a variety of regional and global markets for demonstrating outstanding achievement and superior performance in areas such as leadership, technological innovation, customer service, and strategic product development. Industry analysts compare market participants and measure performance through in-depth interviews, analysis, and extensive secondary research to identify best practices in the industry.

About Frost & Sullivan

For over five decades, Frost & Sullivan has become world-renowned for its role in helping investors, corporate leaders and governments navigate economic changes and identify disruptive technologies, Mega Trends, new business models and companies to action, resulting in a continuous flow of growth opportunities to drive future success. Contact us: Start the discussion.

Contact:

Lindsey Whitaker
P: +1 (210) 477-8457
E: lindsey.whitaker@frost.com

About Percepto

Percepto is the market leader of on-site autonomous drone solutions for critical infrastructures and industrial sites. Operating with no need for human intervention, Percepto’s autonomous Sparrow drones perform multi missions, around the clock. The solution is ideally suited to any large-scale enterprises looking to increase productivity, improve security and reduce safety risks and operational costs. Organizations using the Percepto solution are better aware of events taking place, allowing them to be proactive and more efficient in addressing risks and operational needs. The Percepto Solution is currently in use around the world including Enel in Europe, as well as a number of Fortune 500 organizations.

info@percepto.co 

Photo – https://techent.tv/wp-content/uploads/2020/04/percepto-lauded-by-frost-sullivan-for-accelerating-clients-decision-making-with-its-emerging-technology-led-autonomous-drone-solution.jpg