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PR Newswire
Huawei Wins Eight Awards, Including Five Grand Awards, at Interop Tokyo 2020

TOKYO, June 5, 2020 /PRNewswire/ — The COVID-19 pandemic has brought unprecedented changes to diverse industries and sectors. But it cannot prevent the rapid development of the ICT industry, it would seem. The Organizing Committee of Interop Tokyo 2020 — the largest ICT exhibition in Japan — has announced the winners of the Best of Show Awards. Huawei’s innovative products and solutions have won eight awards, demonstrating their unique technical advantages.

Huawei Wins Eight Awards, Including Five Grand Awards, at Interop Tokyo 2020
Huawei Wins Eight Awards, Including Five Grand Awards, at Interop Tokyo 2020

Huawei received the following awards:

Grand Prize in Network Infrastructure: OptiXtrans OSN 9800 M12, the industry’s first super C-band transmission product.

Grand Prize in Cloud Infrastructure: CloudEngine 16800 data center switch, the industry’s highest-density 400 GE line card for data centers in the AI era.

Grand Prize in Server and Storage: Huawei’s next-generation all-flash storage OceanStor Dorado 8000/18000 V6, oriented to core production and transaction scenarios, and continuously setting performance, reliability, and intelligence benchmarks.

Grand Prize in IoT: Huawei edge computing gateway AR502H.

Grand Prize in Facility: The eMIMO edge computing facility solution.

In the AI category, the industry-leading Atlas 900 AI cluster is the only award-winning product.

Special Prize in Enterprise IT: Huawei 5G AR NetEngine AR6000.

Special Prize in Network Infrastructure: Huawei OptiXtrans DC908, an intelligent Data Center Interconnect (DCI) product with a single-fiber capacity of 88 Tbit/s and AI-enabled O&M.

Huawei’s awards at Interop Tokyo in 2020, and in the years preceding it, is the industry recognition of Huawei’s emphasis on innovation and quality, and is a reflection of its long-term strategic investment in R&D. Such recognition — both from peers and customers alike — remains the driving force behind Huawei’s ongoing efforts. Huawei is committed to investing in R&D for the longer term, in order to provide customers with more competitive, innovative, unique ICT products and solutions through core technological innovation.

Affected by the pandemic, Interop Tokyo 2020 canceled on-site demonstrations. Online demonstrations and ICT award selection activities were held from April 13 to June 30, instead. The conference showcased the most advanced technological innovation and practices in the industry. Gathering leading solutions in multiple fields, including AI, IoT, edge computing, and the industrial Internet, Interop Tokyo has helped to inject new vitality and confidence into the industry and, indeed, the wider world.

Demonstrating its "open, collaborative, and mutually beneficial" cooperation with partners, Huawei showcased a brand new digital intelligent ecosystem and relevant application cases, including 14 products and solutions. These cutting-edge offerings ably illustrated Huawei’s capabilities to comprehensively promote rapid digital and intelligent development in the ICT field. With continuous investment in new ICT technologies and ecosystems, and with the ongoing accumulation of global service experience, Huawei is gaining trust from an increasing number of industry-leading enterprises. To date, over 700 cities and 228 Fortune Global 500 companies — including 58 in the top 100 — have chosen Huawei as their digital transformation partner.

-Ends-

About Interop Tokyo

Interop Tokyo is one of the most widely-regarded network computing events in the industry, and the largest and most influential ICT exhibition in Japan. The Best of Show Award is Interop’s iconic prize. Each year, hundreds of solutions are reviewed by a panel of judges made up of leading industry experts and university professors. They select the most innovative products and solutions with the most cutting-edge technologies and the highest commercial value.

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Related Links :

http://www.huawei.com/cn

http://www.huawei.com

PR Newswire
Aetina Launches New Edge AI Computer Powered by the NVIDIA Jetson Platform

TAIPEI, June 5, 2020 /PRNewswire/ — Aetina Corp., a provider of high-performance GPGPU solutions, announced the new AN110-XNX edge AI computer leveraging the powerful capabilities of the NVIDIA® Jetson Xavier™ NX, expanding its range of edge AI systems built on the Jetson platform for applications in smart transportation, factories, retail, healthcare, AIoT, robotics, and more.

Aetina launch new edge AI computer powered by NVIDIA(R) Jetson Xavier(TM) NX.
Aetina launch new edge AI computer powered by NVIDIA(R) Jetson Xavier(TM) NX.

The AN110-XNX combines the NVIDIA Jetson Xavier NX and Aetina AN110 carrier board in a compact form factor of 87.4 x 68.2 x 52 mm (with fan). AN110-XNX supports the MIPI CSI-2 interface for 1x4k or 2xFHD cameras to handle intensive AI workloads from ultra-high-resolution cameras to more accurate image analysis. It is as small as Aetina’s AN110-NAO based on the NVIDIA Jetson Nano™ platform, but delivers more powerful AI computing via the new Jetson Xavier NX. With 384 CUDA® cores, 48 Tensor Cores, and cloud-native capability the Jetson Xavier NX delivers up to 21 TOPS and is the ideal platform to accelerate AI applications. Bundled with the latest NVIDIA Jetpack™ 4.4 SDK, the energy-efficient module significantly expands the choices now available for developers and customers looking for embedded edge-computing options that demand increased performance to support AI workloads but are constrained by size, weight, power budget, or cost.

Also, Aetina offers a full system, AN110-XNX-EN70 with fanless chassis enabling quick time to market. For backup support, Aetina offers BSP and DTB configuration updates for both standard and customized platforms in their service policy. The company is developing Jetson Xavier NX based edge computing platforms with 5G communications capability and full function browser-based edge device management. 

"Partnering with an edge-computing leader like NVIDIA supports our mission to deliver long-term embedded and industrial solutions to our customers across multiple industries," said Eric Chu, PM of Aetina Corp. As an NVIDIA Preferred Partner, Aetina focuses on delivering edge AI computing solutions based on the Jetson platform for embedded applications. NVIDIA Jetson is the leading AI-at-the-edge computing platform, with nearly half a million developers. With support for cloud-native technologies now available across the NVIDIA Jetson lineup, manufacturers of intelligent machines and developers of AI applications can build and deploy high-quality, software-defined features on embedded and edge devices targeting robotics, smart cities, healthcare, industrial IoT and more.

The AN110-XNX is available now. For more information, please contact us at [email protected] or visit our website at www.aetina.com.

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PR Newswire
ChipMOS to Present at Investor Conference Hosted by the Taiwan Stock Exchange and SinoPac Securities Corp.

HSINCHU, June 4, 2020 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present at the Taiwan Double Good Forum hosted by the Taiwan Stock Exchange and SinoPac Securities Corp. The virtual conference will take place on Wednesday, June 10, 2020.

Management from the Company, including Jesse Huang, Vice President of Strategy and Investor Relations, will discuss the Company’s recent financial results, business trends and growth opportunities. The Company’s investor update is currently available on the investor relations’ section of its website at www.chipmos.com.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

[email protected]

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

[email protected]

Related Links :

http://www.chipmos.com

PR Newswire
KLEVV Builds on New SSD with Enhanced Line-up: Introducing NEO N610 2.5″ SATA & CRAS C710 M.2 NVMe SSDs

HONG KONG, June 3, 2020 /PRNewswire/ — KLEVV, an emerging memory brand introduced by Essencore, announced the launch of two new products, the NEO N610 2.5" SATA 6Gb/s SSD, and the CRAS C710 M.2 NVMe SSD. The next-generation solid-state drives are available in enhanced capacities of up to 1TB, offering accelerated system speeds while maintaining core stability. The introduction of these two new KLEVV SSDs is to provide an even more compelling SSD choice for users looking for rock-solid reliability and fast speeds for a wide range of uses.

NEO N610 2.5" SATA 6Gb/s SSD: A Perfect Combination of Performance, Reliability, and Stability

KLEVV NEO N610 2.5" SATA SSD
KLEVV NEO N610 2.5" SATA SSD

The NEO N610 2.5" SATA 6Gb/s SSD features latest 3D TLC NAND and a 4-channel controller IC, which increases the amount of data that can be transmitted at any given time. Different from other KLEVV 2.5" SSDs, NEO N610 provides an embedded DRAM buffer that enhances runtime performance while also extends the lifespan of the drive. It comes further equipped with a powerful LDPC ECC engine, an intelligent SLC caching algorithm, S.M.A.R.T. (self-monitoring, analysis, and reporting technology), over-provisioning, bad block management, and Global Wear Leveling technology. All of which combine to optimize performance, durability, reliability, and data integrity. The new NEO N610 SATA SSD comes in three capacities: 256GB, 512GB, 1TB, while delivering sequential read/write speeds of up to 560/520 MB/s, catering to customers with varied efficiency needs.

CRAS C710 M.2 NVMe SSD: Built for Gamers & Enthusiasts

KLEVV CRAS C710 M.2 NVMe SSD
KLEVV CRAS C710 M.2 NVMe SSD

Also offered in 256GB, 512GB and 1TB using 3D TLC NAND, the CRAS C710 M.2 NVMe SSD adopts PCIe Gen3 x4 interface supported by NVMe 1.3 technology. Which provides a sequential read speed of up to 2100 MB/s and a sequential write speed of up to 1650 MB/s, while retaining legacy technology to ensure stable performance even at high processing speeds, making it ideal for gaming or image processing. Optimized technologies include a thermal throttling algorithm to protect SSD integrity, SRAM error detection and correction, and CRC parity for end-to-end data path protection. In addition, the CRAS C710 shares all the essential functions that make KLEVV drives reliable, such as LDPC ECC technology, SLC caching, S.M.A.R.T. and Global Wear Leveling.

Responding to the Market with Additional Data Backup Software for Peace of Mind

By making customer service a top priority, Both CRAS C710 & NEO N610 have gone through KLEVV’s rigorous in-house examination process, and come with a five-year limited warranty as standard.  Further to that, KLEVV has improved user experience by providing complimentary Acronis® True Image™ HD 2018 software activation key, which gives users full disk-image backup access and universal restore functions for a seamless data transfer experience. Additional Acronis Active Protection function against ransomware is also available to help protect valuable data from this nefarious & modern data threat.

KLEVV products are distributed by Scorptec Computers in Australia. All lineups are available at Scorptec’s online and offline stores.

Find out more about the full range of Essencore/KLEVV products at: http://www.essencore.com/ and http://www.klevv.com.

About Essencore

Established in 2014, Essencore Limited, a company founded by a group of key figures from the major memory IDMs, aims to become the world’s top vendor of DRAM modules and NAND flash application products. The company started with one goal: to "Change the world and be a leader in semiconductor distribution". The business strategies of Essencore is to adopt the newest technologies to differentiate ourselves in front of customers from competitors, deliver dedicated Memory products, and offer various product portfolio for customer’s competition readiness. For more information, please visit www.essencore.com.

About KLEVV

KLEVV, is a premium brand of Essencore, the major Module and NAND Flash application product vendor. The KLEVV range includes gaming memory modules, microSDs, USB flash drives, and solid state drives. KLEVV is committed to delivering world-class products with first-rate quality. All products are designed in South Korea, home of the world’s top two largest memory IDMs. KLEVV memory has been recognized by Germany’s Red Dot Design Award in 2015 and 2019. For more information, please visit www.klevv.com.

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Related Links :

http://www.essencore.com/

http://www.klevv.com

PR Newswire
Memory, Power and AI Semiconductors in 5G to Hit $15.03 Billion in Revenues by 2025, Finds Frost & Sullivan

5G semiconductor applications witness unprecedented growth, driven by increasing data traffic and hardware improvements

SANTA CLARA, California, June 3, 2020 /PRNewswire/ — Frost & Sullivan’s recent analysis, Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025, finds that the 5G AI, memory, and power amplifier (PA) semiconductor market is rapidly transitioning from a nascent stage to a growth stage. It is strongly driven by exponentially increasing data traffic, technological advancements leading to hardware performance and capability improvements, and the emergence of new use cases. Registering an unprecedented growth at a compound annual growth rate (CAGR) of 74.3%, the market for 5G AI, memory, and PA semiconductors is estimated to garner revenue of $15.03 billion by 2025 from $536.9 million in 2019.

Frost & Sullivan - 5G
Frost & Sullivan – 5G

For further information on this analysis, please visit – http://frost.ly/458.

"5G is in the early commercialization stage, and a majority of the deployments in the coming years are expected to be in the sub-6 GHz range. Hence, short-term opportunities will be limited to traditional devices, such as smartphones, communication infrastructure, and laptops," said Prabhu Karunakaran, Test & Measurement Industry Analyst at Frost & Sullivan. "Further, the AI processor market for 5G applications is rapidly growing, specifically in edge devices. They are expected to play a significant role in various devices, including edge servers and autonomous cars."

Karunakaran added, "Memory integrated circuits (ICs) supporting 5G end-user markets will be the highest contributors. Power amplifier IC is estimated to have generated larger revenue due to multiple 5G deployments, with revenue from the infrastructure segment. Additionally, AI is in the infancy stage and is expected to grow significantly in the next five years."

To tap into opportunities created by memory, PA, and AI semiconductors in 5G, Frost & Sullivan has identified key prospects in the:

  • Manufacturing Sector: To mitigate the issues of surging operational costs in the manufacturing sector, semiconductor companies must work with network equipment manufacturers and robotics system manufacturers to integrate cost-effective memory, PA, and AI chips and capitalize on the opportunity.
  • Healthcare Sector: The spread of the COVID-19 pandemic has resulted in a sudden rise in the adoption of robotics in the healthcare sector. AI and PA market participants should look into optimizing the existing products to leverage this unprecedented opportunity.
  • Automotive Sector: Autonomous vehicles need an ultra-fast, reliable network that processes huge volumes of data. Hence, 5G AI, PA, and memory device manufacturers should develop automotive-grade devices that function reliably.
  • Retail Sector: AI, memory, and PA semiconductor market participants should increasingly focus on developing solutions for 5G edge servers that will require processing large data volumes.
  • Agriculture Sector: Digitization is transforming the agriculture sector rapidly. Market players must work with system and device manufacturers to develop cost-effective, application-specific integrated circuits to enhance farm productivity.

Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025 is the latest addition to Frost & Sullivan’s Test & Measurement research and analyses available through the Frost & Sullivan Leadership Council, which helps organizations identify a continuous flow of growth opportunities to succeed in an unpredictable future.

About Frost & Sullivan
For over five decades, Frost & Sullivan has become world-renowned for its role in helping investors, corporate leaders and governments navigate economic changes and identify disruptive technologies, Mega Trends, new business models and companies to action, resulting in a continuous flow of growth opportunities to drive future success. Contact us: Start the discussion.

Growth Opportunities for Memory, Power, and Artificial Intelligence (AI) Semiconductors in 5G, Forecast to 2025
(K44C-26)

Media Contact:
Priya George, Corporate Communications
M: +91 98403 55432; P: +91 44 6681 4414
E: [email protected] 

http://ww2.frost.com

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Related Links :

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PR Newswire
L-com Launches New Category 6a, IP67-Rated, Outdoor, High-Flex Cable Assemblies

IRVINE, California, May 29, 2020 /PRNewswire/ — L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, announced today that it has introduced a new series of Cat6a, IP67 and outdoor-rated cable assemblies for use in harsh industrial environments.

TRG695AHF1-05M
TRG695AHF1-05M

L-com’s new TRG695AHF-series cables are designed for industrial and outdoor environments where ordinary patch cables would fail. These ultra high-flex cables utilize an outdoor-rated FR-TPE (flame-retardant thermoplastic elastomer) jacket that is resistant to industrial oils and UV damage while maintaining a CMX flame rating. Double shielding along with L-com’s shielded RJ45 connectors thwart EMI/RFI interference. These assemblies are available with either one or both ends having a shrouded IP67-rated, waterproof RJ45 plug that is compatible with L-com’s TDG1026KS-C6A-DC-WPK or WP67-BHA-DC for a waterproof seal. Additionally, the WP67-RJ45-DC waterproof RJ45 plug kits are also available for customers who would like to build or repair their own assemblies.

"These new rugged Ethernet cable assemblies offer both extreme durability and the ability to support 10 Gig connectivity with a Category 6a rating. Designed for outdoor use, these new Industrial Ethernet cables are one of the toughest lines L-com offers off-the-shelf with same-day shipping," said Dustin Guttaduaro, Product Line Manager.

L-com’s new Category 6a, IP67-rated, outdoor, high-flex cable assemblies are all in stock and available for immediate shipment.

About L-com:
L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. L-com is headquartered in North Andover, Mass., is ISO 9001: 2015 certified and many of its products are UL® recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:
Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMe Cables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.

Press Contact:
Peter McNeil
L-com
17792 Fitch
Irvine, CA
978-682-6936

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PR Newswire
Aetina x SmartCow: Introduce Medical Assistant for Pandemic Environment Care

TAIPEI, May 28, 2020 /PRNewswire/ — Healthcare system is the foundation of human being culture, every innovative medical research shows its supports and values to continue and expand. The world is suffering from COVID-19, AI developers seek a medical assistant to maintain the healthcare system. Aetina Corporation, a GPGPU and edge AI computing solution provider, and AI solution developer, SmartCow Co. Ltd. cooperated building an algorithm with six types of AI models that based on the edge computing platform.

Aetina x SmartCow: smart medical assistant for pandemic environment care, powered by edge AI computing platform
Aetina x SmartCow: smart medical assistant for pandemic environment care, powered by edge AI computing platform

Edgar, an AI-powered healthcare assistant built-up with Aetina AN110-NAO platform, developed for a safe work environment and patient care. In public, AI should build in original equipment or other machines most efficiently, AN110-NAO sized perfectly, with 87.4×67.4×46 mm (with fan). Various I/O support is an excellent way to build a tight and one single solution. The AN110-NAO platform, which is ready for common I/O, includes the I2S slot that brings audio out, which is suited for Edgar’s application environment, set for warning modules. Meanwhile, camera supports are the core visual AI solution. The platform supports MIPI CSI-II interface 1x 4k or 2x FHD cameras. Not only landed-ready but also fulfill demands from Edgar – high-resolution images bring accurate reality recognition.

Edgar supports six types of AI models, like social distance estimation, masks detection, and safe sneeze action classification. Among these functions, Edgar creates a safe environment in times of medical emergencies, assist the front-line medical staff in preventing the respiratory disease. For example, one of Edgar’s ability is face-mask recognition. It can be set up easily in access and provide guidance and direction to mask dispenser machines before differentiating the mask-wore to enter the premises. The types of face mask covered PPE, N95 and surgical. Another specialty of Edgar is social distancing detection; the device could combine with a policy network and keep public activity in 6 feet between 2 people.

In the data explosion era, security and privacy is the first concern. Edgar is GDPR compliant. Images will be processed and remain on the edge system; no data will transfer to the cloud. It is well-prepared for the public and ready to assist the market. Besides, Aetina Jetson series serve comprehensive, experienced R&D advise and edge AI ecosystem prop for AI development.

To reach more detail by visit Aetina website: www.aetina.com or contact them at [email protected].

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Related Links :

http://www.aetina.com

PR Newswire
Prysm Launches 225″ LPD World’s Largest Seamless Interactive Display- Preparing Businesses for Pandemic and Post-pandemic World

SAN JOSE, California, BEIJING and DUBAI, U.A.E., May 28, 2020 /PRNewswire/ — Prysm Inc.,a leading display and visual collaboration solutions provider is creating a new category in the display market by unveiling its World’s largest seamless interactive display – the Prysm Laser Phosphor Display (LPD) 6K  Series, 225" which is 20ft wide and 5ft high. The Prysm LPD 6K Series are interactive large-format displays that offer a panoramic image uninterrupted by seams or bezels.

Prysm launches World’s Largest Seamless Interactive & Energy-Efficient Display
Prysm launches World’s Largest Seamless Interactive & Energy-Efficient Display

 

The LPD 6K Series deliver top-notch experiences across different use cases. The flexible, impact-resistant surface offers smooth touch interaction and can be viewed at any distance & at any angle without eye fatigue. The latest interactive LPD is an extremely energy-efficient, shatter-resistant, flexible and offers rollability for transport.

The LPD 6K Series is uniquely optimized for executive briefing centers, command and control centers, training rooms, collaboration and innovation centers. Coupled with Prysm’s visual collaboration platform, it makes meetings, presentations & analysis more engaging and immersive, resulting in better, faster decisions. It is ideal for central monitoring of business processes and workflows across the entire organization.

The new modular design helps speed display integration and permits installation in a variety of locations. The durable front screen – made of a specially coated polycarbonate layer – is rolled into a cylinder for easy transport. It can enter through standard doors and passenger elevators during set-up. The LPD 6K Series 225" is currently in general availability & shipping to partners & customers.

"We are excited to launch our largest LPD seamless interactive display, the LPD 6K 225". Prysm has been constantly innovating and pushing the boundaries of technology," said Amit Jain, President and CEO of Prysm. "In today’s challenging business environment, where organizations are looking for interactivity, seamless integration, connectivity and collaboration, we allow teams to work together from any part of the world, saving countless travel hours and resources."

"Virtual life-like experiences will become so much more important in the new age of reducing travel and commuting to prevent undue health exposures while helping the environment. The LPD 6K 225" adds to the existing product line; the LPD 6K 190" and the LPD 6K 135". The new 225" form factor allows displaying two large 125" 16:9 content side-by-side with uncompromised scaling. Simultaneous data and visual feeds can be broadcasted to and from mobile or standalone displays with high cloud security," said Dr Roger Hajjar, Founder and CTO, Prysm.

Video

About Prysm

PR Newswire
Microchip Switchtec(TM) PAX Advanced Fabric Gen 4 PCIe Switches Released to Production

Switchtec PAX PCIe fabric solutions provide greater flexibility and scalability for data center and cloud AI and ML architectures

BANGKOK, May 28, 2020 /PRNewswire/ — To support cloud, data center and hyperscale computing that facilitates advancements in Artificial Intelligence (AI) and Machine Learning (ML), Microchip Technology Inc. (Nasdaq: MCHP) today released to production its Switchtec™ PAX Advanced Fabric Gen 4 PCIe switch family, enabling complex fabric topologies with greater scalability, lower latency, and higher performance than traditional Peripheral Component Interconnect Express (PCIe) switches.

Microchip Switchtec(TM) PAX Advanced Fabric Gen 4 PCIe Switches Released to Production
Microchip Switchtec(TM) PAX Advanced Fabric Gen 4 PCIe Switches Released to Production

 

Microchip Switchtec(TM) PAX Advanced Fabric Gen 4 PCIe Switches Released to Product
Microchip Switchtec(TM) PAX Advanced Fabric Gen 4 PCIe Switches Released to Product

Microchip’s Switchtec PAX PCIe family of switches provides a turnkey fabric solution and reduces time-to-market for systems requiring multi-host sharing of Single Root I/O Virtualization (SR-IOV) Non-Volatile Memory (NVMe) Solid State Drives (SSDs), Graphics Processing Units (GPUs) and other PCIe endpoints. 

The Switchtec PAX devices are the industry’s lowest-power Gen 4 PCIe switches, significantly reducing total system power consumption. The Switchtec PAX family of switches is available in the following variants: 100-lane, 84-lane, 68-lane, 52-lane, 36-lane and 28-lane. Other PAX family of switches features include:

  • Advanced error containment
  • Comprehensive diagnostics and debug capabilities
  • Wide breadth of I/O interfaces
  • Integrated MIPS processor
  • Secure boot to prevent execution of unauthorized firmware through public key cryptography.

Applications include GPU workstations, composable General Purpose GPUs (GP-GPU) fabrics, scalable multi-host systems, SR-IOV-enabled JBOFs, disaggregated systems and rack-scale architectures.

Contact the Microchip salesperson for ordering detail. Complete information is at https://www.microchip.com/design-centers/interface-and-connectivity/pcie-switches

Resources:

Application Image: https://www.flickr.com/photos/microchiptechnology/49895531416/
Block diagram: https://www.flickr.com/photos/microchiptechnology/49895848567

About Microchip Technology

Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

Note: The Microchip name and logo, and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Switchtec™ is a trademark of Microchip. All other trademarks mentioned herein are the property of their respective companies.

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Related Links :

http://www.microchip.com

PR Newswire
L-com Launches New High-Flex, Continuous Motion USB 3.0 Cable Assemblies with Machine Vision Thumbscrews

IRVINE, California, May 22, 2020 /PRNewswire/ — L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, announced today that they have launched a new line of high-flex, continuous motion USB 3.0 cables with machine vision thumbscrews to address industrial connectivity applications.

CAU3VISHFAMB-1M
CAU3VISHFAMB-1M

L-com’s new USB 3.0 high-flex cables are made for applications where ordinary USB cables would fail. They feature a special continuous motion TPE cable which allows the assembly to be flexed up to one million times without degradation of performance.  Additionally, these new high-flex USB 3.0 cable assemblies feature UL recognized jackets and 22AWG power conductors for maximum power delivery, optional machine vision thumbscrews on the Micro-B connectors for secure, locked down connections and a foil plus braid shield which provides maximum protection against EMI/RFI. These continuous motion USB cables are excellent for use in automation and factory use and are available off-the-shelf in standard lengths of 1, 2 and 3 meters.

"Our unique, high-flex USB 3.0 cables were specifically designed to address applications where ordinary cables would fail due to excessive flexure. These rugged cables can withstand 10 times as many flex cycles as a standard USB cable while retaining their performance and durability," said Dustin Guttadauro, Product Manager.

L-com’s high-flex USB 3.0 cable assemblies with machine vision thumbscrews are in stock and available for immediate shipment.

About L-com:

L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. L-com is headquartered in North Andover, Mass., is ISO 9001: 2015 certified and many of its products are UL® recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:

Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMe Cables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.

Press Contact:
Peter McNeil
L-com
17792 Fitch
Irvine, CA
978-682-6936

Photo – https://techent.tv/wp-content/uploads/2020/05/l-com-launches-new-high-flex-continuous-motion-usb-3-0-cable-assemblies-with-machine-vision-thumbscrews.jpg
Logo – https://techent.tv/wp-content/uploads/2020/05/l-com-launches-new-high-flex-continuous-motion-usb-3-0-cable-assemblies-with-machine-vision-thumbscrews-1.jpg

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