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PR Newswire

MediaTek Advances its 5G Platform with New T750 5G Chipset for Fixed Wireless Access Routers and Mobile Hotspot CPE Devices

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Highly integrated, low-power T750 5G chipset delivers 5G broadband experience for 5G NR sub-6GHz frequencies

HSINCHU, Taiwan, Sept. 3, 2020 — MediaTek today announced its T750 5G chipset to power next generation 5G CPE wireless products, like fixed wireless access routers (FWA) and mobile hotspots, to bring fast 5G connectivity into homes, businesses and anyone on the go.

The highly integrated, 7nm compact chip design comes with an integrated 5G radio and quad-core Arm CPU. It’s full-featured with all the essential functions and peripherals for device makers to build high performance consumer premise equipment products in the smallest form factors possible. The T750 is sampling now with potential customers.

"Pervasive high-speed broadband connectivity is becoming more important with the increase in connected devices and the surge of people working from home, taking online classes and using services like tele-health and video calling," said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit. "We are extending our 5G leadership beyond the smartphone segment with the T750 chipset, opening up new markets for broadband operators and device makers, and helping consumers – no matter where they live – to experience all the advantages of 5G connectivity."

5G routers with support for sub-6GHz frequencies bring a more affordable broadband alternative to areas with limited DSL, cable or fiber services. Having access to super-fast connectivity will also be a game-changer for suburban, rural and less developed areas that struggle with access to current wireless services and signals.

Analyst firm IDC expects the global 5G and LTE router and gateway market to grow from approximately $979 million in 2019 to just under $3 billion in 2024. Counterpoint Research also projects 5G fixed wireless access growing from 10.3M subscribers in 2020 to over 450M subscribers by 2030.  

The MediaTek T750 chipset supports 5G sub-6GHz frequencies and two component carrier aggregation (2CC CA) for extended coverage, making it ideal for indoor and outdoor fixed wireless access products, like home routers, as well as mobile hotspots. In addition, the T750 design, which includes a 5G NR FR1 modem, quad-core Arm Cortex-A55 processors and the required peripherals all on a single chip, offers performance and time-to-market advantages that speed up ODM/OEM development times.

"Operators can take advantage of 5G capabilities, high bandwidth and low latency to offer 5G FWA services supporting fiber-like experience for consumers and businesses. As adoption of live video streaming and latency intensive applications such as gaming, AR/VR based online applications is increasing, 5G FWA services are expected gain momentum," said Khin Sandi Lynn, industry analyst from ABI Research. "MediaTek’s 5G chipsets for FWA routers will certainly fulfill the market demand as well as accelerate the competition in the FWA CPE ecosystem. In addition, the support of sub-6GHz band is a perfect solution for many of the operators planning to achieve wide service coverage in a short time frame."

For consumers, the T750 offers a compact 5G device that they can self-install and avoid the hassles of lengthy installation times for fixed line broadband. For operators, the T750 will provide 5G speeds right out the box to rival fixed line services without incurring costs for laying down cables or fiber. The T750 chipset comes pre-integrated with software drivers for MediaTek’s connectivity solutions such as our 4×4 and 2×2 + 2×2 dual-band Wi-Fi 6 chipsets for distributing fast 5G internet to consumers’ favorite client devices.

Additional T750 features include:

  • Support for standalone and non-standalone (SA/NSA) sub-6GHz 5G networks
  • Two component 5G FR1 carrier aggregation in both FDD and TDD modes
  • Support for up to 5CC LTE carrier aggregation
  • Embedded GPU and display driver to support a HD display up to 720p
  • Four PCIe interfaces for external Wi-Fi and Bluetooth
  • Two 2.5Gbps SGMII interfaces to allow for a variety of LAN configurations
  • PCM interface for external land-line phones

The T750 joins the MediaTek family of 5G chips powering smartphones, smart homes and PCs. It leverages MediaTek’s existing integrated circuits and intellectual property to help OEMs accelerate time to market. MediaTek recently introduced its T700 5G data card connectivity solution for PCs and other embedded applications. MediaTek boasts a full tier of 5G Dimensity chips for smartphones. The Dimensity series are powerful and power-efficient chipsets offering unrivaled connectivity, multimedia, AI and imaging innovations for premium and mid-tier smartphones. MediaTek is also the number one Wi-Fi supplier across broadband, retail routers, consumer electronics devices and gaming, and its Wi-Fi 6 chipsets are powering the latest networking equipment for faster computing experiences.

For more information about MediaTek’s 5G portfolio, please visit: https://i.mediatek.com/mediatek-5g.

###                    

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 1.5 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.

MediaTek Press Office:

PR@mediatek.com
Kevin Keating, MediaTek
+1- 206-321-7295
10188 Telesis Ct #500, San Diego, CA 92121, USA

 

Related Links :

http://www.mediatek.com

PR Newswire

Acer Announces Availability of New Swift 5 and Swift 3 Notebooks Powered by 11th Gen Intel Core Processors, Swift 5 Verified as An Intel Evo Platform Notebook

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Award-winning Acer Swift 5 thin-and-light laptop one of the industry’s first to have been tested, tuned and verified[1] to meet the requirements of the Intel® Evo™ platform, ensuring it meets Intel’s hardware specifications and key experience targets for consistent responsiveness, instant wake, long-lasting battery life and fast charge.

Editor’s Summary

  • Swift 5 (SF514-55) is a performance-minded ultraportable with an Antimicrobial Corning® Gorilla® Glass touchscreen[2], with the option to further include an antimicrobial solution[2] on the touchpad, keyboard and all covers of the device (SF414-55TA), and verified as an Intel Evo platform notebook design
  • Two Swift 3 models provide ample performance: Swift 3 (SF313-53) maximizes viewing and productivity with a high-brightness 13.5-inch 2K 3:2 display; Swift 3 (SF314-59) is svelte, stylish and features a 14-inch Full HD 16:9 display

TAIPEI, Sept. 3, 2020 — Acer today announced the availability of the new Swift 5 and Swift 3 notebook models featuring new 11th Gen Intel® Core™ processors with Iris® Xe graphics.

 

Acer Swift 5 (SF514-55) powered by 11th Gen Intel Core processors and verified as an Intel Evo platform notebook
Acer Swift 5 (SF514-55) powered by 11th Gen Intel Core processors and verified as an Intel Evo platform notebook

The new Acer Swift 5 notebook is one of the industry’s first to be verified[1] through Intel’s Project Athena innovation program, as Intel® Evo™ platform laptop design, and designed to deliver incredibly responsive mobile performance and immersive features that improve the overall experience, including instant wake, Intel Iris Xe graphics, vibrant displays and the latest in connectivity. In addition, it features an all-day battery that can be fast-charged, yielding four hours of use from only a 30-minute charge.

The Acer Swift 3 notebook designs are a part of Intel’s Project Athena innovation program and targeting verification, pending further tuning, to utilize the Intel Evo platform badge.

"The new Acer Swift notebook lines represent a substantial leap forward in performance, responsiveness and usability for our customers who are cultivating a unique blend of work, life and passion-projects on-the-go," said James Lin, General Manager, Notebooks, IT Products Business, Acer Inc. "Acer took meticulous care to ensure that all aspects of the design were elevated to match the best-in-class experience the Intel Evo platform provides to help our customers achieve more."

Swift 5: Portable Sophistication with Antimicrobial Properties

The Acer Swift 5 (SF514-55) ultrathin-and-light notebook marries an uber-stylish design with the latest performance technology. Powered by 11th Gen Intel Core i5 and Intel Core i7 processors and verified[1] to meet the requirements of an Intel Evo platform, the Swift 5 has the power and performance to seamlessly run multiple applications and provides up to 17 hours of battery life[3] for all-day productivity. The Swift 5 can handle video, graphics and more on-the-go with new Intel Iris Xe graphics.[4]

The impressive capabilities of the Swift 5 are matched by its sophisticated aesthetics. The premium magnesium-lithium and magnesium-aluminum chassis is durable yet lightweight; it weighs about 1 kg (2.29 lbs). The specially-designed hinge elevates the device when the screen is opened, which improves ergonomics while typing, provides better thermal performance and keeps the focus on the vibrant 14-inch Full HD display. Boasting a 340-nit brightness[4] rating and covering 100% of the sRGB color gamut, the display is surrounded by ultra-narrow bezels on all four sides, resulting in a 90% screen-to-body ratio and creating an immersive viewing experience and more compact form factor.

The Swift 5’s touchscreen display is covered with a layer of Antimicrobial Corning® Gorilla® Glass[2], which has been specially formulated to reduce the growth of odor and stain-causing microorganisms. Additionally, users have the option to further include an antimicrobial solution[2] on the touchpad, keyboard and all covers of the device.

Swift 3: Performance and Portability in Two Different Display Choices

Providing an ideal balance between performance and design, two models in the Acer Swift 3 line will be powered by new 11th Gen Intel Core i7 and Core i5 processors and are a part Intel’s Project Athena innovation program. The Swift 3 notebooks are currently targeting verification, pending further tuning, to utilize the Intel Evo platform badge. 

The two new Swift 3 models have a sleek metal chassis, the latest technology including Intel Iris Xe graphics and Thunderbolt™ 4.[4] Customers will also enjoy a fast and reliable Internet connection with WiFi 6 (Gig +). 

The new Acer Swift 3 (SF313-53) maximizes viewing with a productivity-boosting and vibrant 13.5-inch display with 2256 x 1504 resolution and a 3:2 aspect ratio for 18% more vertical viewing and less need to scroll. In addition, the display covers 100 percent of the sRGB color range and has a 400-nit brightness[4] rating. The Swift 3 (SF313-53) provides up to 18 hours of battery life[3] for more than all-day productivity. Plus, the lightweight and durable aluminum and magnesium-aluminum design makes the Swift 3 (SF313-53) easy to transport anywhere; it measures only 15.95 mm (0.63 inch) thin, weighing just 2.62 pounds (1.19kg).

Featuring a svelte and stylish design, the new Acer Swift 3 (SF314-59) has an aluminum chassis and a magnesium-aluminum palm rest. The Swift 3’s ultra-narrow 0.22-inch bezels enhance the compact frame and provide a screen-to-body ratio of up to 82.73 percent, keeping the focus on the vibrant images on the Full HD 14-inch display. Weighing just 2.65 pounds (1.2kg) and measuring just 15.95 mm (0.63 inch) thin, the Swift 3 is easy to carry by hand, and fits easily into a briefcase or book bag.

Both new Swift 3 models have a backlit keyboard, utilize fast and reliable SSD storage and support up to 16GB of LPDDR4X memory. In addition, they support Windows Hello via a fingerprint reader for easy and more secure logins.   

Pricing and Availability

The Acer Swift 5 (SF514-55) with 11th Gen Intel Core processors and a 14-inch Full HD display will be available in North America in November starting at USD 999.99.

The Acer Swift 3 (SF313-53) with 11th Gen Intel Core processors and a 13.5-inch 2K display will be available in North America in November starting at USD 799.99.

The Acer Swift 3 (SF314-59) with 11th Gen Intel Core processors and a 14-inch Full HD display will be available in North America in November starting at USD 699.99.

Exact specifications, prices, and availability will vary by region. To learn more about availability, product specifications and prices in specific markets, please contact your nearest Acer office via www.acer.com.

[1] As measured by industry benchmark and Representative Usage Guides testing and unique features of 11th Gen Intel® Core™ processors. Intel’s comprehensive laptop innovation program Project Athena ensures designs are tested, measured and verified against a premium specification and key experience indicators. For more complete information about performance and benchmark results, visit www.intel.com/Evo.

[2] All antimicrobial solutions including Antimicrobial Corning® Gorilla® Glass do not protect users or provide any direct or implied health-benefit.

[3] Listed battery life is based on testing using video playback. The test clip loops and continues to run, without interruption or any other inputs, until the battery is drained. Stated battery life is for comparison purpose only. Actual battery life varies by model, configuration, applications, video chip format andmfeatures used. A battery’s maximum capacity decreases with time and use. Battery life test configuration: 11th Gen Intel® Core™ i7, Intel® Iris® Plus Graphics, FHD, SSD only, 16GB of LPDDR4X memory. Battery life test condition: LCD brightness 150 nits, connected headphones, WLAN off, Bluetooth off and Better Battery Mode on.

[4] Specifications may vary depending on model and/or region. All models subject to availability.

About Acer

Established in 1976, Acer is a hardware + software + services company dedicated to the research, design, marketing, sale, and support of innovative products that enhance people’s lives. Acer’s product offerings include PCs, displays, projectors, servers, tablets, smartphones and wearables. It is also developing cloud solutions to bring together the Internet of Things. Acer celebrated its 40th anniversary in 2016 and is one of the world’s top 5 PC companies. It employs 7,000 people worldwide and has a presence in over 160 countries. Please visit www.acer.com for more information.

© 2020 Acer Inc. All rights reserved. Acer and the Acer logo are registered trademarks of Acer Inc. Intel and the Intel logo are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other trademarks, registered trademarks, and/or service marks, indicated or otherwise, are the property of their respective owners. All offers subject to change without notice or obligation and may not be available through all sales channels. Prices listed are manufacturer suggested retail prices and may vary by location. Applicable sales tax extra.

Related Links :

http://www.acer.com

PR Newswire

ChipMOS to Present at 21st Credit Suisse Asian Technology Conference.

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HSINCHU, Sept. 1, 2020 — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today announced that it will present at the 21st Credit Suisse Asian Technology Conference to be held virtually from Wednesday, September 9 to Friday, September 11, 2020.

Management from the Company, including Jesse Huang, Vice President of Strategy and Investor Relations, will meet virtually with institutional investors to discuss the Company’s recent financial results, business trends and growth opportunities.  The Company’s latest investor update is available on the investor relations’ section of its website at www.chipmos.com.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 

Related Links :

https://www.chipmos.com

PR Newswire

Flujo PowerEdge: World’s First Monitor Stand with Modular USB-C Multifunction Docking Station launches on Kickstarter

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SINGAPORE, Sept. 1, 2020 — A year after the debut of the first integrated USB-C Hub and SSD enclosure, Flujo has returned to unveil its next crowd-funded product. The world’s first monitor stand with a modular USB-C Hub will launch on Kickstarter this August. As businesses around the world explore the possibility of remote working, Flujo PowerEdge may become the next addition to home workspaces as we adjust to the new normal.

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PowerEdge
PowerEdge

The PowerEdge is a monitor stand with a detachable USB-C hub, designed to expand connectivity options at home and offer mobility of portable USB-C hubs, useful whenever users want to take their work outside. It comes with a large variety of ports – two USB-A 3.0 ports, one HDMI port, one USB-C port, SD and microSD card slot, an audio jack, one Ethernet port, and a VGA port. Here are the specification at a glance:

Outputs: 

  • HDMI 2.0: 4K@30Hz
  • SD/MicroSD: Up to 104Mbps
  • USB-A 3.0 x 2: Up to 5Gbps
  • USB-C: Power Delivery of 60W Max
  • Audio: 3.5mm
  • RJ45 (Ethernet): 10/100/1000 Mbps
  • VGA: 1080P

Input: USB-C (Bus Power)

Cable Management
Cable Management

The PowerEdge is equipped with most of the essential ports needed for remote working: 2 USB-A 3.0 ports for file transfer, a USB-C port for device charging, SD and MicroSD card slots for data transfer from a phone or camera, an Ethernet port for stable internet connections, and a basic audio port for sound. The HDMI output can handle a display at 4K 30Hz, enabling users to enjoy gorgeous displays on a 4K screen. The PowerEdge also comes with a VGA port, a nod to the fact that many office monitors still have VGA connections.

Easily assembled and without the need of tools, the PowerEdge provides a comfortable viewing height for monitors and laptops, encouraging good posture and reducing neck strain associated with long hours of sitting. It features a cable holder to aid with the possibility of messy cables sticking out from behind the ports. With the trend in Apple accessory design, the Power Edge is made of aluminum to match the aesthetics of users’ iMac or Macbook.

Ports
Ports

The Kickstarter exclusive will be priced at SGD158 for early bird space, limited to the first 80 units. Be among the first to get the PowerEdge, now available on Kickstarter.

Video – https://cdn5.prnasia.com/202008/Flujo/video.mp4
Photo – https://photos.prnasia.com/prnh/20200819/2889693-1-a?lang=0
Photo – https://photos.prnasia.com/prnh/20200819/2889693-1-b?lang=0
Photo – https://photos.prnasia.com/prnh/20200819/2889693-1-c?lang=0

https://cdn5.prnasia.com/202008/Flujo/video.mp4?_=1
PR Newswire

HARTING Technology Group has been shaping the future for 75 years

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Innovative products and solutions for Industry 4.0

ESPELKAMP, Germany, Aug. 28, 2020 — For 75 years now, the HARTING Technology Group has been driving technological change. The vision formulated in 1996 by the owner family "We want to shape the future with technologies for people" remains the guiding star of our entrepreneurial activities. September 1 marks the 75th anniversary of the founding day of the family company.

The manufacturer of everyday products such as waffle irons and irons has evolved into a worldwide leading supplier of industrial connection technology for the three lifelines of data, signal and power, a global player fielding innovative products and solutions focusing on Industry 4.0 and digitization.    

– Cross reference: Picture is available at AP Images (http://www.apimages.com) –

Wilhelm and Marie Harting opened the "Wilhelm Harting Mechanical Workshops" on September 1, 1945, in a repair workshop covering a good 100 square meters in Minden. From 1950 onwards, the company gradually moved to the neighbouring town Espelkamp. This was the period in which the success story of the Han® connector commenced. The Han® (HARTING standard), patented in 1956 and a registered trademark since 1957, became the standard, the epitome of the industrial connector. Thanks to the Han-Modular® series, customers are able to achieve optimal design solutions for the supply of machines, systems and plants.   

In October 2015, Dietmar Harting, son of Marie and Wilhelm Harting, handed over the reins as Chairman of the Board to his son Philip. Today, Philip Harting and his sister Maresa Harting-Hertz work closely with their parents Margrit and Dietmar Harting on the Board. The body includes three managers from outside the family.

Contact:

HARTING Stiftung & Co. KG
Detlef Sieverdingbeck
General Manager
Corporate Communications & Branding (CCB) 
Marienwerderstr. 3
32339 Espelkamp

Tel.: 05772 47-244
Fax:  05772 47-400
Detlef.Sieverdingbeck@HARTING.com
More information at www.HARTING.com

 

 

Related Links :

http://www.harting.com/

PR Newswire

L-com Introduces New USB 3.0 Right-Angle Type-C Assemblies Ideal for High Speed Data Transfer in Tight Spaces

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IRVINE, Calif., Aug. 28, 2020 — L-com, a preferred manufacturer of wired and wireless connectivity products, announced today that it has launched a new line of USB 3.0 right-angle type-C assemblies that are ideal for data storage and acquisition, test and measurement, video transfer or cameras, portable data storage, and gaming hardware and interfaces.

L-com’s newest USB 3.0 assemblies feature an angled, 90°, type-C male connector on one end, and either a straight, type-A male or 90°, right-angle, type-A male plug on the other end. Since USB type-C has no set orientation, these new angled C cables can serve as both left and right or up and down angles.  This eliminates the need for separate cables for each version angle as you can simply flip the cable from left to right or up to down.  These assemblies are USB 3.0-compliant and feature 30-micro-inch gold-plated contacts that provide a reliable connection with repeated mating cycles. These cable assemblies are constructed with molded back shells for durability and increased strength at cable entry point for solving difficult connection problems in tight spaces. Plus, UL-style 2725 PVC jackets with 26 AWG power conductors deliver excellent power transfer capability.

"These new cable assemblies are perfect for high speed data transfer in tight spaces, while creating neat and organized cable runs. They have durable, molded, angled ends that save space and reduce stress on connector heads, strain reliefs and connecting ports," said Dustin Guttadauro, Product Line Manager.

L-com’s new USB 3.0 right-angle type-C cable assemblies are in stock and available for immediate shipment.

About L-com:
L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. L-com is headquartered in North Andover, Mass., is ISO 9001: 2015 certified and many of its products are UL® recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:
Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMeCables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.

Press Contact:
Peter McNeil
L-com
17792 Fitch
Irvine, Calif.
978-682-6936

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PR Newswire

Vehicle Displays & Interfaces Virtual Technical Symposium & Expo to Provide a First Look at the Future of the Vehicle-to-Human Interface

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Society for Information Display (SID) Metropolitan Detroit Chapter Annual Meeting Sidelined by Pandemic to Now Take Place for a Global Engineering Virtual Only Audience October 14-15, 2020 and On Demand Until February 15, 2021

DETROIT, Aug. 27, 2020 — The Metropolitan Detroit Chapter of the Society for Information Display (SID) is pleased to announce the 27th Annual Vehicle Displays & Interfaces Symposium & Expo will take place in a virtual-only format Wednesday and Thursday October 14-15, 2020, for the benefit of multi-disciplined and multi-international OEM teams and specialists composed of designers, engineers, scientists, technologists, researchers, and system integrators of land, air, sea, and space vehicle displays.

The SID Metropolitan Detroit Chapter recognizes that in the high-tech 4th Industrial Revolution a strong technical understanding of new and emerging Display 3.0 technologies is essential to the global success of engineers, display specialists and executives who design, manufacture, sell and buy vehicle displays, display components, services, and products that integrate display and visual information technology into vehicles. 

In the 2020-decade, the rapid evolution and divergence of visual information technologies continues on pace to connect humankind with their land, air, sea and space vehicles, and their vehicles to them.

"This year’s technical program underscores how the future of electronic vehicle displays resides in the confluence of new and emerging sciences, materials, form factors and technological advances in hardware, software, sensors, systems, components and applications." – Silviu Pala, SID Symposium Chair

The two-day Vehicle Displays & Interfaces October event gives registrants an opportunity for in-depth learning and valuable insights from keynote and back-to-back technical presentations from globally recognized scientists, tech visionaries, thought leaders and researchers presenting leading-edge science and R&D, with leading value-add suppliers providing solutions to global supply chains from pandemic disruption. Registrants can conduct online Q&A with speakers in ‘chat,’ as well as move projects forward by arranging real-time ‘private chat’ sessions with expert exhibitor technical staff.

The 2020 online technical program features distinguished speaker presentations from the global display, HMI, vehicle systems, photonics, academic and vehicle OEM communities. Peer-reviewed papers provide in-depth knowledge and insights on the latest scientific advances, most recent breakthroughs, and potentially revolutionary applications.

TECHNICAL PROGRAM SEGMENTS, TOPICS AND SPEAKERS FROM US, ASIA, EUROPE

Displays and HMI Systems:

  • Reflection Properties of AR Coated Flat and AG Glass Surfaces
    Dave McLean, MAC Thin Films, Santa Rosa, CA, US
  • IOT Intelligent Display Technology
    Lingling Zhang, Tianma, Shanghai, China
  • Display Module with Integrated Driver of Multi-screen
    Liang Zhou, Tianma, Shanghai, China
  • High Precision Optical Bonding for Free-form and Curved Displays
    Gino Mariani, Henkel Surface Technologies, Madison Heights, MI, US

Head-Up Displays:

  • Diffusive Microlens Array for Head-Up Display Applications
    Jerry Wu, Dexerials Corporation, Tagajo-shi, Japan
  • Human Perception Studies of Head-Up Display Ghosting
    Steve Pankratz, 3M Display Materials and Systems Division, St. Paul, MN, US
  • Computational Holographic Displays for 3D AR HUD Using Free-Form Optics
    Hakan Urey, CY Vision, San Jose, CA, US
  • Holographic Optical Elements and Projector Design Considerations for Automotive Windshield Displays
    Michael Firth, CERES Holographics, St. Andrews, Scotland, UK

Tutorial:
Drs. Kai-Han Chang and Thomas Seder from GM R&D will deliver a presentation entitled ‘Holography and Its Automotive Applications: A Tutorial’

Display Metrology:                          

  • Understanding and Achieving Reproducible Sparkle Measurements for an Automotive Specification
    Ingo Rotscholl, TechnoTeam Bildverarbeitung GmbH, Ilmenau, Germany
  • Measuring MicroLEDs for Color Non-Uniformity Correction
    Mike Naldrett, ELDIM, Radiant Vision Systems LLC, Redmond, Washington, US

New Display Solutions:

  • Supervising (Automotive) Displays for Safe Visualization of Camera Video
    Benjamin Axmann, Mercedes-Benz Cars Group Research, Future Technologies, Boeblingen, Germany
  • Customized Local Dimming Algorithm and BLU for Automotive Application towards Low Power Consumption and High Visual Quality
    Maxim Schmidt, Institute of Microelectronics, Saarland University, Saarbrücken, Germany 
  • Automotive Smart Surfaces: Conformable HDR Displays and Smart Windows to Activate Almost Any Surface
    Paul Cain, FlexEnable, Cambridge, UK
  • The Functional Safety Designs of Vehicle Display Driver ICs
    Cheng-Chih Deno, Himax, Hsinchu City, Taiwan
  • Automotive Dual Cell microZone™LCD Development
    Paul Weindorf, Visteon Corporation, Van Buren TWP, MI, US
  • A Low-power Transflective TFT-LCD Based on IGZO TFT
    Lou Tenggang, Tianma Micro-Electronics Group, Shanghai, China
  • A Micro LED Device With 0mm Border
    TengGang Lou, Tianma Micro-Electronics Group, Shanghai, China
  • Enabling Features of VueReal MicroLED Technology for Automotive Applications
    Rexa Chaji, VueReal Inc, Waterloo, Ontario, Canada
  • New Challenges and Testing Solutions for Flexible Vehicle Displays & Interfaces
    Eisuke Tsuyuzaki, Bayflex Solutions, Alameda, CA, US
  • New Material Solutions for Automotive Displays. Interfaces and Applications
    Eisuke Tsuyuzaki, Bayflex Solutions, Alameda, CA, US 
  • An Alternative to OLED with Full-array Local Dimming in Automotive Displays
    Logan Cummins, Texas Instruments, Dallas, TX, US

Post-Event On Demand Viewing:
Registrants can view symposium presentations and virtual exhibitor booth content and videos anyplace, anytime, any time zone on demand until February 15, 2021.

Links:
To review the symposium program and exhibitor list, go to www.VehicleDisplay.org. 
To register, go to www.VehicleDisplay.org.
To secure a virtual exhibitor booth or sponsorship opportunity contact Joe Nemchek at jnemchek.@pcm411, or call (203) 502-8338.

About SID Vehicle Displays & Interfaces Detroit Symposium & Expo:
The SID Vehicle Displays & Interfaces Symposium & Expo Detroit is presented by the Metro-Detroit Chapter of SID (Society for Information Display) www.SID.org. SID is the only professional society focused on the advancement of electronic display and visual information technologies. By exclusively focusing on the advancement of electronic display and visual information technologies, SID provides a unique platform for industry collaboration, communication and training in all related technologies while showcasing the industry’s best new products. The organization’s members are professionals in the technical and business disciplines that relate to display research, design, manufacturing, applications, marketing and sales.

PR Newswire

Infortrend Provides Chinese Radio and TV Broadcasting Station with Storage Solution for NLE and Media Library

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TAIPEI, Aug. 25, 2020 — Infortrend® Technology, Inc. (TWSE: 2495), the industry-leading enterprise storage provider, enabled Chinese radio and TV broadcasting station with a reliable and high throughput EonStor GS storage solution for their non-linear editing (NLE) workflows and media asset management (MAM) system.

This Chinese radio and TV broadcasting station has been developing in line with the cultural reform by seamlessly combining traditional media with emerging media trends. As a result, the growing data volume and daily media workloads needed a modernized high throughput storage solution compatible with the already existing sophisticated hardware and software IT infrastructure. The station planned to deploy an easy-to-use storage with data protection functions. It was required to provide a foundation for media resource management and realization of the content ingestion, editing, and storage for release of radio and TV programs and further content archiving.

Infortrend’s EonStor GS 2000 with JB3000 expansion enclosure was chosen as it perfectly conformed to the project objectives. It can deliver up to 5.5GB/s throughput to handle workflow from 10 HD editing workstations through 10GbE. With such bandwidth, GS ensures that NLE workflows, e.g. editing, color correction, audio adjusting and subtitling, are smoothly and concurrently performed for on-time high quality program production. 100TB of usable space and smooth integration with the MAM-system allowed for unified and centralized management of all the media in the station. Data protection measures, such as RAID6 disk protection, snapshots, remote replication, and cloud backup, secure integrity of media content. Importantly, the user-friendly management software EonOne allows non-IT employees to easily set up and manage the system. For future development in 4K and 8K content production, maximum storage capacity can be expanded to more than 10PB.

Learn more about EonStor GS

About Infortrend

Infortrend (TWSE: 2495) has been developing and manufacturing storage solutions since 1993. With a strong emphasis on in-house design, testing, and manufacturing, Infortrend storage delivers performance and scalability with the latest standards, user friendly data services, personal after-sales support, and unrivaled value. For more information, please visit www.infortrend.com

Infortrend® and EonStor® are trademarks or registered trademarks of Infortrend Technology, Inc.; other trademarks are the property of their respective owners.

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PR Newswire

SINTRONES Edge AI GPU Computing Solution enabling flexibility: EBOX-7000

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TAIPEI, Aug. 24, 2020 — SINTRONES, one of the global leaders in computing technology in vehicles, announces the launch of the new EBOX-7000 Edge AI GPU Computing. The new EBOX-7000 Edge AI GPU Computing is suitable for various factory automation and Industrial Internet of Things (IIoT) control system in large-scale processes such as mining and manufacturing. It is powered by Intel 9th Gen Core i7/ Intel 8th Gen Core i7/i5/i3 CPU with 6 x RJ45 GbE (optional 4 x PoE Max. 100W). EBOX-7000 features two LTE SIM Card Sockets with automatic SIM Card detection (Taiwan Patent No. M592609). It supports both 5G and LTE standard for wireless network performance. Furthermore, the users can simply remove the HDD and use it as a portable hard drive with USB port and power connector. No additional converter needed.

SINTRONES Edge AI GPU Computing Solution enabling flexibility:EBOX-7000
SINTRONES Edge AI GPU Computing Solution enabling flexibility:EBOX-7000

EBOX-7000 provides PCIe card expansion including a riser card w/ 1 x PCIe x16 slot (1 x PCIe 3.0 x16 interface) or optional riser card w/ 2 x PCIe x16 slot (2 x PCIe 3.0 x8 interface). Both riser cards can be up to 185mm length total 90W~150W PCIe cards. It is expandable with Nvidia Tesla Card, Nvidia GPU card, Nvme card, image capture card and I/O card. Furthermore, EBOX-7000 can be used in edge AI enhancements, intelligent video analytics AI Video analysis, IIoT, traffic management and machine vision.

EBOX-7000 features TPM 2.0 and memory 2 x DDR4 2400/2666 MHz SO-DIMM up to 32GB. In addition, the environmental tolerance continually maintains a wide range of operating temperatures (-40°C ~ 70°C) allowing it to operate in extreme and rugged environment conditions.

Another highlight of EBOX-7000 is the SINTRONE self-developed technology SINSmart – it provides reliable monitoring of network-connected remote power control devices, Power over Ethernet (PoE) switches and UPS for power management. It has remote monitoring of voltage, UPS delay setup and Digital, IO/WDT/System temperature control. This feature supports edge ai gpu computing with reliable remote connectivity. Furthermore, it has automatic recovery short circuit protection and vehicle power ignition for variety vehicles. Includes an optional battery backup kit (SINTRONE patented technology), for continuous operations, providing an extra 10 minutes after power drain or failure of the main power source to increase the reliability of the system.

Key Features:

  • Intel 9th Gen Core i7/ Intel 8th Gen Core i7/i5/i3
  • 1 x PCIe 3.0 x16 Interface Expansion (optional 2 x PCIe 3.0 x8 Interface)
  • 6 x RJ45 GbE (optional 4 x PoE Max. 100W)
  • 8 x GPI, 4 x GPO and 2 x RS-232/422/485
  • 1 x DP + 1 x HDMI + 1 x DVI-I (Single Link w/o Analog Video)
  • Dual Hot Swappable SATA Storage RAID 0,1,5
  • 9-48V DC Input and Operating Temp.: -40~70°C
  • TPM 2.0

For more information, please visit www.sintrones.com, Products / Edge AI GPU Computing.

About SINTRONES

SNTRONES is a world-renowned and ISO 9001 & IRIS ISO/TS 22163 certified company of in-vehicle computing system products. We are dedicated to provide our customers with high quality system products that meet international traffic standards certification, including EN50121, EN50155, E-Mark, IEC60945, IACS E10, DNV and MIL-810. SINTRONES in-vehicle computing solutions have been widely adopted and approved by many well-known international brands and companies in industries.

Photo – https://photos.prnasia.com/prnh/20200820/2891979-1?lang=0

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PR Newswire

MediaTek Conduct World’s First Public Test of 5G Satellite IoT Data Connection with Inmarsat

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MediaTek’s satellite-enabled Narrowband (NB)-IoT standard chipset tested with base station at Fucino Space Center in Italy using Inmarsat’s ‘Alphasat’ Geostationary Orbit (GEO) satellite

FUCINO SPACE CENTER, Italy, Aug. 19, 2020 — MediaTek is pushing the boundaries of advanced IoT 5G satellite communications with a successful field trial that transfers data through Inmarsat’s Alphasat L-band satellite, in Geostationary Orbit (GEO) 35,000 kilometers above the equator.

The results of MediaTek and Inmarsat’s IoT field test will be contributed to the 3rd Generation Partnership Project (3GPP)’s Rel-17 standardization work on Non-Terrestrial Network (NTN), which is part of its overarching initiative to establish 5G standards toward new use cases and services.

The new 5G satellite NB-IoT technology established a bi-directional link from MediaTek’s satellite-enabled standard NB-IoT device to a commercial GEO satellite, breaking new ground for a truly global IoT coverage. The successful test builds the foundation for hybrid satellite and cellular networks to enable new ubiquitous 5G IoT services at a global scale.

"MediaTek’s collaboration with Inmarsat will accelerate industry efforts to converge cellular and satellite networks in the 5G era. MediaTek is a leading connectivity provider and contributor to 3GPP standards, and our ongoing work with Inmarsat GEO satellites will help drive 5G innovation across verticals like IoT," said Dr. Ho-Chi Hwang, MediaTek General Manager of Communication System Design.

MediaTek is the world’s 4th largest fabless semiconductor company and Inmarsat is the world leader in global, mobile satellite communications. The two companies ran the test with a base station located at the Fucino Space Center in Italy and developed by Taiwan’s Institute for Information Industry (III). The test device, built with MediaTek’s satellite-enabled NB-IoT chipset, was located in Northern Italy. The prototype system successfully established a communication channel and data transfer with the GEO satellite ‘Alphasat’.

The successful test could provide proof as to the feasibility of new global standards and open market potential of using a single device for connecting both satellite and cellular networks.

"Testing MediaTek’s standard NB-IoT chip over Inmarsat’s established GEO satellite network has proven technology from mobile networks works effectively over GEO satellites with little modification and will provide a very cost effective path to ubiquitous and hybrid global IoT coverage," said Jonathan Beavon, Senior Director, Inmarsat Product Group.

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http://www.mediatek.com