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PR Newswire

ChipMOS REPORTS FOURTH QUARTER AND FULL YEAR 2020 RESULTS

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Full Year 2020 Highlights (as compared to the Full Year 2019):

  • 13.1% Increase in Revenue to US$819.5 Million from US$724.3 Million, with Record Quarterly Revenue Through 2020
  • 28.2% Expansion of Gross Profit to US$179.2 Million from US$139.8 Million, Reflecting Higher Utilization Levels and Strategic Price Increases
  • 260 Basis Point Improvement in Gross Margin to 21.9% from 19.3%
  • Net Earnings of NT$3.26 or US$0.12 per Basic Common Share or US$2.32 per Basic ADS Compared to Net Earnings of NT$3.55 or US$0.13 per Basic Common Share or US$2.53 per Basic ADS
  • US$55.5 Million of Full Year Free Cash Flow, with a US$146.5 Million Balance of Cash and Cash Equivalents at Year End
  • NT$2.2 Per Share Distribution Authorized by Board Pending Shareholder Approval at May 2021 AGM, as Company Continues to Build Value and Deliver a Higher Yield to Shareholders

HSINCHU, March 15, 2021 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), today reported consolidated financial results for the fourth quarter and full year ended December 31, 2020. All U.S. dollar figures cited in this press release are based on the exchange rate of NT$28.08 against US$1.00 as of December 31, 2020.

All the figures were prepared in accordance with Taiwan-International Financial Reporting Standards ("Taiwan-IFRS").

Revenue for the fourth quarter of 2020 was NT$6,310.3 million or US$224.7 million, an increase of 11.0% from NT$5,686.1 million or US$202.5 million in the third quarter of 2020 and an increase of 13.3% from NT$5,571.5 million or US$198.4 million for the same period in 2019.  Revenue for the fiscal year ended December 31, 2020 was NT$23,011.4 million or US$819.5 million, an increase of 13.1% from NT$20,337.9 million or US$724.3 million for the fiscal year ended December 31, 2019. 

Net non-operating expenses in fourth quarter of 2020 was NT$277.6 million or US$9.9 million, compared to NT$178.5 million or US$6.4 million in the third quarter of 2020. The increase compared to the third quarter of 2020 is mainly due to an increase of the share of loss of associates accounted for using equity method and foreign exchange loss, combined with a higher foreign exchange loss against the U.S. dollar.  Net non-operating expenses in fourth quarter of 2019 was NT$224.7 million or US$8.0 million. Net non-operating expenses of the Company for the fiscal year ended December 31, 2020 was NT$593.1 million or US$21.1 million, compared to net non-operating income of NT$573.2 million or US$20.4 million for the fiscal year ended December 31, 2019. The decline in 2020 compared to 2019 is mainly due to a decrease of the gain on disposal of investment accounted for using equity method and a higher foreign exchange loss.  

Net profit attributable to equity holders of the Company for the fourth quarter of 2020 was NT$686.4 million or US$24.4 million, and NT$0.94 or US$0.03 per basic common share, as compared to NT$423.4 million or US$15.1 million, and NT$0.58 or US$0.02 per basic common share in the third quarter of 2020.  This compares to NT$530.0 million or US$18.9 million, and NT$0.73 or US$0.03 per basic common share in the fourth quarter of 2019.  Net earnings for the fourth quarter of 2020 were US$0.67 per basic ADS, compared to US$0.41 per basic ADS for the third quarter of 2020 and US$0.52 per basic ADS in the fourth quarter of 2019.  Net profit attributable to equity holders of the Company for the fiscal year ended December 31, 2020 was NT$2,367.5 million or US$84.3 million, and NT$3.26 or US$0.12 per basic common share, compared to net profit attributable to equity holders of the Company for the fiscal year ended December 31, 2019 was NT$2,584.2 million or US$92.0 million, and NT$3.55 or US$0.13 per basic common share. Net earnings for the fiscal year ended December 31, 2020 were US$2.32 per basic ADS, compared to US$2.53 per basic ADS for the fiscal year ended December 31, 2019.  The decline primarily reflects a one-time gain of NT$982 million recognized in 2019 on the disposal of investment accounted for using equity method, the increase of foreign exchange loss of NT$200 million, income tax expense of NT$159.7 million, was which was partially offset by the increase of gross profit of NT$1,106.1 million.

Free cash flow for the fiscal year ended December 31, 2020 was NT$1,558.9 million or US$55.5 million, with a balance of cash and cash equivalents was NT$4,113.7 million or US$146.5 million.

Fourth Quarter and Full Year 2020 Investor Conference Call / Webcast Details

Date: Tuesday, March 16, 2021
Time: 3:00PM Taiwan (3:00AM New York)
Dial-In: +886-2-21928016
Password: 723607 #
Webcast of Live Call and Replay: https://www.chipmos.com/chinese/ir/info2.aspx
Replay Starting 2 Hours After Live Call Ends
Language: Mandarin

Note: An English translation audio and transcript will be made available on the Company’s website following the Mandarin conference call to help ensure transparency, and to facilitate a better understanding of its financial results and operating environment.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors, including the potential impact of COVID-19. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the "SEC") and in the Company’s other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

 

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

 

Related Links :

https://www.chipmos.com

PR Newswire

FORESEE Automotive eMMCs from Longsys Enhance Driver Assistance System Safety

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SHENZHEN, China, March 5, 2021 — Since the beginning of 2021, FORESEE brand from Longsys has launched industrial eMMCs, industrial wide-temperature eMMCs, and automotive eMMCs products that can meet the storage stability requirement of automobiles and perform ideally in ADAS.

In general, the advantages of FORESEE automotive eMMCs are their stability and safety. With their unique device status monitoring system, automotive eMMCs can greatly simplify host operations and also ensure that the host can use standard commands to check the operational status and lifetime of memory devices at any time. In this way, automotive eMMCs can continually monitor storage status, provide early warnings for any issues, and perform maintenance in a timely manner. This protects the device and the internal data, and improves the overall stability of the device. eMMCs are secure in that they are designed to operate in harsh environments. Industrial eMMCs can operate at temperatures between -25°C and -85°C. Industrial eMMCs, industrial wide-temperature eMMCs, and automotive eMMCs can even operate at temperatures ranging from -40°C to -85°C. FORESEE industrial eMMCs and automotive eMMCs also perform well in extreme or harsh environments such as those subject to static electricity and electromagnetic interference.

In addition to extensive applications in ADAS, the high-standard performance of industrial and FORESEE automotive eMMCs allow for them to be widely used in automotive, industrial, and commercial electronics, including: automotive central control, in-vehicle communication and smart home systems, industrial control platforms, medical electronics, and durable home appliances.

As a strong guarantee of automobile safety, ADAS quality must be second-to-none. Memory devices that affect ADAS stability must be tested under harsh environments. Only after ensuring that memory devices are both secure and reliable can they be installed in ADAS. Longsys FORESEE maintains high product standards in this regard and utilizes its ingenuity and technical prowess to produce highly reliable storage products. FORESEE will continue to keep up with the trends of the times and launch new products, all while maintaining excellent product quality. FORESEE will continue to help global customers seize opportunities with its innovative and high-quality products.

 

PR Newswire

Macronix Provides Advanced Ultra-High-Performance OctaBus Flash Memory to STMicroelectronics’ Latest STM32 Microcontrollers

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512-Mbit OctaBus Memory Enables Fast Response Time, Easy Software Updates in ST’s New STM32H72x/73x, STM32L5 and STM32U5 MCU Discovery Kits, Evaluation Boards

HSINCHU, March 3, 2021 — Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the non-volatile memory (NVM) market, today announced that STMicroelectronics (ST) is using Macronix OctaBus™ flash memory for several STM32 microcontroller (MCU) platforms, including the STM32H72x/73x, STM32L5 and the recently announced STM32U5. Macronix’s MX25 OctaBus family is providing the high-performance memory on select STM32 Discovery Kits and Evaluation Boards.

"Finding an external memory solution that allows our STM32 devices to demonstrate the full range of their exceptional performance and features is key to the success of our industry-leading family of MCUs," said Daniel Colonna, marketing director, Microcontroller Division, STMicroelectronics. "By helping developers exploit the full capabilities of the STM32 MCUs, Macronix, with its OctaBus non-volatile memories, is a member of the ST Partner Program and a contributor to the extensive STM32 ecosystem."

"We’re pleased to continue our valuable partnership with STMicroelectronics and to deliver innovative solutions that unleash the exceptional performance of the wide STM32 offering," said F.L. Ni, vice president of marketing at Macronix. "STM32 family is designed to cover the full spectrum of performance, high memory integration and power savings for smart, connected products."

The highly advanced STM32 devices embed up to two Octal SPI ports supporting the OctaBus interface, which comprises Macronix’s octaflash 8 I/O NOR and OctaRAM™ memories. OctaBus memory devices have been designed to meet current and emerging trends of demanding applications that require extremely high performance, reliability and an enhanced user experience.

The MX25LM/UM OctaBus memories meet the growing demand for "instant-on" performance and real-time system responsiveness for external memories in automotive, industrial and consumer applications. The ultra-high-performance OctaBus memory products can perform up to an operational frequency of 250MHz with 500MB/s read throughput, which is the industry’s fastest. The OctaBus memory devices enable system architects to meet customers’ demanding expectations for systems with a rich graphical user interface and achieve ultra-fast response times.

The MX25LW/UW OctaBus memory family has exceptional features for efficient management of over-the-air (OTA) software updates and data logging. Those features of the MX25LW/UW family are also a natural extension as execute-in-place (XIP) memory for STM32 MCUs. OctaBus memory offered in densities up to 2Gb can support the most advanced graphical user interfaces.

The STM32 family of 32-bit microcontrollers, based on the Arm® Cortex®-M processor, is designed to offer new degrees of freedom to MCU users. It offers products combining very high performance, real-time capabilities, digital signal processing, low-power / low-voltage operation, and connectivity, while maintaining full integration and ease of development.

About Macronix

Macronix, a leading integrated device manufacturer in the non-volatile memory (NVM) market, provides a full range of NOR Flash, NAND Flash, and ROM products. With its world-class R&D and manufacturing capability, Macronix continues to deliver high-quality, innovative and performance-driven products to its customers in the consumer, communication, computing, automotive, networking and other market segments. Find out more at www.macronix.com.

OctaBus and OctaRam are trademarks of Macronix International Co., Ltd.

Related Links :

http://www.macronix.com/

PR Newswire

Innodisk Announces New Industrial-Grade Products For Embedded World 2021

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TAIPEI, Feb. 26, 2021 — Innodisk is proud to announce multiple new products coinciding with Embedded World 2021, to be held from 1 – 5 March 2021. As a leading global provider of industrial-grade flash, DRAM, and embedded peripherals, Innodisk has strived to maintain its unrelenting pace of innovation in the face of the past year’s pandemic challenges.

Innodisk Announces New Industrial-Grade Products For Embedded World 2021
Innodisk Announces New Industrial-Grade Products For Embedded World 2021

 

Kicking off this year of the Ox on a high note, Innodisk is announcing new PCIe Gen 4 NVMe flash storage, DDR4-3200 DRAM, and CANbus & LAN modules.

PCIe Gen 4 NVMe — Twice The Transfer

Innodisk’s NVMe flash storage series now supports the latest PCIe Gen 4 interface with a staggering 7.88 GB/s transfer rate—double the bandwidth of Gen 3—that simultaneously lowers overall power consumption, reducing the overheating issues of many PCIe SSDs. Smart temperature control through thermal throttling firmware technology is convenient for users to monitor temperature changes of SSDs at any time, and protect data with higher performance.

Featuring end-to-end data protection, including iData Guard, iPower Guard, and iCell technologies, Innodisk’s NVMe series provides exceptional flexibility and data security. Further enhanced by TCG Opal 2.0 compliance and AES-256 military-grade encryption, data is secure with Innodisk’s NVMe series flash storage solutions in various applications.

NVMe flash storage is available in M.2 2242, M.2 2280, CFexpress, 2.5" U.2, and NanoSSD form factors with up to 8 TB storage capacity.

DDR4-3200 — Industrial-Grade DRAM

Innodisk’s DDR4-3200 DRAM module lineup provides technology leaders with the performance and features necessary to capitalize on the future of computing. The development of 5G, edge computing, and the Internet of Things (IoT) has fueled the exponential growth of connected devices as more data is generated and processed at the edge.

Innodisk’s DDR4-3200 industrial DRAM modules provide the robustness necessary for computers at the edge that require the fastest speeds, wide-range temperature tolerance, and environmental protection. The DRAM modules feature anti-sulfuration, side fill, and conformal coating. They are available in 4 GB, 8 GB, and 16 GB capacities across SODIMM, UDIMM, and RDIMM form factors, including optional ECC.

CANbus and LAN — Embedded Expansion

CANbus is crucial for industrial automation and smart healthcare. Innodisk CANbus series products meet this increasing demand in the autonomous vehicle, automation, and medical markets. Available modules provide one or two CANbus ports, are offered in M.2 2260, M.2 2280 B-M, and mPCIe form factors, with support for USB and PCIe protocols. These combinations meet the requirements for CANbus 2.0B, J1939, and the increasingly popular CANopen.

LAN connectivity is non-negotiable, especially in applications like industrial automation and surveillance. The comprehensive range of GbE LAN modules fits any application where multiple wired network ports are needed. Industrial-grade LAN modules utilize a PCIe data connection, come with single or dual GbE RJ-45 LAN ports, and are available in mPCIe, M.2 2280 B-M, and M.2 2242 B-M form factors.

In this online-only event, Innodisk is showcasing its smart IoT technologies and solutions, including InnoOSR SSD which can quickly restore the system with one click. Innodisk’s smart transportation solutions that integrate advanced technologies from in-vehicle signaling, edge computing, and image recognition, will be presented with smart service, smart agriculture, and autonomous vehicle cases.

About Innodisk

Innodisk is a service-driven provider of flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications. With satisfied customers across a range of demanding industries, we have set ourselves apart with a commitment to exceptional products and service.

For more information about Innodisk, please visit https://www.innodisk.com

Related Links :

https://www.innodisk.com

PR Newswire

Supermicro Breakthrough Multi-Node, Multi-GPU Platform Delivers Unrivaled Energy Efficiency and Flexibility for a New Performance Standard of Video Streaming, Cloud Gaming, and Social Networking Applications

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2U 2-Node NVIDIA A100 based GPU System Sets A New Level for High-Performance, Resource-Saving, Large-Scale Data Center GPU Solutions

SAN JOSE, Calif., Feb. 24, 2021 — Super Micro Computer, Inc. (Nasdaq: SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, released details on an innovative new multi-node GPU solution unlike any existing products in the market. This multi-node system delivers up to 10% TCO savings utilizing shared power and cooling. The new 2U 2-node energy-efficient, Resource-Saving system is designed with up to 64 cores and 128 PCIe 4.0 lanes with three double-width PCIe 4.0 GPUs or six single-width PCIe GPUs at full speed per node.


"Our new 2U 2-node multi-GPU server is the perfect platform for video streaming, high-end cloud gaming, and countless social networking applications," said Charles Liang, president, and CEO of Supermicro. "With our advanced server Building Block Solutions® design, and resource-saving architecture, customer deployments will be the most energy-efficient systems available. Supermicro’s market-leading system flexibility and cost savings will deliver uninterrupted performance. We have already experienced overwhelming market interest for this unique platform from global customers." 

Powered by AMD EPYC 7002 series and next-generation processors with 64 cores and 128 PCIe 4.0 lanes per node, the thermally efficient, streamlined airflow allows sustained top performance of this dense multi-GPU system. It is ideal for multi-instance high-end cloud gaming and many other compute-intensive data center applications. Equipped with Supermicro’s advanced I/O Module (AIOM) for fast and flexible networking capabilities, the system can also process massive dataflow for demanding AI/ML applications, deep learning training, and inferencing.

The unique multi-GPU node design allows excellent serviceability, unlike existing products in the market. The two-node drawers in the 2U system can be pulled out for easy serviceability thanks to the shared power and cooling resources. This unique design and the accessibility to the GPUs lowers the cost of maintenance and upgrades for demanding GPU accelerated applications such as cloud gaming that typically require sustaining high-power usage and frequent maintenance. 

Learn more about the new system in this video.

About Super Micro Computer, Inc.

Supermicro (Nasdaq: SMCI), the leading innovator in high-performance, high-efficiency server and storage technology is a premier provider of advanced server Building Block Solutions® for Enterprise Data Center, Cloud Computing, Artificial Intelligence, and Edge Computing Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners.

Related Links :

http://www.supermicro.com

PR Newswire

Montage Technology Appointed to the Board of Directors of JEDEC

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SAN JOSE, Calif., Feb. 23, 2021 — Montage Technology, a leading IC design company, was recently appointed to the Board of Directors of JEDEC (Joint Electron Device Engineering Council, now known as the JEDEC Solid State Technology Association). Christopher Cox, Vice President of Strategic Technology at Montage Technology joined the board, which provides governance over the JEDEC committees and Task Groups.

JEDEC is the global leader in developing open standards for the microelectronics industry. The mission of JEDEC is to serve the solid state industry by creating, publishing and promoting global acceptance of standards, and by providing a forum for technical exchange on leading industry topics. The organization consists of over 300 member companies globally working in more than 100 committees and subcommittees. Today, the JEDEC standards and publications have been widely adopted in mainstream semiconductor memory circuits and similar storage devices worldwide.

The Board of Directors at JEDEC plays a critical role in preparing, reviewing and approving standards and materials to meet the ever-changing challenges and needs for global manufacturers and suppliers. Since 2004, Montage Technology has been an active contributor leading DRAM, Register and Buffer task groups and promoting the standardization of DDR technology. Currently, Montage is serving as the chair of three committees and sub committees.

"Montage is thrilled to join the Board of JEDEC. For years, our team has been actively taking the lead in JEDEC initiatives in building the memory standards," said Dr. Howard Yang, Chairman and CEO of Montage Technology, "Montage is looking forward to bringing our experience to further facilitate the development of open standards within the organization and empower global collaboration and synergy across the industries."

As the Vice President of Strategic Technology at Montage Technology, Mr. Cox oversees new technology initiatives as well as strategic planning for the company. Previously he spent over 27 years in the technology sector working for companies like Intel, 3Dfx and AMD where he worked on everything from Memory architecture to Audio BIOS design. Mr. Cox is a significant innovator who holds over 100 patents across the different countries.

For more information about JEDEC Board of Directors, please visit: https://www.jedec.org/about-jedec/board-directors

About Montage Technology

Founded in 2004, Montage Technology is a leading IC design company dedicated to providing high-performance, low-power IC solutions for cloud computing and data center markets.

For more information about Montage Technology, please visit: https://www.montage-tech.com

Related Links :

https://www.montage-tech.com/

PR Newswire

Absen Improves Meetings and Presentations Further with the New Absenicon 3.0

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SHENZHEN, China, Feb. 19, 2021 — Absen (SZSE: 300389) improves meetings and presentations further with the new Absenicon 3.0. The new Absenicon 3.0 is an all-in-one conference LED display product for meetings and presentations. This new improved version was designed to be the perfect visual solution for high-end meeting rooms, lecture halls and auditoriums in corporate, government, education and other indoor environments which require a reliable and visually stunning display for effective communication.

Absenicon 3.0
Absenicon 3.0

With a 5mm frame and shallow 28.5mm screen depth, the Absenicon 3.0 boasts a slim design and an impressive 94% screen-to-body ratio, which provides superb and virtually seamless large-format images.

With adjustable brightness levels from 0 to 350nits, the Absenicon 3.0 is perfectly adapted to open and bright spaces. Featuring a colour gamut of 110% and a contrast ratio of 5000:1, the Absenicon 3.0 is able to display detailed content with accurate and vivid colours. In addition, the 160° ultra-wide viewing angle enables attendees to benefit from enhanced meeting efficiency and productivity.

Absenicon’s all-in-one design integrates a complete control, operation and sound system, thus avoiding the need for any traditional control box and video processor. Its hidden cable design also presents a sleek and clean finish to the whole screen.

Featuring a new smart control system, operating the Absenicon 3.0 is as easy as watching TV. Its remote control allows users to easily turn the screen on and off, switch the digital channels and adjust the screen brightness and the On Screen Display menu settings.

The Absenicon 3.0 supports dual systems including the Android 8.0 and Windows 10 O.S. By scanning a QR code, people can share the content of a computer, smartphone or tablet while taking notes on these devices during a conference. The Absenicon 3.0 is able to share four screens simultaneously and present different creative ideas all at once.

Absenicon can be installed by two engineers in only as little as two hours, with two installation options available (wall mounting and mobile). The Absenicon 3.0 is front serviceable and it takes just a couple of seconds to remove a module with a special tool, making the installation and maintenance quick and convenient.

More information, please contact: Absen@absen.com.

PR Newswire

Supermicro Statement on Bloomberg’s Claims

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Supermicro reaffirms security of Supermicro products, refutes Bloomberg article

SAN JOSE, Calif., Feb. 13, 2021 — Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, strongly refutes the accuracy of information in a recent Bloomberg article.

Bloomberg’s story is a mishmash of disparate and inaccurate allegations that date back many years. It draws farfetched conclusions that once again don’t withstand scrutiny. In fact, the National Security Agency told Bloomberg again last month that it stands by its 2018 comments and the agency said of Bloomberg’s new claims that it "cannot confirm that this incident—or the subsequent response actions described—ever occurred." Despite Bloomberg’s allegations about supposed cyber or national security investigations that date back more than 10 years, Supermicro has never been contacted by the U.S. government, or by any of our partners or customers, about these alleged investigations.

Bloomberg has produced no conclusions from these alleged investigations. Nor could Bloomberg confirm to us if any alleged investigation was even ongoing. To the contrary, several of the U.S. government agencies Bloomberg claims had initiated investigations continue to use our products and have done so for years.

Because we recognize that security threats are constantly evolving, we are vigilant and address issues as soon as we become aware of them. For example, many years ago, an Intel employee raised a question that we were not able to verify, but out of an abundance of caution, we promptly took steps to address.  We have always valued our close partnership with Intel, which has always been strong. Furthermore, the update site referenced in the Bloomberg article have been long retired in favor of newer, secure (HTTPS) technology. Finally, the cyber incidents we disclosed in 2019 were investigated, remediated, and determined not to affect our business, our products, or our operations.

Unfortunately, Bloomberg continues to attempt to revive its false and widely discredited 2018 story. In response to those allegations, we have never found any malicious chips, even after engaging a third-party security firm to conduct an independent investigation on our products.  

In addition, we have never been informed by any customer or government agency that such chips have ever been found. In 2018, several public and private sector officials rebutted the story on the record. Then-Secretary of the Department of Homeland Security Kirstjen Nielsen said we "do not have any evidence that supports the article," then-Director of National Intelligence Dan Coats stated "we’ve seen no evidence" of manipulation of Supermicro products, Federal Bureau of Investigation Director Christopher Wray warned officials to "be careful what you read" about the 2018 Bloomberg claims, and Apple CEO Tim Cook said "it is 100 percent a lie, there is no truth to it" and urged Bloomberg to "do the right thing" and "retract their story." The NSA said at the time it was "befuddled" by Bloomberg’s report and was unable to corroborate it.

Supermicro is an American success story, founded and headquartered in San Jose, Calif., in 1993. The quality, security, and integrity of our products is our top priority, and we constantly implement new and improved security features and processes in our business, we investigate security issues that are brought to our attention and we work to remediate any issues.

About Super Micro Computer, Inc.

Supermicro (Nasdaq: SMCI), the leading innovator in high-performance, high-efficiency server and storage technology is a premier provider of advanced server Building Block Solutions® for Enterprise Data Center, Cloud Computing, Artificial Intelligence, and Edge Computing Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners. Supermicro, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners.

Media Contact:
Greg Kaufman
Super Micro Computer, Inc.
PR@supermicro.com

Related Links :

http://www.supermicro.com

PR Newswire

Luokung Technology Corp. Announces $5.0 Million Registered Direct Placement

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BEIJING, Feb. 5, 2021 — Luokung Technology Corp. (the "Company" or "Luokung") (NASDAQ: LKCO), today announced that it has entered into a securities purchase agreement with certain institutional investors for a registered direct offering of $5.0 million of ordinary shares at a price of $0.52 per share. The Company will issue a total of 9,615,387 ordinary shares to the institutional investors. As part of the transaction, the Company will also issue to the investors warrants ("Warrants") for the purchase of up to 4,807,694 ordinary shares at an exercise price of $0.68 per share, which Warrants will have a term of three years from the date of issuance. 

The net proceeds from this offering will be used for working capital and general corporate purposes. The offering is expected to close on or about February 9, 2021, subject to the satisfaction of customary closing conditions.

FT Global Capital, Inc. acted as the exclusive placement agent for the transaction.

These securities are being offered through a prospectus supplement pursuant to the Company’s effective shelf registration statement and base prospectus contained therein. A shelf registration statement (SEC Filing No. 333-233108) relating to these securities has been filed with and declared effective by the Securities and Exchange Commission (the "SEC") on August 16, 2019. A prospectus supplement related to the offering will be filed with the SEC. This press release does not constitute an offer to sell or the solicitation of an offer to buy, and these securities cannot be sold in any state in which this offer, solicitation, or sale would be unlawful prior to registration or qualification under the securities laws of any such state. Any offer will be made only by means of a prospectus, including a prospectus supplement, forming a part of the effective registration statement.

For further details of this transaction, please see the Form 6-K to be filed with the SEC.

About Luokung Technology Corp.

Luokung Technology Corp. is one of the global leading spatial-temporal big-data processing technology companies and a leading interactive location-based services company in China. The core business brands of the Company are "Luokuang" and "Superengine". The Company mainly provides spatial temporal big data PaaS, SaaS and DaaS intelligent services based on its self-developed patented technology which can be applied in Mobile Internet LBS, Internet Travelling, Intelligent Transportation, Automatic Drive, Smart City, Intelligent IoT, Natural Resources Exploration and Monitoring and so on. These services are integrated intelligent computing and application services for spatial temporal data which including but not limited to Satellite and UAV Remote Sensing Image Data, HD Map, 2D and 3D Internet Map, Real-time Trajectory, IoT Industrial Stream Data. For more information, please go to http://www.luokung.com.

Safe Harbor Statement 

This press release contains certain statements that may include "forward-looking statements." All statements other than statements of historical fact included herein are "forward-looking statements." These forward-looking statements are often identified by the use of forward-looking terminology such as "believes," "expects" or similar expressions, involving known and unknown risks and uncertainties. Although the Company believes that the expectations reflected in these forward-looking statements are reasonable, they do involve assumptions, risks and uncertainties, and these expectations may prove to be incorrect. You should not place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company’s actual results could differ materially from those anticipated in these forward-looking statements as a result of a variety of factors, including the risk factors discussed in the Company’s periodic reports that are filed with the Securities and Exchange Commission and available on the SEC’s website (http://www.sec.gov). All forward-looking statements attributable to the Company or persons acting on its behalf are expressly qualified in their entirety by these risk factors. Other than as required under the applicable securities laws, the Company does not assume a duty to update these forward-looking statements.

CONTACT:

The Company:

Mr. Jay Yu
Chief Financial Officer
Tel: +86-10-5327-4727
Email: ir@luokung.com

INVESTOR RELATIONS

PureRock Communications Limited
Email: luokung@pure-rock.com

Related Links :

http://www.luokung.com

PR Newswire

DFI Joins Hands with German ACL to Develop Substantial Business Opportunities in the Smart Medical Market

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TAIPEI, Feb. 5, 2021 — DFI, a leading industrial computer manufacturer, has entered a strategic alliance with ACL, a well-known German medical IT hardware manufacturer, and will combine with DFI’s 40 years of rich experience in industrial computers. ACL has been famous in the medical personal computer market since 1995. With profound expertise in medical IT hardware for ICU/IMC and digital operating rooms, both will join hands to open up tremendous business opportunities in the smart healthcare market.

With over 25 years of "Made in Germany" quality, ACL’s rugged and durable medical computer products are widely used in 29 out of the 37 university hospitals in Germany and deployed in many well-known medical institutions in Europe. ACL also manufactures medical-related products for many world-renowned brands such as Dräger, Olympus, eSATURNUS (Sony Group), ATMOS, XION, Cascination, Zimmer Biomet, Humanscale, and HT Group. In the initial stage, DFI will support ACL in selling their medical product portfolio in America and APAC. 

"DFI and ACL, the leaders in the smart medical market, are cooperating to create smart healthcare solutions. It is hoped that these high-quality products will open up endless business opportunities and help the medical system overcome the difficult challenges brought about by an aging society," said Steven Tsai, DFI’s President.

"For seven years, we have worked together with DFI. This strategic partnership can help us to get the latest technologies from Taiwan and faster integration into our custom-made products to the medical field," said Thomas Wollesky, ACL’s CEO.

The medical and health industry is entering a critical period of digital transformation. The alliance between DFI and ACL hopes to make an effort to improve the quality of healthcare in an aging society.

About DFI

Founded in 1981, DFI is a leading global provider of high-performance computing technology across multiple embedded industries. Smart medical applications are critical to medical quality will also be a new field where DFI will bring more contributions to an aging society.

About ACL

ACL has been manufacturing specialized IT hardware solutions for medicine and hygienically critical areas such as digital operating rooms, digitalization in intensive care units, telemedicine, and mobile solutions at its headquarters in Leipzig, Germany since 1995. Faultless and durable products are both an incentive and obligation for all ACL employees.