Tag Archives: HRD

Equipped with Huawei’s Tech, Bank of Communications Wins The Asian Banker’s Award of Best Big Data Implementation in China

BEIJING, Aug. 26, 2022 /PRNewswire/ — The Asian Banker, an authoritative global platform for insights about the finance industry, has unveiled the winner list for its 2022 Financial Technology Awards at Finance China 2022. Bank of Communications (BOC) won the Best Big Data Implementation award for its Lakehouse DaaS built using Huawei Cloud FusionInsight intelligent data lake.


BOC’s business has grown rapidly over the past few years. The bank has expanded the number of business lines and has rendered its business processes more diversified, convenient, and intelligent. As a result, it’s generating an unprecedented amount of data and using it for complex applications. To cope with all this data, BOC has built an intelligent data lake — Lakehouse DaaS — upon Huawei Cloud FusionInsight MRS cloud-native data lake and Huawei Cloud GaussDB(DWS) data warehouse.

Powered by the GaussDB(DWS) distributed data warehouse, BOC has enhanced its access to data, reducing the cost of using data while improving efficiency and quality. BOC has also built a high-quality and centralized dashboard for comprehensive data analysis, which supports the bank’s operational decision-making and helps maximize the value of data.

The FusionInsight MRS real-time data lake has helped BOC develop new technical capabilities, such as real-time collection and computing, and batch-stream convergence. The bank has also deployed real-time collection, computing, analysis, and consumption data flows, supporting various real-time and quasi-real-time business scenarios.

Since launching the intelligent data lake, BOC has made big leaps in several fields.

  • Marketing: Create user personas based on user transactions and interaction behaviors, improving the customer conversion rate by 164%.
  • Risk control: Analyze user behavior features and identify fraud behaviors in real time, reducing the number of risky cases by 52%.
  • Operations: Search and analyze banking data in real time and quickly make informed decisions.
  • Customer relationship management: Establish a customer churn warning model to track customers who are about to churn and retain them.

BOC has worked with Huawei to reconstruct its big data platform. The bank aims to speed up services related to big data and provide timely input for marketing, risk control, supervision, and operations. It also looks to centralize monitoring, enable process-based management, and visualize its data assets for data governance. Ultimately, BOC wants to make sure that its data is working for its business, helping it become a fully digital bank.

To date, Huawei has served over 2000 financial customers from more than 60 countries and regions, including 49 of the world’s top 100 banks. Huawei Cloud FusionInsight is often used in core data analysis platforms by banks, securities, insurance, and other types of financial customers. The solution helps them build a platform where data and AI converge.

Looking ahead, Huawei will continue offering customers high-value analytical capabilities to maximize the value of their data through FinTech innovation.

Huawei and Bank of China Jointly Win The Asian Banker’s Award of Best Bank Infrastructure Technology Implementation in China

BEIJING, Aug. 26, 2022 /PRNewswire/ — The “Finance China 2022” event organized by the prestigious international finance magazine The Asian Banker successfully commenced in Beijing on the 25th of August. Huawei and the Bank of China jointly won the Best Bank Infrastructure Technology Implementation in China in the category of Financial Technology Awards.

Huawei has shaped many innovative technological solutions by using its innovative ICT technologies and capacities and orchestrated cross-domain collaboration among technologies, helping financial institutions enhance their operational resilience and provide optimal user experience.

  • NoF+ is an Ethernet-enabled lossless storage network solution that applies NVMe, a high-speed read/write protocol dedicated to flash memory and IP networks. Customers can use this technology to build intelligent and lossless networks that sense network faults and facilitate cross-domain coordination. This solution will significantly increase the IOPS throughput performance compared to Fibre Channel (FC) networks.
  • Replacing FC with NoF+ significantly reduces data read and write latency within data centers. In addition, data can be transmitted without loss across data centers and over long distances thanks to the iLossless algorithm.
  • This solution can help networks proactively sense link status and fast switch storage algorithms in order to reduce the impact of network jitter on financial transactions, and reduce link switching time from minutes to seconds in case of failed transmissions.

Dr. Margaret Hu, President of Marketing and Solution Sales, Huawei Global Digital Finance said, “We thank The Asian Banker for honoring us this significant award. Huawei will continue working with financial institutions and partners to conduct joint innovation and open collaboration. We will build innovative digital infrastructure that helps financial services grow and innovate. Our joint efforts will accelerate the financial industry’s digital transformation.”

To date, Huawei has served more than 2,000 financial customers in more than 60 countries and regions around the world, including 49 of the world’s Top 100 banks. Learn more about Huawei’s digital finance solutions:

https://e.huawei.com/en/solutions/industries/smart-finance

GIGABYTE Holds Global Campaign “AERO 16 Relay Challenge” Featuring Color Accurate Laptops For Creators

TAIPEI, Aug. 18, 2022 /PRNewswire/ — GIGABYTE, the world’s leading computer brand, wowed the creator community with its completely re-designed AERO series laptops since their launch earlier this year. Above all, the AERO 16 creator laptop is particularly designed with graphic designers, video editors, and photographers in mind, delivering X-Rite™ certified and Pantone® validated (Delta E<1) color accuracy. Combined with the Super Narrow Bezel 4K+ OLED display and VESA-certified DisplayHDR™ 500 True Black, the AERO 16 laptop brings true-to-life colors that make creators’ inspirations come alive.

GIGABYTE Holds Global Campaign “AERO 16 Relay Challenge” Featuring Color Accurate Laptops For Creators
GIGABYTE Holds Global Campaign “AERO 16 Relay Challenge” Featuring Color Accurate Laptops For Creators

To share such a creative edge, GIGABYTE is inviting the whole community to join AERO 16 Relay Challenge and pass on the joy of color and creation on social platforms. The campaign is led off with the Color Relay Challenge. Starting from August 10, participants are invited to apply the AERO 16-themed Instagram AR filter and complete the tasks for a chance to win awesome prizes.

The campaign will be later succeeded by the Creativity Relay Challenge. GIGABYTE will be teaming up with several world-renowned content creators, including Asia Ladowska, Carles Dalmau, Elenamics, Elliot Ulm and Li Cambon. These creative talents will be split into two, as each team will create a piece of art in a relay format based on the subjects of realness and freedom. Each talent will be using the AERO 16 laptop and let their creativity fly thanks to its powerful performance and perfect color accuracy. Starting from August 23, everyone can visit Official Facebook Page and vote for their favorite artwork for a chance to win a custom AERO 16 laptop featuring the winning design.

For more information about the campaign, please visit https://bit.ly/GIGABYTE-AERO16-Laptop-Relay-Challenge

Innodisk Announces Launch of Edge AI SSDs


TAIPEI, July 29, 2022 /PRNewswire/ — Innodisk, a global leader in industrial-grade storage and embedded peripherals, is pushing the development of edge AI technology, and in doing so has officially launched a new edge computing solid-state drive (SSD) product line, consisting of the 2.5″ SATA 3TS6-P, 3TS9-P and M.2 (P80) 4TS2-P drives. Innodisk’s new edge AI SSDs feature low latency, high DWPD (drive writes per day), and large capacities. In addition, the included iCell and AES technologies protect data from losses and breaches. Aiming at smart retail, smart city, smart fleet management, and NAS network storage applications, Innodisk is providing high speeds, reliability, and industrial-grade high quality to respond to the rising market needs.

Research suggests that the edge data center market is expected to reach a compound annual growth rate of 24.58% between 2020 and 2028. With the rapid development of AI, IoT, and 5G, data utilization has shifted from cloud to edge applications, driving the demand for edge servers and edge data centers. Innodisk is ready to roll out edge server market solutions and open up new business opportunities.

Edge AI SSDs inside edge servers are required to process data at high speeds at the source, instead of sending all data back to a central data center, thus improving latency and reducing cost. As an example, smart street lights and traffic monitoring units rely on the SSD to provide high-speed read/write, a large capacity, and low-latency to process data in real time, and the same can be said for edge data centers. With the series reaching 6.4TB, these new SSDs are sure to disrupt the edge storage market and improve experiences for end users.

CC Wu, GM of Innodisk’s Flash Division, pointed out that Innodisk has already actively started focusing on applications for the fast-growing 5G and AI fields. This new product line integrates Innodisk’s R&D capabilities in software, hardware, and firmware. With the introduction of specialized SSDs that combine the advantages of industrial SSDs with the characteristics of data center SSDs, Innodisk hopes to seize edge computing business opportunities and meet the needs of the ever-growing sector.

About Innodisk

Innodisk is a service-driven provider of flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications. For more information about Innodisk, please visit https://www.innodisk.com

VVDN Inks Contract with C-DAC to Manufacture India’s first indigenously designed HPC server


GURUGRAM, India, July 28, 2022 /PRNewswire/ — VVDN Technologies, a global provider of engineering, manufacturing and digital services and solutions, today announced that it has signed a contract with Centre for Development of Advanced Computing (C-DAC), a premier R&D organization of the Ministry of Electronics and Information Technology (MeitY), for manufacturing of India’s first indigenously designed High Performance Computing (HPC) servers ‘RUDRA,’ in presence of the Hon’ble MeitY Secretary, Shri Alkesh Kumar Sharma.

The ‘RUDRA’ HPC servers, designed by C-DAC, will be manufactured by VVDN under National Supercomputing Mission and is planned to be used in C-DAC’s ‘PARAM’ series of Supercomputers. A wide spectrum of sectors, including High Performance Computing (HPC) systems, hyperscale data centres, edge computing, banking & commerce, manufacturing, oil & gas industry and healthcare, can benefit from the indigenously-built server.

VVDN has established a complete manufacturing set up with SMT lines capable of handling board sizes up to 850 mm x 560 mm. The company also has a big mechanical infrastructure with tooling and injection molding, sheet metal fabrication, dedicated assembly lines, robust testing, validation and reliability set up. VVDN comes with expertise in doing the design, development and manufacturing of servers such as rack storage servers, communication servers, etc. While working in the datacenter space, VVDN has its own IPs for OvS and SSL for network compute.

Recently, VVDN was approved under PLI scheme for IT Hardware which includes the manufacturing of server, laptops, tablets, all-in-one desktops, etc. VVDN has also been approved under 3 other PLIs by the Govt. of India in the space of Telecom and Networking equipment manufacturing, White Goods manufacturing and Automobile and Auto components manufacturing.

Nitin Jain, VP-Business Development 5G & Datacenter, India and EMEA, VVDN Technologies said, ” It is a matter of great pride for VVDN to do the manufacturing of RUDRA 1U and 2U HPC servers – India’s first ever indigenous designed server for C-DAC. VVDN is deeply committed to doing server manufacturing in India and has set up best-in-class infrastructure to do end-to-end manufacturing including PCBA, mechanical – sheet metal fabrication, testing & validation as well as certification. This collaboration with C-DAC is the testimony of the advancement towards strengthening Indian research and development by doing indigenous design, development, manufacturing and deployment of cost-effective servers which can be called as DESIGN and MAKE in INDIA.”

About VVDN Technologies

VVDN is a Product Engineering & Manufacturing company focused on designing & manufacturing end-to-end products across several technology vertical markets (5G, Data Center, Vision, Networking and Wi-Fi, IoT, Cloud & Apps). VVDN’s India HQ is located at Gurgaon, India and its North America HQ’s is located in Fremont, CA, USA. VVDN serves global customers across several regions including US, Canada, Europe, India, Vietnam, Korea, and Japan. VVDN has 10 advanced Product Engineering Centers in India, which are fully equipped to design & test the complete hardware & software required to develop a complete product or solution. VVDN’s 6 Manufacturing facilities are located at Manesar, Gurgaon, India which includes in-house best-in-class SMT Factory, Molding & Tooling Factory, Die Casting, Sheet Metal Fabrication, Product Assembly Factory, and Product Certifications labs. VVDN’s Engineering & Manufacturing facilities are fully complied to develop & manufacture Enterprise, Consumer, Industrial, and Automotive-grade products.

Visit www.vvdntech.com for more information.

ORICO Launches High-Performing Portable SSD Inspired by Mondrian

The bold design encases an ultra-high performing solid-state drive that can achieve up to a 3,126MB/s reading speed

SHENZHEN, China, July 26, 2022 /PRNewswire/ — ORICOShenzhen-based innovative enterprise focusing on high-performance solutions for USB data transmission and charging – is proud to unveil the ORICO USB4 High Speed Portable SSD Montage 40Gbps series, with a striking and durable design inspired Dutch painter Piet Mondrian.


The bold and bright aesthetic draws from Mondrian’s famous work Composition with Red, Blue and Yellow, incorporating the thick black lines and blocks of color that immediately distinguish the device from the monochrome alternatives on the market. Loud, but not lurid, the design is applied with the durable in-mold labeling technique also found in automobile manufacturing for its resistance to corrosion.

However, the product engineers at ORICO do not pursue form over function and have invested in the right technology to make the Montage 40Gbps series one of the best-performing SSDs available. During performance testing, the drive achieved 3,126MB/s reading speed, a 2,832MB/s writing speed, and transferred 3GB files in just one second, matching, and even surpassing, many leading products currently on the market.

Accompanied by a versatile 2-in-1 data cable for USB type A and type C connections, the drive is widely compatible and able to be used with Mac OS, Windows, Android, and Linux operating systems without requiring a driver. Depending on user requirements, the Montage series offers capacity options ranging from 512GB to 2TB.

“We are so excited to launch the eye-catching Montage series, serving superior performance and carrying a timeless aesthetic that really transcends style trends,” commented Xu Yeyou, CEO of ORICO. “We had in mind on-the-go creatives, such as photographers and video editors, when designing the product.”

About ORICO

Shenzhen ORICO Technologies Co., Ltd. was established in 2009, and its brand ORICO is an innovative national high-tech enterprise focusing on USB data transmission and USB charging technology.

To learn more about the ORICO SSD Montage 40Gbps Series, click here.

Connect with ORICO

Website | Youtube | Instagram | Twitter | Facebook | LinkedIn | Amazon

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S2C Shines at DAC 2022 with its New Prodigy Player Pro-7 Prototyping Software, Multi-FPGA Prototype Hardware Platforms, and Complete Prototyping Solutions

Stand-Out Veteran Provider of FPGA Prototyping Solutions

SAN JOSE, Calif., July 23, 2022 /PRNewswire/ — The 59th Design Automation Conference returned to San Francisco’s Moscone Center this year to notch almost six decades of week-long immersion in EDA technology and market trends, combining keynote presentations by industry luminaries with the “DAC Engineering Track” technical presentations and the EDA tool-provider exhibits for in-person exchanges of EDA user-needs and the latest EDA solutions.  Attendance by exhibitors, and EDA tool end-users alike, was noticeably improved from last year’s conference but still below pre-COVID levels.  The Moscone Center neighborhood provided a less than inviting convention venue as San Francisco recovers from COVID’s decimation of the convention-generated commerce around the Center marred by heavily littered streets, a very noticeable presence of “street people”, and the closure of many name-brand businesses that are normally sustained by the “collateral business” generated by convention attendees.

Despite the lower DAC attendance, S2C saw a marked improvement in the quantity and quality of visitors to the S2C booth.  S2C highlighted its latest hardware and software and provided interactive demonstrations of its Prodigy MDM Pro multi-FPGA debug tools and its Prodigy ProtoBridge high-throughput channel for the transfer of large amounts of transaction-level data between the FPGA prototype and a host computer – both demonstrations running on S2C’s Quad Logic System prototyping hardware featuring Intel’s massive Stratix GX 10M FPGAs.

S2C took the opportunity at DAC to roll out its newest version of its prototyping software Prodigy Player Pro-7.  The new software suite includes Player Pro-RunTime, for prototype platform control and hardware test; Player Pro-CompileTime, with enhanced automation of multi-FPGA partitioning and pre/post-partition timing analysis; and Player Pro-DebugTime, for multi-FPGA debug probing and trace viewing with S2C’s class-leading MDM Pro debug tools.

With an emphasis on large-scale SoC design prototyping, Player Pro-7 offers enhanced support for multi-FPGA implementations, including:

  • RTL Partitioning and Module Replication to support Parallel Design Compilation and reduce Time-to-Implementation
  • Pre/Post-Partition System-Level Timing Analysis for Increased Prototyping Productivity
  • SerDes TDM Mode for Optimal Multi-FPGA Partition Interconnect and Higher Prototype Performance

S2C displayed a number of its latest prototyping products in its DAC booth this year, including the Prodigy Logic System 10M based on the industry’s largest FPGA, Intel’s Stratix 10 GX 10M. Also on display were S2C’s Xilinx-based prototyping hardware, the Prodigy S7-19P Logic System, and the S7-9P Logic System, both getting their fair share of DAC attendee attention.

The highlight of the S2C booth was the new Prodigy Logic Matrix LX2.  Based on Xilinx’s largest Virtex Ultrascale+ FPGA, the LX2 boasts eight VU19P;for expansion beyond eight FPGAs, up to eight LX2s can be housed in a single standard server rack, extending prototyping gate-capacity up to sixty-four VU19P FPGAs. For expansion beyond eight FPGAs, the LX2 architecture is designed for prototyping with up to eight LX2’s in a single standard server rack, extending prototyping gate-capacity up to sixty-four VU19P FPGAs.  At this level of FPGA prototyping density, hardware quality and reliability become first-order considerations, and S2C’s 18+ year proven track record of delivering high-quality prototyping hardware sets a high bar for other prototyping solutions.

To enable users to configure prototyping platforms quickly and reliably, S2C displayed a sampling of its Prototype Ready IP in the booth.  Prototype Ready IP are off-the-shelf daughter cards designed by S2C to plug-and-play with S2C prototyping hardware platforms.  The daughter cards are designed to attach reliably to the FPGA prototype hardware and compose a rich collection of prototyping functions, including High-Speed GT Peripherals (Ethernet, PCIe, MIPI, SATA, high-performance cables, etc.), General Peripherals (GPIO, USB, mini-SAS, JTAG, RS232, etc.), Memory Modules (EMMC, DDR, SRAM, etc.), ARM Processor Interface Modules, Embedded and Multimedia modules (DVI, HDMI, MIPI, etc.), and Expansion and Accessories modules (FMC-HPC Converters, Level Shifters, I/O Test Modules, DDR Memory Modules for user-supplied external memory, Interconnect Cables, Clock Modules, etc.).

The Prodigy MDM Pro demonstrations at the booth showcased the implementation of S2C’s multi-FPGA debug tools for prototyping with a combination of external hardware, soft IP implemented in the FPGA, high-speed FPGA I/O, and debug configuration software (Player Pro-DebugTime)MDM Pro was designed specifically to support multi-FPGA prototype implementations – with support for high probe-counts, deep-trace debug data storage, optimization of debugging reconfiguration compiles, and with the ability to choose debug configuration tradeoffs to optimize prototype performance.  The Player Pro-DebugTime software supports user-friendly debug configuration, complex trace-data capture triggering, and single-window viewing on the user console of simultaneous streams of trace-data from multiple FPGAs.  MDM Pro hardware supports high-performance deep-trace debug data storage without consuming internal FPGA storage resources.

S2C also demonstrated its Prodigy ProtoBridge in the DAC booth to showcase its off-the-shelf solution for a high-throughput channel (4GB/second) between the FPGA prototype and a host computer for the application of large amounts of transaction-level test data to the FPGA prototype – such as processor bus transactions, video data streams, communications channel transactions, etc.  ProtoBridge uses a PCI-to-AXI interface implemented in the FPGA and connected to the user’s RTL as an AXI-4 bus.  ProtoBridge includes a set of C-API function calls to perform AXI bus transactions in the FPGA prototype, a PCIe3 driver for Linux or Windows operating systems to control Logic System operations, C-API reference operations with sample access to FPGA internal memory, and an integration guide on how to connect the user’s RTL code to the ProtoBridge AXI-4 bus module.

Overall, DAC 2022 was a successful conference for S2C, firmly establishing S2C as the leading independent FPGA prototyping supplier, with the strongest track record of delivering complete prototyping solutions worldwide.

The FPGA prototyping hardware and software displayed at DAC are available now. For more information, please contact your local S2C sales representative, or visit www.s2cinc.com

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Don’t Miss GIGABYTE’s ‘Back To School’ Deals on Laptops

TAIPEI, July 22, 2022 /PRNewswire/ — GIGABYTE, the industry-leading brand in PC components and laptops with a gaming concentration, announces fetching deals on its laptop family to celebrate the ‘Back To School’ season. Acknowledging a lightweight, portable powerhouse is doubtlessly the best companion to students on their educational journey; GIGABYTE offers discounts up to 31% on the brand’s gaming line-up as well as the content creation-focused model. Wherever the classroom is, GIGABYTE will be along. The models that will be involved in the promotion below:

GIGABYTE Announces ‘Back To School’ Deals on Laptops
GIGABYTE Announces ‘Back To School’ Deals on Laptops

For students who have strong creative pursuits but also prioritize portability and an uncompromised experience in video or 3D rendering, the AERO 15 and AERO 16 laptops are deals that cannot be missed. These award-winning models are equipped with a stunning 4K OLED panel, Intel 12th Gen H-series processor, and RTX 30 series are designed to make learning and working as smooth as possible.

Born for hardcore gamers that prefer mobility and versatility, the world’s first four-sided super-thin bezel gaming laptops, AORUS 15 and 17, are Intel 12th Gen and RTX 30 series-ready, with a 360Hz Gaming display, with the goal to build the ultimate gear for the quintessential gamers. 

For consumers that seek a balance of gaming, entertainment, and work capabilities, the GIGABYTE G5, powered by Intel 11th Gen processor and RTX 3050, is now on Bestbuy.

For more details on these great ‘Back To School’ deals, visit GIGABYTE’s BTS page: https://www.gigabyte.com/us/back-to-school.

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Axiomtek Presents New Server Grade EATX Motherboard for AIoT – IMB760


TAIPEI, July 13, 2022 /PRNewswire/ — Axiomtek – a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency – is pleased to announce the IMB760, a server-grade extended ATX motherboard (330mm x 305mm) powered by the dual LGA4189 socket 3rd Gen Intel® Xeon® scalable processors (code name: Ice Lake-SP) with the Intel® C627A chipset. It comes with an effective load balancing between two CPUs and multiple accelerator cards to stabilize computation loads and maximize computing power. Featuring optimized performance, more PCI Express Card slots, and high-density memory expansion, this EATX server motherboard enables high level computing, AI workload and deep learning for the data-fueled future.

“Performance, security, and flexibility are indispensable for AI in next-gen computing. As the first and flagship EATX motherboard of Axiomtek, the IMB760 features built-in AI and crypto acceleration functions as well as advanced security capabilities to meet the specific needs of automated manufacturing, robotics, image or video analytics, and other AIoT applications. This server-grade motherboard has sixteen DDR4-3200 RDIMM sockets with a memory capacity of up to 1TB. Ready for the demands of massive data storage and high-speed data transmission, the industrial motherboard supports two NVMe SSD, one IPMI LAN, and two 10GbE LAN ports. Rich expansions with enough PCIe x16 slots and PCIe x8 slots for GPU acceleration, making IM760 a perfect solution for computationally intensive imaging, intelligent video analytics, and heavy workload processing,” said Wayne Chung, the product manager of AIoT Team at Axiomtek.

The IMB760 offers rich expandability with four PCIe x16 slots, two PCIe x8 slots and two M.2 Key M 2280 interfaces with PCIe x4 signal, supporting GPU cards, capture cards, RAID cards, NVMe storage, and more. Eight SATA-600 ports with integrated RAID 0/1/5/10 are available for reliable data storage and protection. Featuring a wide array of I/O interfaces, the IMB760 supports six USB 3.2 Gen1, six USB 2.0, two USB 2.0 (180D Type A), one RS-232/422/485, one IPMI LAN port via Intel® Ethernet controller I210-AT, two 10GbE port (Intel® X550-AT2), one VGA, eight-channel programmable digital I/O port, SMBus, and one PS/2 keyboard. Trusted Platform Module 2.0 (TPM 2.0) is available to ensure critical information security. This server board is also coupled with Intelligent Platform Management Interface (IPMI), which allows users to remotely manage and monitor servers regardless of the installed operating system. More functions include watchdog timer and hardware monitoring for CPU/system temperature, voltage detection and smart fan control.

The server-grade EATX motherboard, IMB760, is available in August 2022 for purchase. For more product information or pricing, please visit our global website at www.axiomtek.com or contact one of our sales representatives at info@axiomtek.com.tw.

Advanced Features of IMB760

  • Dual 3rd gen Intel® Xeon® scalable processors (Ice Lake-SP)
  • 16 288-pin DDR4-3200 RDIMM for up to 1TB of memory
  • 4 PCIe x16 and 2 PCIe x8
  • Supports 2 M.2 Key M for NVMe
  • Supports TPM 2.0 (optional)
  • Supports internal USB dongle

About Axiomtek Co., Ltd

Axiomtek has experienced extraordinary growth in the past 30 years because of our people, our years of learning which resulted in our tremendous industry experience, and our desire to deliver well-rounded, easy-to-integrate solutions to our customers. These factors have influenced us to invest in a growing team of engineers including software, hardware, firmware and application engineers. For the next few decades, our success will be determined by our ability to lead with unique technologies for AIoT and serve our key markets with innovatively-designed solution packages of hardware and software – coupled with unmatched engineering and value-added services that will help lessen the challenges faced by our systems integrator, OEM and ODM customers and prospects alike. We will continue to enlist more technology partners and increase collaborations with our growing ecosystem who are leaders in their fields. With such alliances, we will create synergy and better deliver solutions, value and the expertise our customers need.

As an associate member of the Intel® Internet of Things Solutions Alliance, Axiomtek continuously develops and delivers cutting edge solutions based on the latest Intel® platforms.

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Macronix OctaBus™ Flash Memory Selected for Renesas VC4 Automotive Computing Development Platform

Macronix OctaBus MX25UW51245G NOR Flash Provides Boot Memory to Renesas R-CAR S4 SoC-based VC4 Vehicle Computer Reference Designs

TAIPEI, July 7, 2022 /PRNewswire/ — Macronix International Co., Ltd. (TSE: 2337), a leading integrated device manufacturer in the non-volatile memory (NVM) market, today announced that its MX25UW51245G Serial NOR Flash memory has been selected by Renesas Electronics Corporation for reference designs based on the Vehicle Computer Generation 4 (VC4) chipset. The high-performance MX25UW51245G will provide the VC4 platform, based on Renesas R-Car S4 system on a chip (SoC), with critical memory that enables fast boot-up times in automotive-computing designs.

Fast, reliable flash memory is essential to rapidly booting VC4-based systems, allowing them to adhere to real-time computing requirements. The MX25UW51245G, which can achieve up to 400MB/s read throughput and features low random latency, provides VC4 reference boards the flash storage needed for initial boot of the R-Car S4 SoC.

“Macronix and Renesas continue to enjoy a collaborative relationship, and we’re once again joining forces to bring our respective technologies together and empowering designers with advance automotive-electronics solutions,” said Macronix Vice President of Marketing F.L. Ni. “The VC4 evaluation platform featuring our MX25UW51245G will help unleash the power of the R-Car S4 SoC and VC4 in next-generation automotive systems.”

“The Renesas VC4 evaluation platform streamlines the development of automotive gateway and zone controller systems that can leverage the performance and safety features in both R-Car S4 SoC and MX25UW51245G,” said Takashi Yasumasu, Vice President of Automotive Core Technology Development Division at Renesas.

A core member of Macronix’s highly efficient NOR flash memory line featuring its OctaBus™ interface, the MX25UW51245G features 512Mb density, an Automotive Grade 1 temperature range of -40 ℃ to +125 ℃ and provides functional safety up to Automotive Safety Integrity Level D (ASIL D). The memory’s quality and performance are enhanced substantially by Macronix’s high efficient technology and know how.

The VC4 system is based on a complete Renesas chipset, the centerpiece of which is the R-Car S4 with 8x Cortex®A55 cores which features 8MB of SRAM, advanced cybersecurity and a rich selection of automotive interfaces. The VC4 provides functional safety up to ASIL D, along with the capability for simulating a wide range of connectivity inside the vehicle thereby allowing developers a rich environment for rapid prototyping. It offers an three-port Gigabit Ethernet switch and an integrated RH850 MCU functionality, which drastically reduces the customer’s bill of material.

Macronix and Renesas have a rich history of complementary products and evaluation solutions. Macronix is also a member of Renesas RZ Partner Ecosystem Solutions program and the R-Car Consortium, and a broad range of its flash memory products are represented in several Renesas RZ evaluation boards, including the OctaBus, ArmorFlash™ and e.MMC™ families.

For more information on the Macronix MX25UW51245G, please go to https://www.macronix.com/en-us/products/NOR-Flash/Serial-NOR-Flash/Pages/spec.aspx. For more information on the Renesas Vehicle Computer Generation 4, please go to www.renesas.com/eu/en/application/automotive/gateway-domain-control/vehicle-computer-generation-4#overview.

About Macronix

Macronix, a leading integrated device manufacturer in the non-volatile memory (NVM) market, provides a full range of NOR Flash, NAND Flash, and ROM products. With its world-class R&D and manufacturing capability, Macronix continues to deliver high-quality, innovative and performance-driven products to its customers in the consumer, communication, computing, automotive, networking and other market segments. Find out more at www.macronix.com.

OctaBus, ArmorFlash and e.MMC are trademarks of Macronix International Co., Ltd. All other trademarks are the property of their respective holders.

Editorial contacts

Macronix HQ:
Michelle Chang
Director, Corporate Communication Office
Macronix International Co., LTD.
Tel: +886-3-578-6688 ext. 71233
Fax: +886-3-666-3169
Email: michellechang@mxic.com.tw

US:
Jerry Steach
CommonGround Communications (for Macronix)
Tel: +1-415.222.9996
Email: jsteach-cgc@att.net

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