Tag Archives: ECP

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions

BANGKOK, May 19, 2020 /PRNewswire/ — With the rise of Artificial Intelligence (AI), Machine Learning (ML) and the Internet of Things (IoT), applications are moving to the network edge where data is collected, requiring power-efficient solutions to deliver more computational performance in ever smaller, thermally constrained form factors. Through its Smart Embedded Vision initiative, Microchip Technology Inc. (Nasdaq: MCHP) is meeting the growing need for power-efficient inferencing in edge applications by making it easier for software developers to implement their algorithms in PolarFire® field-programmable gate arrays (FPGAs). As a significant addition to the solutions portfolio in this segment, Microchip’s VectorBlox Accelerator Software Development Kit (SDK) helps developers take advantage of Microchip’s PolarFire FPGAs for creating low-power, flexible overlay-based neural network applications without learning an FPGA tool flow.

Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions
Microchip Reveals Software Development Kit and Neural Network IP for Easily Creating Low-Power FPGA Smart Embedded Vision Solutions

FPGAs are ideal for edge AI applications, such as inferencing in power-constrained compute environments, because they can perform more giga operations per second (GOPS) with greater power efficiency than a central processing unit (CPU) or graphics processing unit (GPU), but they require specialized hardware design skills. Microchip’s VectorBlox Accelerator SDK is designed to enable developers to code in C/C++ and program power-efficient neural networks without prior FPGA design experience.

The highly flexible tool kit can execute models in TensorFlow and the open neural network exchange (ONNX) format which offers the widest framework interoperability. ONNX supports many frameworks such as Caffe2, MXNet, PyTorch, and MATLAB®. Unlike alternative FPGA solutions, Microchip’s VectorBlox Accelerator SDK is supported on Linux® and Windows® operating systems, and it also includes a bit accurate simulator which provides the user the opportunity to validate the accuracy of the hardware while in the software environment. The neural network IP included with the kit also supports the ability to load different network models at run time.

“In order for software developers to benefit from the power efficiencies of FPGAs, we need to remove the impediment of them having to learn new FPGA architectures and proprietary tool flows, while giving them the flexibility to port multi-framework and multi-network solutions,” said Bruce Weyer, vice president of the Field Programmable Gate Array business unit at Microchip. “Microchip’s VectorBlox Accelerator SDK and neural network IP core will give both software and hardware developers a way to implement an extremely flexible overlay convolutional neural network architecture on PolarFire FPGAs, from which they can then more easily construct and implement their AI-enabled edge systems that have best-in-class form factors, thermals and power characteristics.”

For inferencing at the edge, PolarFire FPGAs deliver up to 50 percent lower total power than competing devices, while also offering 25 percent higher-capacity math blocks that can deliver up to 1.5 tera operations per second (TOPS). By using FPGAs, developers also have greater opportunities for customization and differentiation through the devices’ inherent upgradability and ability to integrate functions on a single chip. The PolarFire FPGA neural network IP is available in a range of sizes to match the performance, power, and package size tradeoffs for the application, enabling customers to implement their solutions in package sizes as small as 11 x 11 mm.

Microchip’s Smart Embedded Vision initiative was launched last July to provide hardware and software developers with tools, intellectual property (IP) cores, and boards for meeting the thermally constrained and small-form-factor requirements of edge applications. Because PolarFire FPGAs deliver lower power compared to other solutions, customers can eliminate the need for fans in their enclosures. PolarFire FPGAs also offer more functional integration for a customer’s design. For example, in applications such as a smart camera, PolarFire FPGAs can integrate the image signal pipeline which includes the sensor interface, DDR controller, image signal processing (ISP) IP and network interfaces, all while integrating the machine learning inference.

Availability

Microchip’s VectorBlox Accelerator SDK is scheduled to be available in the third quarter of 2020, starting with an Early Access Program in June. PolarFire FPGAs are in production today. For more information, visit the Smart Embedded Vision web page or contact sales.support@microsemi.com.

Resources

 High-res images available through Flickr or editorial contact (feel free to publish):

About Microchip Technology

Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

Note: The Microchip name and logo, the Microchip logo and PolarFire are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are the property of their respective companies.

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L-com Now Stocks Waterproof USB 3.0 Cable Assemblies for Harsh Environment Applications

IRVINE, Calif., May 15, 2020 /PRNewswire/ — L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, announced today that it has introduced a new series of IP67- rated waterproof USB 3.0 cable assemblies for use in test and measurement, data transfer and harsh environment computing applications.

U3A00026-1M
U3A00026-1M

L-com’s new waterproof USB cable assemblies are USB 3.0 compliant and feature a waterproof, panel/enclosure mount connector on one end of the assembly. These rugged cables boast threaded couplings and O-ring seals that ensure IP67-rated protection from water and dust. Rugged, molded backshells deliver durability and 30-micro-inch gold-contact plating provides a reliable connection even with repeated mating cycles. Off-the-shelf configurations include waterproof USB-A-male to standard USB-B-male, waterproof USB-A-female to standard USB-A-male and waterproof USB-B-female to standard USB-A-male options.

Additionally, shielded versions are offered that employ a metal coupling nut that provides a 360-degree shield when mated with a metal, female L-com U3A cable assembly. Shielded, waterproof USB cable options include shielded waterproof USB-A-male to standard US-B-male and shielded waterproof USB-A-male to standard USB-A-male assemblies.

“The addition of these new IP67-rated USB 3.0 cables adds to our extensive line of waterproof USB interconnects and provides our customers with even more options when dealing with USB connectivity in unforgiving environments. Furthermore, since the new assemblies are USB 3.0 complaint, they are able to handle up to 4.8 Gbps data rates to address today’s high-speed computing applications,” said Dustin Guttadauro, Product Line Manager.

L-com’s new waterproof USB 3.0 cable assemblies are all in-stock and available for immediate shipment.

About L-com:

L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. L-com is headquartered in North Andover, Mass., is ISO 9001: 2015 certified and many of its products are UL® recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:

Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMe Cables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.

Press Contact:

Peter McNeil
L-com
17792 Fitch
Irvine, CA
978-682-6936 

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Supermicro Expands Portfolio with Fully Integrated NVIDIA A100 GPU-Powered Systems Delivering 5 PetaFLOPS of AI Performance in a Single 4U Server

SAN JOSE, California, May 14, 2020 /PRNewswire/ — Super Micro Computer, Inc. (Nasdaq: SMCI), a global leader in enterprise computing, storage, networking solutions and green computing technology, today announced two new systems designed for artificial intelligence (AI) deep learning applications that fully leverage the third-generation NVIDIA HGX™ technology with the new NVIDIA A100™ Tensor Core GPUs as well as full support for the new NVIDIA A100 GPUs across the company’s broad portfolio of 1U, 2U, 4U and 10U GPU servers. NVIDIA A100 is the first elastic, multi-instance GPU that unifies training, inference, HPC, and analytics.

“Expanding upon our industry-leading portfolio of GPU systems and NVIDIA HGX-2 system technology, Supermicro is introducing a new 2U system implementing the new NVIDIA HGX™ A100 4 GPU board (formerly codenamed Redstone) and a new 4U system based on the new NVIDIA HGX A100 8 GPU board (formerly codenamed Delta) delivering 5 PetaFLOPS of AI performance,” said Charles Liang, CEO and president of Supermicro. “As GPU accelerated computing evolves and continues to transform data centers, Supermicro will provide customers the very latest system advancements to help them achieve maximum acceleration at every scale while optimizing GPU utilization. These new systems will significantly boost performance on all accelerated workloads for HPC, data analytics, deep learning training and deep learning inference.”

As a balanced data center platform for HPC and AI applications, Supermicro’s new 2U system leverages the NVIDIA HGX A100 4 GPU board with four direct-attached NVIDIA A100 Tensor Core GPUs using PCI-E 4.0 for maximum performance and NVIDIA NVLink™ for high-speed GPU-to-GPU interconnects. This advanced GPU system accelerates compute, networking and storage performance with support for one PCI-E 4.0 x8 and up to four PCI-E 4.0 x16 expansion slots for GPUDirect RDMA high-speed network cards and storage such as InfiniBand™ HDR™, which supports up to 200Gb per second bandwidth.

“AI models are exploding in complexity as they take on next-level challenges such as accurate conversational AI, deep recommender systems and personalized medicine,” said Ian Buck, general manager and VP of accelerated computing at NVIDIA. “By implementing the NVIDIA HGX A100 platform into their new servers, Supermicro provides customers the powerful performance and massive scalability that enable researchers to train the most complex AI networks at unprecedented speed.”

Optimized for AI and machine learning, Supermicro’s new 4U system supports eight A100 Tensor Core GPUs. The 4U form factor with eight GPUs is ideal for customers that want to scale their deployment as their processing requirements expand. The new 4U system will have one NVIDIA HGX A100 8 GPU board with eight A100 GPUs all-to-all connected with NVIDIA NVSwitch™ for up to 600GB per second GPU-to-GPU bandwidth and eight expansion slots for GPUDirect RDMA high-speed network cards. Ideal for deep learning training, data centers can use this scale-up platform to create next-gen AI and maximize data scientists’ productivity with support for ten x16 expansion slots.

Customers can expect a significant performance boost across Supermicro’s extensive portfolio of 1U, 2U, 4U and 10U multi-GPU servers when they are equipped with the new NVIDIA A100 GPUs.  For maximum acceleration, Supermicro’s new A+ GPU system supports up to eight full-height double-wide (or single-wide) GPUs via direct-attach PCI-E 4.0 x16 CPU-to-GPU lanes without any PCI-E switch for the lowest latency and highest bandwidth. The system also supports up to three additional high-performance PCI-E 4.0 expansion slots for a variety of uses, including high-performance networking connectivity up to 100G. An additional AIOM slot supports a Supermicro AIOM card or an OCP 3.0 mezzanine card.

As the leader in AI system technology, Supermicro offers multi-GPU optimized thermal designs that provide the highest performance and reliability for AI, Deep Learning, and HPC applications. With 1U, 2U, 4U, and 10U rackmount GPU systems; Utra, BigTwin™, and embedded systems supporting GPUs; as well as GPU blade modules for our 8U SuperBlade® , Supermicro offers the industry’s widest and deepest selection of GPU systems to power applications from Edge to Cloud.

To deliver enhanced security and unprecedented performance at the edge, Supermicro plans to add the new NVIDIA EGX™ A100 configuration to its edge server portfolio. The EGX A100 converged accelerator combines an NVIDIA Mellanox SmartNIC with GPUs powered by the new NVIDIA Ampere architecture, so enterprises can run AI at the edge more securely.

For more on Supermicro’s new GPU systems, please visit www.supermicro.com/A100.

Follow Supermicro on LinkedIn, Twitter, and Facebook to receive their latest news and announcements.

About Super Micro Computer, Inc.
Supermicro (Nasdaq: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced Server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its “We Keep IT Green®” initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, Server Building Block Solutions, BigTwin, SuperBlade, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners.

SMCI-F

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Source: Super Micro Computer, Inc.

Atos delivers its Quantum Learning Machine to Japan

PARIS, May 13, 2020 /PRNewswire/ — Atos, a global leader in digital transformation, today announced that it has sold its Atos Quantum Learning Machine (QLM), the world’s highest-performing commercially available quantum simulator, through its APAC distributor Intelligent Wave Inc. (IWI), in Japan. This is the first QLM that Atos has sold in Japan.

Atos delivers its Quantum Learning Machine to Japan
Atos delivers its Quantum Learning Machine to Japan

Quantum computing is a key priority for Japan. It launched a dedicated ten-year, 30 billion yen (US$280 million) quantum research program in 2017, followed by a 100 billion yen (US$900 million) investment into its Moonshot R&D Program – one focus of which will be to create a fault-tolerant universal quantum computer to revolutionize the economy, industry, and security sectors by 2050.

Combining a high-powered, ultra-compact machine with a universal programming language, the Atos Quantum Learning Machine enables researchers and engineers to develop an experiment with quantum software. It is the world’s only quantum software development and simulation appliance for the coming quantum computer era. It simulates the laws of physics, which are at the very heart of quantum computing, to compute the exact execution of a quantum program with double-digit precision.

“We’re delighted to have sold our first QLM in Japan, thanks to our strong working partnership with Intelligent Wave Inc.. We are proud to be part of this growing momentum as the country plans to boost innovation through quantum. Japan understands that quantum research requires a long-term vision and nurtures innovation at every level to build its future success in the field, said Nourdine Bihmane, Head of Growing Markets and Head of B&PS Public & Regional at Atos. The Atos Quantum Learning Machine enables businesses to develop and experiment with quantum processes and delivers superior simulation capabilities to speed innovation.”

The introduction of the Atos QLM enables companies to prepare algorithms tailored to their own use cases and adapt them to current and future quantum technologies. It also supports research and educational institutions in training human resources to quantum programming and to promote advanced research on these topics.

The Atos QLM simulates the behavior of a quantum computer, meaning that quantum algorithms can be developed without the need for quantum hardware. As the Atos QLM is hardware-agnostic, quantum algorithms developed on it can be executed on any quantum computer from any manufacturer.

Atos QLM users continue to grow. Launched in 2017, the QLM is being used in numerous countries worldwide including Austria, Finland, FranceGermany, India,  Italy, the Netherlands, Senegal, UK and the United States, empowering major research programs in various sectors. Atos’ ambitious program to anticipate the future of quantum computing – the ‘Atos Quantum program – was launched in November 2016. As a result of this initiative, Atos was the first organization to offer a quantum noisy simulation module within the Atos QLM.

More information about Atos Quantum Learning Machine: https://atos.net/en/solutions/quantum-learning-machine

About Atos

Atos is a global leader in digital transformation with 110,000 employees in 73 countries and annual revenue of 12 billion euro. European number one in Cloud, Cybersecurity and High-Performance Computing, the Group provides end-to-end Orchestrated Hybrid Cloud, Big Data, Business Applications and Digital Workplace solutions. The Group is the Worldwide Information Technology Partner for the Olympic & Paralympic Games and operates under the brands Atos, Atos|Syntel, and Unify. Atos is a SE (Societas Europaea), listed on the CAC40 Paris stock index.

The purpose of Atos is to help design the future of the information space. Its expertise and services support the development of knowledge, education and research in a multicultural approach and contribute to the development of scientific and technological excellence. Across the world, the Group enables its customers and employees, and members of societies at large to live, work and develop sustainably, in a safe and secure information space.

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Press contact:

Marion Delmasmarion.delmas@atos.net | +33 6 37 63 91 99

L-com Launches Ruggedized USB 3.0 Cable Assemblies with Die-Cast Shells and Thumbscrews

IRVINE, California, May 8, 2020 /PRNewswire/ — L-com, an Infinite Electronics brand and a preferred manufacturer of wired and wireless connectivity products, announced today that it has launched a new series of ruggedized USB 3.0 cables that feature die-cast metal back shells and optional thumbscrews that are commonly used in machine vision applications. 

L-com’s new CAU3DCVIS-series cables were developed to address demanding connectivity applications including industrial and factory automation, process engineering, machine vision, data acquisition and PLC communications.

These unique and hard to find cables feature specialized die-cast back shells with optional thumbscrews for securing the connectors to ensure connectivity is not disrupted in the event of pull or impact. The cables are available off-the-shelf with the following connector combinations: Type-A male to Micro-B male, Type-A male to Type-C male and Type-A male to Type-B male. Other features include black PVC cable jackets, double shielding and 22AWG power conductors which provide maximum USB power transfer.

“Our new ruggedized USB 3.0 cables are perfect for use in industrial settings where high vibration, impacts and other harsh conditions prevail. These unique cables can be mated to any standard USB 3.0 Type-A jack and allow for the use of thumbscrews for applications requiring extra secure connections,” said Dustin Guttadauro, Product Line Manager.

L-com’s new ruggedized USB 3.0 cable assemblies with die-cast back shells are in-stock and available for immediate shipment.

About L-com:

L-com, a leading manufacturer of wired and wireless connectivity products, offers a wide range of solutions and unrivaled customer service for the electronics and data communications industries. The company’s product portfolio includes cable assemblies, connectors, adapters, antennas, enclosures, surge protectors and more. L-com is headquartered in North Andover, Mass., is ISO 9001: 2015 certified and many of its products are UL® recognized. L-com is an Infinite Electronics brand.

About Infinite Electronics:

Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMe Cables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.

Press Contact:

Peter McNeil
L-com
17792 Fitch
Irvine, CA
978-682-6936

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Huntkey Adds the SCA109C to Its Wireless Charger Family

SHENZHEN, China, May 8, 2020 /PRNewswire/ — Huntkey, a leading global provider of power solutions, increases its selection of wireless chargers with the SCA109C, a wireless charger complemented with one USB-C (also known as USB Type-C) port and two USB-A ports.

The Huntkey USB-C Wireless Charger:
https://en.huntkey.com/product/sca109c/

The SCA109C’s wireless charger provides a maximum 10W power output for Qi-certified devices such as Samsung and iPhone smart phones. The USB-C port delivers 5V3A, 9V2A or 12V1.5A power intelligently to fit different devices. The two USB-A ports share a combined 5V2.1A power output.

It is paired with a durable AC cable that is equipped with a two-pin US plug, which is targeted at the North America market. To ensure safety, it is FCC listed and built with multiple protections including OVP (Over Voltage Protection), OCP (Over Current Protection), OTP (Over Temperature Protection) and SCP (Short Circuit Protection). Not only will it protect itself, but also keep the charging devices safe under any circumstances. For more information, please visit: https://en.huntkey.com/

About Huntkey

Huntkey Enterprise Group, founded in 1995 and headquartered in Shenzhen, is a member of The International Power Supply Manufacturer’s Association (PSMA) and a member of The China Power Supply Society (CPSS). With branch companies in the USA, Japan and other areas, and cooperating factories in Brazil, Argentina, India and other countries, Huntkey has specialized in the development, design, and manufacturing of PC power supplies, industrial power supplies, surge protectors, adapters and chargers for many years. With its own technologies and manufacturing strength, Huntkey has served Lenovo, Haier, DELL, Bestbuy and many other large enterprises for years, and has received unanimous recognition and trust from most of the customers.

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Sungrow Rolls Out the Latest Three-phase Inverter SG25CX-SA for Brazilian 220V Market

SAO PAULO, May 8, 2020 /PRNewswire/ — Sungrow, the global leading inverter solution supplier for renewables, launched the Company’s three-phase 1000Vdc commercial inverter SG25CX-SA for Brazilian 220V grid system, showcasing its commitment to the flexibility and reliability of regional grid voltage requirement in commercial and industrial (C&I) applications.

Sungrow three-phase inverter SG25CX-SA
Sungrow three-phase inverter SG25CX-SA

Sungrow’s three-phase inverter SG25CX-SA with unparalleled performance is ideal for Brazilian 220V grid condition which accounts for 55% of diversified local grid voltage modes. Equipped with multiple MPPTs, the 25kW inverter is accessible to be installed in diverse commercial PV plants and guarantees optimal power generation even in the shade. It can be compatible with bifacial modules, offering higher yields and lower LCOE as well.

Particularly with an ingress protection level of IP66 and an anti-corrosion grade of C5, it’s able to accomplish the feat with stunning efficiency with improved resilience. Designed with smart forced air-cooling technology, the inverter can operate without derating at scorching weather conditions. With Built-in PID (potential induced degradation) recovery function, the SG25CX-SA can significantly reduce power loss.

It enables remote firmware update, touch free commission and can co-work with Sungrow’s intelligent monitoring system iSolarCloud, which offers a graphical readout of timely plant production, as well as the status of the PV array and inverter via portable smart devices.

“We are enthused to bring forth another standout innovation SG25CX-SA, a typical three-phase inverter for 220V grid for Brazil, maximizing ROI for our customers at unforeseen levels,” said Rafael Ribeiro, Country Manager of Sungrow Brazil. “Along with the rapid development of the comprehensive technical support, sales, after-sale service, we’re confident to navigate more in this vibrant emerging market,” he added.

Since entering Brazil in late 2010s, Sungrow has been making big moves with inverters supplied across the country, including an 80MW project in Brazil and hundreds of distributed generations in partnership with local distributors. Sungrow took the first place in market share across Brazil in 2019, according to IHS Markit.

About Sungrow

Sungrow Power Supply Co., Ltd (“Sungrow”) is the world’s most bankable inverter brand with over 100 GW to be installed worldwide as of December 2019. Founded in 1997 by University Professor Cao Renxian, Sungrow is a leader in the research and development of solar inverters, with the largest dedicated R&D team in the industry and a broad product portfolio offering PV inverter solutions and energy storage systems for utility-scale, commercial, and residential applications, as well as internationally recognized floating PV plant solutions. With a strong 23-year track record in the PV space, Sungrow products power installations in over 60 countries, maintaining a worldwide market share of over 15%. Learn more about Sungrow by visiting www.sungrowpower.com.

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ChipMOS REPORTS APRIL 2020 REVENUE; NEW RECORD HIGH FOR APRIL

HSINCHU, May 6, 2020 /PRNewswire/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today reported its unaudited consolidated revenue for the month of April 2020.  All U.S. dollar figures cited in this press release are based on the exchange rate of NT$29.72 to US$1.00 as of April 30, 2020.

Revenue for the month of April 2020 was NT$1,854.3 million or US$62.4 million, which is a new record high revenue level for the month of April.  This represents an increase of 18.9% as compared to April 2019 and a decrease of 5.7% from March 2020.  The Company noted that it benefitted from stable memory demand, including DRAM and NOR flash.  These improvements were partially offset by softness in DDIC and gold bumping due to macro weakness in TV and smart phone demand, combined with one less calendar day of operations in the month of April compared to March.

Consolidated Monthly Revenues (Unaudited)

April 2020

March 2020

April 2019

MoM Change

YoY Change

Revenues

(NT$ million)

1,854.3

1,966.8

1,559.5

-5.7%

18.9%

Revenues

(US$ million)

62.4

66.2

52.5

-5.7%

18.9%

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and NASDAQ: IMOS) (https://www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries. 

Forward-Looking Statements

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategy, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors.  Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange commission (the “SEC”) and in the Company’s other filings with the SEC.

Contacts:

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Source: ChipMOS TECHNOLOGIES INC.

Power and Compound Fab Spending to Rebound in Second Half of 2020, Set New Record in 2021, SEMI Reports

MILPITAS, California, May 5, 2020 /PRNewswire/ — Global fab equipment spending for power and compound devices is expected to rebound in the second half of 2020 to meet resurgent end-product demand and jump 59 percent to a segment record US$6.9 billion in 2021, SEMI reported today in its Power & Compound Fab Report to 2024. The 2020 rally will help blunt a drop in annual spending, now projected at 8 percent, as fabs ride the COVID-19 recovery wave.

Power and compound devices are used to control electrical energy for devices across an array of industries such as computing, communications, energy and automotive. Since the widespread enactment of stay-at-home orders to curb the spread of COVID-19, demand for servers, laptops and other electronics at the heart of online communications has surged.

The SEMI Power & Compound Fab Report to 2024 lists more than 800 power- and compound-related facilities and lines and covers investments and capacities for the 12 years from 2013 through 2024. In 2019, the report tracked 804 facilities and lines with installed capacity of 8 million wafers per month (in 200mm equivalent wafers). By 2024, 38 new facilities and lines will begin operation, fueling installed capacity growth of a cumulative 20 percent to 9.7 million wafers per month. 

In breakdowns by region, mainland China will expand power and compound fab capacity by 50 percent and 87 percent, respectively, from 2019-2024, more than any other region. Over the same period, Europe/Mideast and Taiwan will lead the way in adding power fab capacity, while the Americas and Europe/Mideast will be among those regions adding compound fab capacity.

For more information about The SEMI Power & Compound Fab Report to 2024 or to download sample data from the report, please click here.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

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Global Silicon Wafer Area Shipments Edge Up in First Quarter 2020 Despite COVID-19 Headwinds

MILPITAS, Calif., May 4, 2020 /PRNewswire/ — Worldwide silicon wafer area shipments rose 2.7 percent to 2,920 million square inches in the first quarter of 2020, compared with fourth-quarter 2019 shipments of 2,844 million square inches, but dropped 4.3 percent year-over-year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

“Global silicon wafer shipments rebounded slightly in the first quarter of 2020 after declining for one year,” said Neil Weaver, chairman SEMI SMG and vice president, Product Development and Applications Engineering at Shin Etsu Handotai America. “However, with the disruptions caused by the coronavirus, market uncertainty will prevail in the upcoming quarters.”

Silicon Area Shipment Trends – Semiconductor Applications Only

Millions of Square Inches

4Q 2018

1Q 2019

2Q 2019

3Q 2019

4Q 2019

1Q 2020

Total

3,234

3,051

2,983

2,932

2,844

2,920

Source: SEMI (www.semi.org), April 2020

All data cited in this release includes polished silicon wafers such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

A sub-committee of the SEMI Electronic Materials Group (EMG), the SMG is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,260 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org

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